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KAI-47051-FXA-JD-B2

Onsemi

KAI-47051-FXA-JD-B2 by Onsemi

The Onsemi KAI-47051-FXA-JD-B2 is an image sensor with 5.5x5.5 um pixel size, 40 MHz master clock, and 66 dB dynamic range. Ideal for applications requiring high-resolution imaging in a compact form factor, such as industrial machine vision systems or medical imaging devices.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 7,461 parts In-Stock

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Digiode

USA . 1,133 parts In-Stock

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AZTECH Wire

Italy . 813 parts In-Stock

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$8.570

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TANS Electronics

Latvia . 7,641 parts In-Stock

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Problanco Electronics

Mexico . 5,376 parts In-Stock

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Kulean Microsystems

USA . 2,932 parts In-Stock

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SupplyDigital Components

Austria . 1,253 parts In-Stock

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Corphita

USA . 986 parts In-Stock

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Authorized Procurement Solutions

USA . 500 parts In-Stock

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Corohmni

South Africa . 316 parts In-Stock

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UHIMA Technologies

Türkiye . 279 parts In-Stock

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Overview

Enhance your imaging solutions with the KAI-47051-FXA-JD-B2 by Onsemi. As a leading manufacturer in the image sensor industry, Onsemi delivers top-quality products that guarantee superior performance and reliability. This image sensor boasts a pixel size of 5.5X5.5 um, providing crisp and detailed images for a wide range of applications. With a maximum supply voltage of 15.5 V and a dynamic range of 66 dB, this sensor offers unmatched value to customers seeking high-quality imaging solutions. Upgrade your imaging system today with the KAI-47051-FXA-JD-B2 and experience the benefits it brings to your projects.

Feature Benefit Bullets

Pixel Size (um): 5.5X5.5

The small pixel size allows for high resolution image capture and detail.

Maximum Supply Voltage: 15.5 V

Higher supply voltage ensures optimal performance and reliability.

Master Clock: 40 MHz

Fast master clock speed enables quick processing and data transfer.

Body Width: 44.55 inch

Compact body width for easy integration into different systems.

Sensors or Transducers Type: IMAGE SENSOR, CCD

CCD sensors offer high-quality image capture and low noise levels.

Body Height: 3.25 mm

Low profile design for space efficiency and versatility in installation.

Package Shape or Style: RECTANGULAR

Rectangular shape for easy handling and mounting in various applications.

Minimum Supply Voltage: 14.5 V

Lower minimum supply voltage helps in energy efficiency and power optimization.

Maximum Operating Temperature: 70 °C

Wide operating temperature range for diverse environmental conditions.

Horizontal Pixel: 8856

High horizontal pixel count for detailed and sharp image reproduction.

Minimum Operating Temperature: -50 °C

Operational at low temperatures for use in extreme environments.

Dynamic Range: 66 dB

Wide dynamic range for capturing a broad range of light intensity levels.

Vertical Pixel: 5280

Large vertical pixel count for capturing high-resolution images with clarity.

Body Length/Diameter: 69.96 mm

Optimal body length for fitting into different setups and configurations.

Termination Type: SOLDER

Solder termination for secure and reliable connections in the system.

Frame Rate: 7 fps

Decent frame rate for smooth and real-time image capturing and video recording.

Array Type: INTERLINE

Interline array type for efficient light collection and image processing.

Mounting Feature: THROUGH HOLE MOUNT

Through hole mounting feature for secure and stable installation in various setups.

Technical Specifications

Image Sensors KAI-47051-FXA-JD-B2 attributes and parameters. Explore more Image Sensors devices from Onsemi

Specs

Additional Features:

IT HAS A SENSITIVITY OF 38 MICRO VOLT PER ELECTRON, ELECTRONIC SHUTTER

Array Type:

INTERLINE

Body Width:

44.55 inch

Body Height:

3.25 mm

Body Length/Diameter:

69.96 mm

Dynamic Range:

66 dB

Frame Rate:

7 fps

Horizontal Pixel:

8856

Master Clock:

40 MHz

Mounting Feature:

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-50 Cel

Package Shape or Style:

Pixel Size (um):

5.5X5.5

Sensors or Transducers Type:

Maximum Supply Voltage:

15.5 V

Minimum Supply Voltage:

14.5 V

Termination Type:

SOLDER

Vertical Pixel:

5280

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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