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MT9P031I12STM-DP1

Onsemi

MT9P031I12STM-DP1 by Onsemi

MT9P031I12STM-DP1 by Onsemi is a 2.2x2.2 um CMOS image sensor with 2592x1944 pixels, 96 MHz master clock, and 70.1 dB dynamic range. Ideal for applications requiring high-resolution imaging at frame rates up to 14 fps in a compact square package suitable for surface mounting.

Median Price

$30.550

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 58 parts In-Stock

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$30.550

100+ parts

$29.940

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$29.330

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58

$30.550

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$29.330

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Distributors (In-Stock)

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Nova Conductors

Japan . 38 parts In-Stock

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$23.293

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$23.293

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Digiode

USA . 2,499 parts In-Stock

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$29.022

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2,499

$29.022

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Vyrian

USA . 6,832 parts In-Stock

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Flip Electronics

USA . 4,080 parts In-Stock

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ComSIT Distribution GmbH

Germany . 2,160 parts In-Stock

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Chip Stock

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Distributors (Availability)

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Aztec Data Supply Inc.

USA . 239 parts In-Stock

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$2.800

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239

$2.800

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Modulus Dynamics

Lithuania . 1,375 parts In-Stock

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$3.034

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$3.034

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$3.034

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1,375

$3.034

$3.034

$3.034

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Advanced Electronics

New Zealand . 500 parts In-Stock

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$3.274

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$3.111

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$3.111

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500

$3.274

$3.111

$3.111

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AZTECH Wire

Italy . 874 parts In-Stock

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$18.565

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Corohmni

South Africa . 403 parts In-Stock

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$22.371

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403

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Continental Prestige Electronics

USA . 6,481 parts In-Stock

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$22.610

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$22.158

6,481

$22.610

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$22.158

Ampacity Inc.

Singapore . 58 parts In-Stock

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$25.970

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$25.970

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Semicontronic

India . 58 parts In-Stock

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$25.970

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$25.321

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$25.191

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58

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Corphita

USA . 866 parts In-Stock

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$27.495

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Lixinc

USA . 15,883 parts In-Stock

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Authorized Procurement Solutions

USA . 7,000 parts In-Stock

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Problanco Electronics

Mexico . 6,454 parts In-Stock

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Argo Parts USA

USA . 3,143 parts In-Stock

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SupplyDigital Components

Austria . 2,891 parts In-Stock

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Kulean Microsystems

USA . 1,541 parts In-Stock

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Netroflash

USA . 1,000 parts In-Stock

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$22.827

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$22.128

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$21.662

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Perfect Parts

USA . 806 parts In-Stock

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UHIMA Technologies

Türkiye . 732 parts In-Stock

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GreenTree Electronics

Israel . 560 parts In-Stock

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TANS Electronics

Latvia . 282 parts In-Stock

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Eastek

USA . 240 parts In-Stock

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$29.260

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240

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$29.260

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Overview

Capture the world in stunning detail with the MT9P031I12STM-DP1 Image Sensor by Onsemi. Known for their superior quality and reliability, Onsemi delivers cutting-edge technology that exceeds expectations. This image sensor boasts a pixel size of 2.2X2.2 um, providing crystal-clear images with a dynamic range of 70.1 dB. Ideal for a wide range of applications, from security cameras to industrial imaging, this sensor offers unparalleled value and performance. Elevate your projects with the MT9P031I12STM-DP1 and experience the difference today.

Feature Benefit Bullets

Pixel Size (um) 2.2X2.2

Smaller pixel size allows for higher resolution images to be captured with better detail.

Maximum Supply Voltage 1.9 V

Allows for efficient power usage and helps in reducing power consumption.

Master Clock 96 MHz

High master clock frequency ensures fast and efficient image processing.

Body Width 10 inch

Compact body width makes it easy to integrate into various devices.

Sensors or Transducers Type IMAGE SENSOR,CMOS

CMOS sensors provide high image quality and low power consumption.

Package Shape or Style SQUARE

Square package shape allows for easy and secure mounting.

Minimum Supply Voltage 1.7 V

Low minimum supply voltage ensures compatibility with a wide range of devices.

Maximum Operating Temperature 70 °C

Wide operating temperature range makes it suitable for various environmental conditions.

Horizontal Pixel 2592

High horizontal pixel count ensures high-resolution images.

Output Range 0.35-2.30V

Wide output range provides flexibility in signal processing.

Output Type DIGITAL VOLTAGE

Digital output simplifies data transfer and processing.

Minimum Operating Temperature -30 °C

Low minimum operating temperature ensures functionality in cold environments.

Maximum Operating Current 35 mA

Low operating current helps in reducing power consumption.

Dynamic Range 70.1 dB

High dynamic range allows for capturing images with a wide range of brightness levels.

Vertical Pixel 1944

High vertical pixel count contributes to high-resolution images.

Body Length/Diameter 10 mm

Compact body length/diameter makes it suitable for small devices.

Optical Format (inch) 1/2.5

Standard optical format ensures compatibility with various lenses and accessories.

Termination Type SOLDER

Solder termination type provides secure and reliable connections.

Output Interface Type 2-WIRE INTERFACE

2-wire interface simplifies the connection and communication with other devices.

Frame Rate 14 fps

Decent frame rate ensures smooth video recording and real-time image processing.

Array Type FRAME

Array type ensures efficient and organized image capture and processing.

Sensitivity (V/lx.s) 1.4 V/lx.s

High sensitivity allows for capturing clear images even in low light conditions.

Mounting Feature SURFACE MOUNT

Surface mount feature makes it easy to mount the sensor securely onto PCBs.

Technical Specifications

Image Sensors MT9P031I12STM-DP1 attributes and parameters. Explore more Image Sensors devices from Onsemi

Specs

Additional Features:

ELECTRONIC ROLLING SHUTTER; IT ALSO OPERATES AT 2.8 V ANALOG NOMINAL SUPPLY VOLTAGE

Array Type:

FRAME

Body Width:

10 inch

Body Height:

1.25 mm

Body Length/Diameter:

10 mm

Dynamic Range:

70.1 dB

Frame Rate:

14 fps

Horizontal Pixel:

2592

Master Clock:

96 MHz

Mounting Feature:

Maximum Operating Current:

35 mA

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-30 Cel

Optical Format (inch):

1/2.5

Output Interface Type:

2-WIRE INTERFACE

Output Range:

Output Type:

Package Shape or Style:

Pixel Size (um):

2.2X2.2

Sensitivity (V/lx.s):

1.4 V/lx.s

Sensors or Transducers Type:

Maximum Supply Voltage:

1.9 V

Minimum Supply Voltage:

1.7 V

Termination Type:

SOLDER

Vertical Pixel:

1944

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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