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AR1630CSSC34SMD10

Onsemi

AR1630CSSC34SMD10 by Onsemi

Onsemi's AR1630CSSC34SMD10 is a 1/3.2 inch CMOS image sensor with 4632x3492 pixels, offering digital output at 30 fps. Ideal for applications requiring high-resolution imaging in a compact form factor, such as surveillance cameras and industrial machine vision systems.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

AR1630CSSC34SMD10 by Onsemi
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Vyrian

USA . 4,163 parts In-Stock

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Digiode

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AZTECH Wire

Italy . 1,042 parts In-Stock

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Problanco Electronics

Mexico . 7,441 parts In-Stock

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SupplyDigital Components

Austria . 7,027 parts In-Stock

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TANS Electronics

Latvia . 4,239 parts In-Stock

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Corphita

USA . 403 parts In-Stock

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Northwest PG Solutions

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Kulean Microsystems

USA . 234 parts In-Stock

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UHIMA Technologies

Türkiye . 182 parts In-Stock

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Corohmni

South Africa . 116 parts In-Stock

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Native Components

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Overview

Capture every moment with the AR1630CSSC34SMD10 by Onsemi, a leading manufacturer in image sensors. This cutting-edge product offers unparalleled quality and performance, perfect for applications such as security cameras, automotive systems, and medical imaging devices. With its high-resolution capabilities and advanced features, this image sensor delivers crystal-clear images and accurate data, providing customers with exceptional value and endless possibilities. Elevate your projects with the AR1630CSSC34SMD10 and experience the difference that superior technology can make.

Feature Benefit Bullets

Sensors or Transducers Type: IMAGE SENSOR,CMOS

CMOS sensors are known for their low power consumption and high image quality, making this product a good choice for applications requiring efficiency and sharp images.

Horizontal Pixel: 4632

High resolution provided by 4632 horizontal pixels ensures detailed and clear images, making this sensor suitable for high-quality imaging.

Output Type: DIGITAL OUTPUT

Digital output allows for easy integration with digital systems, providing quick and convenient data transfer for efficient processing.

Vertical Pixel: 3492

The vertical resolution of 3492 pixels complements the high horizontal resolution, ensuring complete and precise image capture.

Optical Format (inch): 1/3.2

The 1/3.2 inch optical format offers a good balance between size and image quality, making this sensor ideal for compact yet high-performance devices.

Termination Type: SOLDER

Solder termination provides secure and reliable connections, ensuring the sensor's longevity and durability in various operating conditions.

Output Interface Type: 2-WIRE INTERFACE

2-wire interface simplifies connectivity and communication with other devices, facilitating easy integration and enhancing overall system efficiency.

Frame Rate: 30 fps

A frame rate of 30 fps ensures smooth and real-time image capture, making this sensor suitable for applications requiring fast and continuous imaging.

Array Type: FRAME

Frame array design enhances image quality and processing speed, providing accurate and reliable imaging results for various applications.

Mounting Feature: SURFACE MOUNT

Surface mount option allows for easy and secure installation in compact spaces, making this sensor a versatile choice for space-constrained applications.

Technical Specifications

Image Sensors AR1630CSSC34SMD10 attributes and parameters. Explore more Image Sensors devices from Onsemi

Specs

Array Type:

FRAME

Frame Rate:

30 fps

Horizontal Pixel:

4632

Mounting Feature:

Optical Format (inch):

1/3.2

Output Interface Type:

2-WIRE INTERFACE

Output Type:

Sensors or Transducers Type:

Termination Type:

SOLDER

Vertical Pixel:

3492

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

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