Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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MT9M031I12STC-DPBR by Onsemi is a 1/3 inch CMOS image sensor with 1280x960 resolution, 3.75um pixel size, and 50MHz master clock. Ideal for applications requiring high-quality digital imaging at up to 45fps with a dynamic range of 64dB.
Median Price
$25.420
Lifecycle Status
Suppliers In-Stock
6
In-Stock Inventory
1k+
DigiKey
1+ parts
-
100+ parts
1k+ parts
10k+ parts
Flip Electronics (Authorized)
Vyrian
$23.120
Chip Stock
Flip Electronics
Digiode
Corohmni
Authorized Procurement Solutions
Problanco Electronics
TANS Electronics
SupplyDigital Components
Kulean Microsystems
Corphita
UHIMA Technologies
Smaller pixel size allows for higher resolution images to be captured with more detail.
Allows for efficient power consumption while still providing enough voltage for optimal performance.
High master clock frequency ensures fast and accurate image capturing and processing.
Compact body width allows for easy integration into various devices and systems.
CMOS image sensor technology provides high image quality, low power consumption, and fast readout speeds.
Wide range of operating temperatures makes this sensor suitable for use in various environments.
High frame rate enables smooth and fluid video recording and playback.
Surface mount capability allows for easy and secure installation on PCBs.
Image Sensors MT9M031I12STC-DPBR attributes and parameters. Explore more Image Sensors devices from Onsemi
Additional Features:
Array Type:
Body Width:
Body Height:
Body Length/Diameter:
Dynamic Range:
Frame Rate:
Horizontal Pixel:
Master Clock:
Mounting Feature:
Maximum Operating Current:
Maximum Operating Temperature:
Minimum Operating Temperature:
Optical Format (inch):
Output Interface Type:
Output Type:
Package Shape or Style:
Pixel Size (um):
Sensitivity (V/lx.s):
Sensors or Transducers Type:
Maximum Supply Voltage:
Minimum Supply Voltage:
Termination Type:
Vertical Pixel:
PCN Obsolescence/ EOL - Mult Dev EOL 08/Jul/2021
PCN Assembly/Origin - Update 05/Nov/2020
Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).
President, CEO
Hassane El-Khoury
Executive VP, CFO, Treasurer
Thad Trent
Senior VP
Ross F. Jatou
Aizu Fab
Fabrication
Fab Initiation
1995
Japan
Aizu Wakamatsu
Wafer Capacity
52,000
Si/EPI Fab
2018
Czech Republic
Rožnov pod Radhoštěm
10,000
Expansion Phase 1 for SiC / EPI
2019
14,500
Expansion Phase 2 for SiC / EPI
2024
SiC Fab
2022
USA
Hudson
Bucheon
2013
South Korea
61,000
ISMF - Malaysia
1990
Malaysia
Seremban
95,000
Roznov Device Fab
1987
80,000
Fab 10
2002
East Fishkill
15,000
Burlington
1986
Canada
Gresham
1998
45,000
Bucheon 150mm
2000
50,000
Rochester
1983
Nampa
Pennsylvania
1997
Mountain Top
36,000
BSS123NH6327XTSA1
Infineon Technologies
Infineon BSS123NH6327XTSA1 is a N-CHANNEL FET with 100V DS breakdown voltage, 0.19A ID, and 6 ohm RDS(on). Ideal for small outline applications requiring high drain current and low on-resistance. AEC-Q101 compliant for automotive use.
2N7002
Taitron Components
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Operating Mode: ENHANCEMENT MODE; Minimum DS Breakdown Voltage: 60 V; Package Shape: RECTANGULAR;
SMBJ18CA
Semitron
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
LL4148
Sensitron Semiconductor
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
FDD5614P
Fairchild Semiconductor
P-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): 42 W; Terminal Position: SINGLE; Terminal Form: GULL WING;
LM555CN
Rca Solid State
Analog Waveform Generation Functions; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR; Surface Mount: NO;
Inter F E T
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Maximum Drain-Source On Resistance: 7.5 ohm; Maximum Drain Current (Abs) (ID): .115 A;
BAV99
Diodes Incorporated
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
1N4148WT
Bytesonic Electronics
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: FLAT; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
MBRS130LT3G
Rochester Electronics
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: J BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
BSS138
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .36 W; Terminal Finish: TIN LEAD; Package Body Material: PLASTIC/EPOXY;
1N4148
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
LFXTAL025159REEL
Iqd Frequency Products
LFXTAL025159REEL by IQD Frequency Products is a 32.768 kHz crystal oscillator with 20 ppm frequency tolerance and 40,000 ohm series resistance. It is ideal for applications requiring precise timekeeping, such as real-time clocks in IoT devices or microcontrollers in wearables. The surface-mount design with a drive level of 1 uW makes it suitable for compact electronic systems.
LM317T
National Semiconductor
ADJUSTABLE POSITIVE SINGLE OUTPUT STANDARD REGULATOR; No. of Terminals: 3; Package Code: TO-220; Terminal Form: THROUGH-HOLE; Package Shape: RECTANGULAR; Minimum Input-Output Voltage Differential: 3 V;
LM317LMX/NOPB
ADJUSTABLE POSITIVE SINGLE OUTPUT STANDARD REGULATOR; No. of Terminals: 8; Package Code: SOP; Terminal Form: GULL WING; Maximum Seated Height: 1.75 mm; Nominal Dropout Voltage-1: 3 V;
ULN2803A
Onsemi
NPN; Configuration: 8 BANKS, DARLINGTON WITH BUILT-IN DIODE AND RESISTOR; Surface Mount: NO; Maximum Collector Current (IC): .5 A; Package Body Material: PLASTIC/EPOXY; Qualification: Not Qualified;
Changzhou Galaxy Century Microelectronics
RECTIFIER DIODE; Surface Mount: NO; Config: SINGLE; Peak Reflow Temperature (C): 260; No. of Phases: 1; Diode Element Material: SILICON;
Diotec Electronics
Surge Components
KAF-8300-AXC-CD-AA
The Onsemi KAF-8300-AXC-CD-AA is a CCD image sensor with 5.4X5.4 um pixel size, offering a dynamic range of 64.4 dB and 3326 horizontal pixels. It operates b/w -10 to 70 °C, with a data rate of 28 Mbps, making it ideal for high-resolution imaging applications in various industries.
AR0135AT2M00XUEA0-TPBR
The Onsemi AR0135AT2M00XUEA0-TPBR is a 1/3-inch CMOS image sensor with 1280x960 pixels, offering a pixel size of 3.75um. It operates at a max supply voltage of 1.95V and features a digital output interface, making it suitable for applications requiring high-resolution imaging at up to 54 fps.
MT9P031I12STC
Aptina
IMAGE SENSOR,CMOS; Mounting Feature: SURFACE MOUNT; Output Type: DIGITAL VOLTAGE; Package Shape or Style: SQUARE; Output Range: 0.60-2.30V; Body Height: 1.25 mm;
KAI-29050-QXA-JD-B1
KAI-29050-QXA-JD-B1 by Onsemi is an image sensor with 5.5x5.5 um pixel size, 15.5 V max supply voltage, and 6644 horizontal pixels. Ideal for applications requiring high-resolution imaging in a compact form factor, such as industrial machine vision systems or medical imaging devices.
MT9V111IA7ATC-DR
MT9V111IA7ATC-DR by Onsemi is a 640x480 CMOS image sensor with 5.6um pixel size and 60dB dynamic range. Operating at -20 to 60 °C, it has a digital output interface and runs at 15 fps. Ideal for applications requiring high-quality imaging in compact devices.
KAI-29050-PXA-JD-B1
Onsemi's KAI-29050-PXA-JD-B1 is a 5.5X5.5 um CCD image sensor with 6576Hx4384V pixels, offering a dynamic range of 64 dB. Operating b/w -50 to 70 °C, it requires a 15V power supply and has an optical format of 4/2.99 inch. Ideal for applications requiring high-resolution imaging in varying temperatures.
KAI-4021-CBA-CD-BA
KAI-4021-CBA-CD-BA by Onsemi is a 2048x2048 CCD image sensor with 7.4um pixel size and 60dB dynamic range. It operates b/w -50 °C to 70°C, making it suitable for industrial imaging applications requiring high-resolution and low-light performance. The sensor comes in a rectangular ceramic housing with through-hole mounting, offering a data rate of 40 Mbps.
ILX751B
Sony
Sony ILX751B is a 2048-pixel CCD image sensor with 14x14 um pixel size. It operates b/w -10 to 55 °C, offering a dynamic range of 76 dB and sensitivity of 40 V/lx.s. Ideal for applications requiring high-quality imaging in various lighting conditions.
AR0234CSSC28SUKA0-CR
AR0234CSSC28SUKA0-CR by Onsemi is a CMOS image sensor with 1920x1200 resolution, 3x3 um pixel size, and 71.4 dB dynamic range. It operates at -40 to 85 °C and has a frame rate of 120 fps. Ideal for applications requiring high-quality digital imaging in automotive, surveillance, and industrial systems.
AR0239ATSC00XUEA0-DRBR
IMAGE SENSOR,CMOS; JESD-609 Code: e1; Terminal Finish: TIN SILVER COPPER;
MT9V024IA7XTM-DP2
MT9V024IA7XTM-DP2 by Onsemi is a 1/3" CMOS image sensor with 6x6 um pixel size, offering 60 fps frame rate. Ideal for surface mount applications in various imaging devices due to its compact 9mm square package design.
MT9D112D00STCK15AC1
Image Sensors;
AMIS-720442-A
Image Sensors; Power Supplies (V): 5; Vertical Pixel: 1; Horizontal Pixel: 128; Minimum Operating Temperature: 0 Cel; Maximum Operating Temperature: 50 Cel;
NOIP1SN2000A-QTI
NOIP1SN2000A-QTI by Onsemi features 4.8x4.8 um pixel size, 360 MHz master clock, and 1920x1200 resolution. This image sensor is ideal for high-speed imaging applications requiring a dynamic range of 60 dB and a frame rate of 230 fps in an optical format of 2/3 inch.
TC213-50
Texas Instruments
TC213-50 by Texas Instruments is an image sensor with 12x12 um pixel size, 512 horizontal pixels, and 1000 vertical pixels. Operating at temperatures from -10 to 40 °C, it requires a 12V power supply. Ideal for applications requiring THROUGH HOLE MOUNT feature in various industries.
KAI-2020-FBA-CD-BA
KAI-2020-FBA-CD-BA by Onsemi is an image sensor with 7.4x7.4 um pixel size, 1600 horizontal pixels, and 1200 vertical pixels. It operates b/w -50 to 70 °C and has a dynamic range of 68 dB. Ideal for applications requiring high-resolution imaging in industrial or scientific settings.
AR0132AT6M00XPW90
Onsemi's AR0132AT6M00XPW90 Image Sensor features 3.75um Pixel Size, 50MHz Master Clock, and 115dB Dynamic Range. Ideal for applications requiring high-resolution imaging with a resolution of 1280x960 pixels at a frame rate of 60fps.
KAI-4021-ABA-CR-AE
KAI-4021-ABA-CR-AE by Onsemi is a 2048x2048 CCD image sensor with 7.4um pixel size and 60dB dynamic range. It operates b/w -50 °C to 70°C, making it suitable for industrial imaging applications requiring high-resolution and low-light performance. The sensor comes in a rectangular ceramic housing with through-hole mounting, offering a data rate of 40 Mbps.
KAI-11002-ABA-CD-B1
The Onsemi KAI-11002-ABA-CD-B1 is an image sensor with 9x9 um pixel size, 4008 horizontal pixels, and 2672 vertical pixels. It operates at a supply voltage range of 14.5V to 15.5V, offering a dynamic range of 28 dB. Ideal for applications requiring high-resolution imaging in industrial or scientific settings.
KAI-2001-AAA-CR-BA
KAI-2001-AAA-CR-BA by Onsemi is an image sensor with 7.4x7.4 um pixel size, 1600 horizontal pixels, and 1200 vertical pixels. It operates at a max supply voltage of 15.5 V and has a dynamic range of 60 dB. This rectangular CCD sensor is ideal for applications requiring high-resolution imaging in industrial or scientific settings.
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MT9M001C12STM
The Onsemi MT9M001C12STM image sensor features a pixel size of 5.2x5.2 um, operates at a max supply voltage of 3.6V, and has a master clock of 48 MHz. This CMOS sensor is commonly used in applications requiring high-quality digital imaging with an optical format of 1/2 inch and a frame rate of 30 fps.
Micron Technology
IMAGE SENSOR,CMOS; Mounting Feature: SURFACE MOUNT; Output Type: DIGITAL VOLTAGE; Package Shape or Style: SQUARE; Output Range: 0.20-3.40V; Optical Format (inch): 1/2;
IMAGE SENSOR,CMOS; Output Type: DIGITAL VOLTAGE; Package Shape or Style: SQUARE; Output Range: 0.20-3.40V; Termination Type: SOLDER; Frame Rate: 30 fps;
MT9M001C12STM-DP
IMAGE SENSOR,CMOS; Mounting Feature: SURFACE MOUNT; Output Type: DIGITAL VOLTAGE; Package Shape or Style: SQUARE; Optical Format (inch): 1/2; Maximum Operating Temperature: 70 Cel;
MT9M001C12STM-TP
IMAGE SENSOR,CMOS; Mounting Feature: SURFACE MOUNT; Output Type: DIGITAL VOLTAGE; Package Shape or Style: SQUARE; Body Width: 14.22 inch; Array Type: FRAME;
MT9M001C12STM-DR
IMAGE SENSOR,CMOS; Mounting Feature: SURFACE MOUNT; Output Type: DIGITAL VOLTAGE; Package Shape or Style: SQUARE; Optical Format (inch): 1/2; Array Type: FRAME;
MT9M001C12STM-DR1
IMAGE SENSOR,CMOS; Mounting Feature: SURFACE MOUNT; Output Type: DIGITAL VOLTAGE; Package Shape or Style: SQUARE; Minimum Supply Voltage: 3 V; Body Height: 2.21 mm;
MT9M001C12STM-TR
IMAGE SENSOR,CMOS; Mounting Feature: SURFACE MOUNT; Output Type: DIGITAL VOLTAGE; Package Shape or Style: SQUARE; Frame Rate: 30 fps; Array Type: FRAME;
MT9M001C12STC-DR
IMAGE SENSOR,CMOS; Mounting Feature: SURFACE MOUNT; Output Type: DIGITAL VOLTAGE; Package Shape or Style: SQUARE; Body Height: 2.25 mm; Master Clock: 48 MHz;
MT9M001C12STC-TP
IMAGE SENSOR,CMOS; Mounting Feature: SURFACE MOUNT; Output Type: DIGITAL VOLTAGE; Package Shape or Style: SQUARE; Frame Rate: 30 fps; Minimum Operating Temperature: 0 Cel;
MT9M021IA3XTM-DPBR1
IMAGE SENSOR,CMOS; Mounting Feature: SURFACE MOUNT; Output Type: DIGITAL VOLTAGE; Package Shape or Style: SQUARE; Minimum Operating Temperature: -30 Cel; Sensitivity (V/lx.s): 5.3 V/lx.s;
MT9M021IA3XTM-DPBR
IMAGE SENSOR,CMOS; Mounting Feature: SURFACE MOUNT; Output Type: DIGITAL VOLTAGE; Package Shape or Style: SQUARE; Maximum Operating Current: 55 mA; Master Clock: 50 MHz;
MT9M032C12STMU
IMAGE SENSOR,CMOS; Mounting Feature: SURFACE MOUNT; Output Type: DIGITAL VOLTAGE; Package Shape or Style: SQUARE; Output Range: 0.20-3.05V; Minimum Supply Voltage: 1.7 V;
MT9M034I12STC-DPBR1
IMAGE SENSOR,CMOS; Mounting Feature: SURFACE MOUNT; Output Type: DIGITAL VOLTAGE; Package Shape or Style: SQUARE; Output Range: 0.40-2.50V; Minimum Supply Voltage: 1.7 V;
MT9M034I12STC-DPBR
IMAGE SENSOR,CMOS; Mounting Feature: SURFACE MOUNT; Output Type: DIGITAL CURRENT; Package Shape or Style: SQUARE; Output Range: -22-22mA; Additional Features: DUAL OUTPUT;
MT9M114D00STCZK24BC1-200
IMAGE SENSOR,CMOS; Mounting Feature: SURFACE MOUNT; Output Type: DIGITAL VOLTAGE; Output Range: 0.45-1.35V; Output Interface Type: 2-WIRE INTERFACE; Additional Features: ELECTRONIC ROLLING SHUTTER, IT ALSO OPERATES AT 2.50-3.10 V ANALOG SUPPLY VOLATGE;
MT9M114EBLSTCZ-CR1
MT9M114EBLSTCZ-CR1 by Onsemi is an image sensor with 1296x976 pixels, 1.90um pixel size, and 70.8dB dynamic range. It operates b/w -30 to 70°C and has a digital voltage output interface. Ideal for applications requiring high-quality imaging in compact devices like smartphones and tablets.
MT9M012D00STM
IMAGE SENSOR,CMOS; Mounting Feature: SURFACE MOUNT; Output Type: DIGITAL OUTPUT; Package Shape or Style: RECTANGULAR; Minimum Operating Temperature: -30 Cel; Maximum Operating Temperature: 70 Cel;
MT9M015D00STCC14EC1
IMAGE SENSOR,CMOS; Output Type: DIGITAL CURRENT; Output Range: 2.60-22.30mA; Horizontal Pixel: 1288; Maximum Operating Current: 30 mA; Array Type: FRAME;
MT9M002I12STC
IMAGE SENSOR,CMOS; Mounting Feature: SURFACE MOUNT; Output Type: DIGITAL CURRENT; Package Shape or Style: SQUARE; Output Range: 0.012-0.014mA; Vertical Pixel: 1096;
Supply Digital Components
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Quantity
12,000 In-Stock
Total price ≈ $80,197.29
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