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LC9945

Onsemi

LC9945 by Onsemi

The Onsemi LC9945 is an image sensor with 258Hx299V pixels, 9.7X6.2um pixel size, and operates at -10 to 55 °C. It requires a 15V power supply. Ideal for applications requiring high-resolution imaging in varying temperature conditions.

Median Price

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Lifecycle Status

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3

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1k+

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Digiode

USA . 2,139 parts In-Stock

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Vyrian

USA . 607 parts In-Stock

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Fibra_Brandt Electronic GMBH

Germany . 5 parts In-Stock

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SupplyDigital Components

Austria . 8,198 parts In-Stock

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Kulean Microsystems

USA . 4,758 parts In-Stock

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Problanco Electronics

Mexico . 4,221 parts In-Stock

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TANS Electronics

Latvia . 2,063 parts In-Stock

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Corphita

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Corohmni

South Africa . 488 parts In-Stock

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UHIMA Technologies

Türkiye . 53 parts In-Stock

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Overview

Enhance your imaging experience with the LC9945 by Onsemi. As a leading manufacturer in image sensors, Onsemi ensures top-notch quality and reliability in their products. The LC9945 boasts a pixel size of 9.7X6.2 um, making it ideal for capturing crisp and detailed images. With a wide range of applications in fields such as automotive, security, and medical imaging, this sensor offers exceptional value and benefits to customers looking for high-performance imaging solutions. Upgrade your imaging capabilities with the LC9945 and see the difference for yourself.

Feature Benefit Bullets

Pixel Size (um): 9.7X6.2

Larger pixel size allows for more light to be captured, resulting in better image quality and low-light performance.

Power Supplies (V): 15

Higher power supply voltage allows for efficient operation and better signal processing capabilities.

Maximum Operating Temperature: 55 °C

Higher maximum operating temperature ensures reliable performance even in hot environments.

Horizontal Pixel: 258

Higher number of horizontal pixels allows for sharper and more detailed images.

Minimum Operating Temperature: -10 °C

Lower minimum operating temperature ensures the sensor can still function in colder conditions.

Vertical Pixel: 299

Higher number of vertical pixels allows for better resolution and image clarity.

Technical Specifications

Image Sensors LC9945 attributes and parameters. Explore more Image Sensors devices from Onsemi

Specs

Horizontal Pixel:

258

Maximum Operating Temperature:

55 Cel

Minimum Operating Temperature:

-10 Cel

Pixel Size (um):

9.7X6.2

Power Supplies (V):

15

Sub-Category:

CCD Image Sensors

Vertical Pixel:

299

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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