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MT9P006I12STCU-DP

Onsemi

MT9P006I12STCU-DP by Onsemi

MT9P006I12STCU-DP by Onsemi is an image sensor with 2.2x2.2 um pixel size, 96 MHz master clock, and 2592 horizontal pixels. It is ideal for applications requiring a digital voltage output interface, such as surveillance cameras or industrial imaging systems.

Median Price

$16.871

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 4,814 parts In-Stock

1+ parts

$19.990

100+ parts

$19.590

1k+ parts

$19.190

10k+ parts

-

4,814

$19.990

$19.590

$19.190

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DigiKey

USA . 2,158 parts In-Stock

1+ parts

$23.440

100+ parts

$14.745

1k+ parts

$12.317

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2,158

$23.440

$14.745

$12.317

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Arrow

USA . 2,160 parts In-Stock

1+ parts

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$13.752

2,160

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$13.752

Verical

USA . 2,160 parts In-Stock

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$13.752

2,160

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$13.752

Distributors (In-Stock)

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Vyrian

USA . 2,169 parts In-Stock

1+ parts

$7.200

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2,169

$7.200

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Digiode

USA . 2,096 parts In-Stock

1+ parts

$22.268

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2,096

$22.268

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Flip Electronics

USA . 1,200 parts In-Stock

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1,200

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Nova Conductors

Japan . 900 parts In-Stock

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900

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Chip Stock

USA . 256 parts In-Stock

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256

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Distributors (Availability)

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Corohmni

South Africa . 136 parts In-Stock

1+ parts

$13.752

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-

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136

$13.752

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Corphita

USA . 737 parts In-Stock

1+ parts

$21.096

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737

$21.096

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Perfect Parts

USA . 10,640 parts In-Stock

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Kulean Microsystems

USA . 8,390 parts In-Stock

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8,390

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TANS Electronics

Latvia . 7,342 parts In-Stock

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7,342

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Argo Parts USA

USA . 5,373 parts In-Stock

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5,373

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Problanco Electronics

Mexico . 5,037 parts In-Stock

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SupplyDigital Components

Austria . 3,111 parts In-Stock

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Netroflash

USA . 2,000 parts In-Stock

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Continental Prestige Electronics

USA . 1,830 parts In-Stock

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1,830

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Futuretech Components

Singapore . 960 parts In-Stock

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960

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UHIMA Technologies

Türkiye . 834 parts In-Stock

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834

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Kepictronics

USA . 140 parts In-Stock

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iodParts Technologies Inc.

India . 10 parts In-Stock

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10

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Overview

Capture stunning images with the MT9P006I12STCU-DP image sensor by Onsemi, a leading manufacturer known for top-quality products. Ideal for various applications, this sensor boasts a high pixel resolution and impressive dynamic range. Whether you're a photography enthusiast or a professional in need of reliable imaging technology, this sensor delivers exceptional value, performance, and precision. Upgrade your projects with the MT9P006I12STCU-DP and experience the difference in quality and clarity.

Feature Benefit Bullets

Pixel Size (um): 2.2X2.2

Small pixel size allows for high resolution images with fine details.

Maximum Supply Voltage: 1.9 V

Low maximum supply voltage means lower power consumption and potentially longer battery life.

Master Clock: 96 MHz

High master clock frequency enables fast data processing for real-time imaging applications.

Body Width: 10 inch

Compact body width makes it suitable for integration into small devices or applications with limited space.

Sensors or Transducers Type: IMAGE SENSOR,CMOS

CMOS sensor technology offers high sensitivity, low noise, and low power consumption for high-quality imaging.

Body Height: 1.25 mm

Low body height allows for slim camera designs and flexibility in fitting into various devices.

Package Shape or Style: SQUARE

Square package shape is commonly used and easily mounted for manufacturing purposes.

Minimum Supply Voltage: 1.7 V

Low minimum supply voltage ensures reliable operation even in low power conditions.

Maximum Operating Temperature: 70 °C

Wide operating temperature range makes it suitable for use in various environmental conditions.

Horizontal Pixel: 2592

High horizontal pixel count provides detailed and high-resolution images.

Output Range: 0.16-1.82V

Wide output voltage range offers flexibility in signal processing and compatibility with different systems.

Output Type: DIGITAL VOLTAGE

Digital voltage output simplifies signal processing and enhances compatibility with digital systems.

Minimum Operating Temperature: -30 °C

Low minimum operating temperature allows for use in extreme cold environments without performance degradation.

Maximum Operating Current: 35 mA

Low operating current consumption helps in reducing power usage and heat generation.

Dynamic Range: 67.74 dB

High dynamic range ensures accurate representation of both bright and dark areas in an image.

Vertical Pixel: 1944

High vertical pixel count contributes to the overall image quality and sharpness.

Body Length/Diameter: 10 mm

Compact body length allows for easy integration and installation in various devices.

Optical Format (inch): 1/2.5

Standard optical format supports compatibility with various lenses and optical components.

Termination Type: SOLDER

Solder termination provides a reliable and strong connection for secure mounting.

Output Interface Type: 2-WIRE INTERFACE

2-wire interface simplifies connectivity and data transfer with other systems or devices.

Frame Rate: 15 fps

Decent frame rate allows for smooth video recording and real-time imaging applications.

Array Type: SINGLE FRAME

Single frame array simplifies data processing and reduces complexity in capturing images.

Mounting Feature: SURFACE MOUNT

Surface mount capability offers easy and secure mounting on circuit boards or surfaces.

Technical Specifications

Image Sensors MT9P006I12STCU-DP attributes and parameters. Explore more Image Sensors devices from Onsemi

Specs

Additional Features:

ELECTRONIC ROLLING SHUTTER, IT ALSO OPERATES AT 2.60-3.10 V ANALOG SUPPLY VOLATGE

Array Type:

SINGLE FRAME

Body Width:

10 inch

Body Height:

1.25 mm

Body Length/Diameter:

10 mm

Dynamic Range:

67.74 dB

Frame Rate:

15 fps

Horizontal Pixel:

2592

Master Clock:

96 MHz

Mounting Feature:

Maximum Operating Current:

35 mA

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-30 Cel

Optical Format (inch):

1/2.5

Output Interface Type:

2-WIRE INTERFACE

Output Range:

Output Type:

Package Shape or Style:

Pixel Size (um):

2.2X2.2

Sensors or Transducers Type:

Maximum Supply Voltage:

1.9 V

Minimum Supply Voltage:

1.7 V

Termination Type:

SOLDER

Vertical Pixel:

1944

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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