Loading...

AR0220AT3B00XUEA0-DRBR

Onsemi

AR0220AT3B00XUEA0-DRBR by Onsemi

Onsemi's AR0220AT3B00XUEA0-DRBR is a CMOS image sensor with 1828x948 pixels, 120dB dynamic range, and 27MHz master clock. Ideal for frame array applications in devices requiring high-resolution imaging at temperatures ranging from -40 to 105 °C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,091 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,091

-

-

-

-

Vyrian

USA . 364 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

364

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 640 parts In-Stock

1+ parts

$1,006.040

100+ parts

$985.919

1k+ parts

$975.859

10k+ parts

$965.798

640

$1,006.040

$985.919

$975.859

$965.798

Northwest PG Solutions

USA . 276 parts In-Stock

1+ parts

$1,106.644

100+ parts

-

1k+ parts

-

10k+ parts

-

276

$1,106.644

-

-

-

TANS Electronics

Latvia . 6,331 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,331

-

-

-

-

Problanco Electronics

Mexico . 5,253 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,253

-

-

-

-

Kulean Microsystems

USA . 4,515 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,515

-

-

-

-

Corphita

USA . 640 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

640

-

-

-

-

Corohmni

South Africa . 473 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

473

-

-

-

-

SupplyDigital Components

Austria . 406 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

406

-

-

-

-

UHIMA Technologies

Türkiye . 355 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

355

-

-

-

-

Overview

Capture every detail with the AR0220AT3B00XUEA0-DRBR Image Sensor by Onsemi. As a leading manufacturer in the industry, Onsemi ensures top-notch quality and reliability in every product they offer. This image sensor is perfect for a wide range of applications, delivering crisp images with a high dynamic range of 120 dB. With a frame rate of 60 fps and a compact design, this sensor provides exceptional value to customers looking for superior image quality in a variety of settings. Trust Onsemi to bring your imaging projects to life with the AR0220AT3B00XUEA0-DRBR.

Feature Benefit Bullets

Maximum Supply Voltage: 1.26 V

Higher maximum supply voltage allows for more flexibility in powering the image sensor, potentially enabling improved performance.

Master Clock: 27 MHz

The high master clock frequency helps in achieving fast data readout and processing, leading to high speed and efficiency in capturing images.

Body Width: 9 inch

The compact body width makes this image sensor suitable for applications where space constraints are a concern.

Sensors or Transducers Type: IMAGE SENSOR,CMOS

CMOS image sensors offer low power consumption, high speed operation, and improved image quality, making them a popular choice in various imaging applications.

Body Height: 1.65 mm

The low body height allows for compact integration of the image sensor in devices, making it suitable for miniaturized designs.

Package Shape or Style: RECTANGULAR

Rectangular package shape provides ease of mounting and integration into electronic systems.

Minimum Supply Voltage: 1.14 V

Lower minimum supply voltage ensures efficient power usage in the image sensor, contributing to overall energy savings.

Maximum Operating Temperature: 105 °C

Wide operating temperature range enables reliable performance in various environmental conditions, making it suitable for outdoor or industrial applications.

Horizontal Pixel: 1828

High horizontal pixel count results in detailed and sharp images with high resolution, enhancing overall image quality.

Output Range: 0.40-1.20V

The wide output range allows for capturing a diverse range of brightness levels in the images, providing better dynamic range capabilities.

Output Type: DIGITAL VOLTAGE

Digital voltage output simplifies signal processing and integration with digital systems, offering a convenient interface for data transfer.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature ensures reliable performance in cold environments, making it suitable for outdoor and industrial applications.

Terminal Finish: Tin/Silver/Copper (Sn/Ag/Cu)

The use of Tin/Silver/Copper as terminal finish provides excellent conductivity and corrosion resistance, ensuring robust electrical connections.

Maximum Operating Current: 220 mA

The low operating current consumption helps in reducing power usage and heat generation, contributing to improved efficiency and longer battery life.

Dynamic Range: 120 dB

High dynamic range enables the image sensor to capture a wide range of light intensities accurately, resulting in images with rich details and excellent contrast.

Vertical Pixel: 948

Vertical pixel count contributes to the overall resolution of the image sensor, enhancing the quality of captured images.

Body Length/Diameter: 12 mm

The compact body length/diameter allows for easy integration and placement of the image sensor in space-constrained designs.

Optical Format (inch): 1/1.8

The optical format specification provides information on the size and aspect ratio of the image sensor, aiding in lens selection and image framing.

Termination Type: SOLDER

Solder termination offers reliable and secure electrical connections, ensuring stability and durability in various operating conditions.

Output Interface Type: 2-WIRE INTERFACE

2-wire interface simplifies the connectivity and communication with external devices, enabling seamless integration and data exchange.

Frame Rate: 60 fps

High frame rate allows for capturing fast-moving objects with clarity, making it suitable for applications where motion detection or analysis is required.

Array Type: FRAME

Frame array type enables simultaneous capture of multiple frames, facilitating advanced imaging techniques and high-speed image processing.

Mounting Feature: SURFACE MOUNT

Surface mounting feature simplifies the installation and assembly process, offering flexibility in design and deployment.

Technical Specifications

Image Sensors AR0220AT3B00XUEA0-DRBR attributes and parameters. Explore more Image Sensors devices from Onsemi

Specs

Additional Features:

ELECTRONIC ROLLING SHUTTER; IT ALSO OPERATES AT 2.8 V ANALOG NOMINAL SUPPLY VOLTAGE

Array Type:

FRAME

Body Width:

9 inch

Body Height:

1.65 mm

Body Length/Diameter:

12 mm

Dynamic Range:

120 dB

Frame Rate:

60 fps

Horizontal Pixel:

1828

JESD-609 Code:

e1

Master Clock:

27 MHz

Mounting Feature:

Maximum Operating Current:

220 mA

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Optical Format (inch):

1/1.8

Output Interface Type:

2-WIRE INTERFACE

Output Range:

Output Type:

Package Shape or Style:

Sensors or Transducers Type:

Maximum Supply Voltage:

1.26 V

Minimum Supply Voltage:

1.14 V

Terminal Finish:

Tin/Silver/Copper (Sn/Ag/Cu)

Termination Type:

SOLDER

Vertical Pixel:

948

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 20