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MT9V124EBKSTC-CP

Onsemi

MT9V124EBKSTC-CP by Onsemi

MT9V124EBKSTC-CP by Onsemi is a 1.75um CMOS image sensor with 648x488 pixels, offering a dynamic range of 58dB. Operating at -30 to 70 °C, it has a digital voltage output interface and consumes up to 9.5mA current. Ideal for frame applications requiring a square package shape and surface mounting feature.

Median Price

$6.930

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

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Flip Electronics (Authorized)

USA . 42,239 parts In-Stock

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Farnell

UK . 4,000 parts In-Stock

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$6.870

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Rochester

USA . 3,980 parts In-Stock

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$6.930

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$6.200

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$5.830

3,980

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$6.200

$5.830

Verical

USA . 3,980 parts In-Stock

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$8.662

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$7.750

10k+ parts

$7.287

3,980

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$8.662

$7.750

$7.287

Distributors (In-Stock)

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Digiode

USA . 1,063 parts In-Stock

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$7.315

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Flip Electronics

USA . 42,059 parts In-Stock

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Vyrian

USA . 5,157 parts In-Stock

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Distributors (Availability)

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Corohmni

South Africa . 103 parts In-Stock

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$6.870

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103

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Corphita

USA . 2,340 parts In-Stock

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$6.930

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2,340

$6.930

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AZTECH Wire

Italy . 328 parts In-Stock

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$15.920

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328

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SupplyDigital Components

Austria . 7,270 parts In-Stock

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Problanco Electronics

Mexico . 6,012 parts In-Stock

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Continental Prestige Electronics

USA . 4,000 parts In-Stock

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TANS Electronics

Latvia . 3,271 parts In-Stock

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Kulean Microsystems

USA . 979 parts In-Stock

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UHIMA Technologies

Türkiye . 184 parts In-Stock

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Overview

Experience unparalleled image quality and reliability with the MT9V124EBKSTC-CP Image Sensor by Onsemi. As a leading manufacturer in the industry, Onsemi offers top-notch products that are trusted by professionals worldwide. Ideal for a wide range of applications, this sensor provides crisp and clear images with its advanced technology. With its compact size and high performance, the MT9V124EBKSTC-CP is the perfect solution for your imaging needs. Trust Onsemi to deliver exceptional quality and value with every product.

Feature Benefit Bullets

Pixel Size (um): 1.75

Smaller pixel size allows for higher resolution images with more detail.

Maximum Supply Voltage: 1.95 V

Allows for reliable and stable operation within the specified voltage range.

Body Width: 2.69 inch

Compact size makes it easy to integrate into various devices or systems.

Sensors or Transducers Type: IMAGE SENSOR,CMOS

CMOS sensors are known for low power consumption and high-quality image output.

Output Range: 0.85-1.65V

Consistent output voltage range ensures compatibility with other components.

Maximum Operating Temperature: 70 °C

Can operate in a wide range of temperatures, making it suitable for different environments.

Frame Rate: 30 fps

High frame rate for capturing fast-moving objects or scenes with smooth motion.

Array Type: FRAME

Frame array type allows for capturing full frames at a time, enabling quicker image processing.

Technical Specifications

Image Sensors MT9V124EBKSTC-CP attributes and parameters. Explore more Image Sensors devices from Onsemi

Specs

Array Type:

FRAME

Body Width:

2.69 inch

Body Height:

.73 mm

Body Length/Diameter:

2.69 mm

Dynamic Range:

58 dB

Frame Rate:

30 fps

Horizontal Pixel:

648

JESD-609 Code:

e1

Mounting Feature:

Maximum Operating Current:

9.5 mA

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-30 Cel

Optical Format (inch):

1/13

Output Interface Type:

2-WIRE INTERFACE

Output Range:

Output Type:

Package Shape or Style:

Pixel Size (um):

1.75

Sensors or Transducers Type:

Maximum Supply Voltage:

1.95 V

Minimum Supply Voltage:

1.7 V

Terminal Finish:

Tin/Silver/Copper (Sn/Ag/Cu)

Termination Type:

SOLDER

Vertical Pixel:

488

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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