Loading...

LC99160GL

Onsemi

LC99160GL by Onsemi

LC99160GL by Onsemi is an image sensor with 780x510 pixels, 5X5.55um pixel size, and operates at -10 to 60 °C. It requires a power supply of 18V and features THROUGH HOLE MOUNTing. Ideal for applications requiring high-resolution imaging in various temperature conditions.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,344 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,344

-

-

-

-

Vyrian

USA . 2,252 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,252

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Kulean Microsystems

USA . 7,981 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,981

-

-

-

-

Problanco Electronics

Mexico . 7,770 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,770

-

-

-

-

SupplyDigital Components

Austria . 6,645 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,645

-

-

-

-

TANS Electronics

Latvia . 4,834 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,834

-

-

-

-

Corphita

USA . 1,594 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,594

-

-

-

-

UHIMA Technologies

Türkiye . 851 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

851

-

-

-

-

Corohmni

South Africa . 131 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

131

-

-

-

-

Overview

Capture stunning images with the LC99160GL by Onsemi, a top-of-the-line image sensor that guarantees exceptional quality and performance. Onsemi's reputation for excellence in manufacturing ensures reliability and durability in every product. Ideal for a wide range of applications, this sensor provides crystal-clear images with precise detail, making it perfect for use in security cameras, medical imaging systems, and industrial automation. Experience the value and benefits of the LC99160GL, offering unmatched advantages to meet all your imaging needs.

Feature Benefit Bullets

Pixel Size (um): 5X5.55

This small pixel size allows for high resolution images to be captured, making this sensor ideal for applications where image clarity is important.

Power Supplies (V): 18

The higher power supply of 18V ensures efficient and reliable operation of the sensor, providing consistent performance in various conditions.

Maximum Operating Temperature: 60 °C

With a maximum operating temperature of 60 °C, this sensor can withstand high temperatures without sacrificing performance, making it suitable for use in demanding environments.

Horizontal Pixel: 780

The large number of horizontal pixels allows for detailed and wide-angle image capture, making this sensor suitable for applications where a wide field of view is required.

Minimum Operating Temperature: -10 °C

The low minimum operating temperature of -10 °C ensures that the sensor can function effectively even in cold conditions, expanding its usability in different environments.

Vertical Pixel: 510

The vertical pixel count of 510 provides adequate resolution for capturing detailed images in a vertical orientation, making this sensor versatile for various imaging tasks.

Mounting Feature: THROUGH HOLE MOUNT

The THROUGH HOLE MOUNT feature allows for easy and secure installation of the sensor, ensuring stability and reliability in its placement, which is important for precise image capturing.

Technical Specifications

Image Sensors LC99160GL attributes and parameters. Explore more Image Sensors devices from Onsemi

Specs

Horizontal Pixel:

780

Mounting Feature:

Maximum Operating Temperature:

60 Cel

Minimum Operating Temperature:

-10 Cel

Pixel Size (um):

5X5.55

Power Supplies (V):

18

Sub-Category:

CCD Image Sensors

Vertical Pixel:

510

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 5