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AR0330CM1C00SHKA0-CP

Onsemi

AR0330CM1C00SHKA0-CP by Onsemi

The Onsemi AR0330CM1C00SHKA0-CP is a 1/3-inch CMOS image sensor with 2304 (H) x 1296 (V) pixels. It operates at a max supply voltage of 1.9V and has a dynamic range of 69.5 dB. Ideal for applications requiring high-resolution imaging with a frame rate of up to 60 fps, such as surveillance cameras and industrial machine vision systems.

Median Price

$12.850

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 13,229 parts In-Stock

1+ parts

-

100+ parts

$11.910

1k+ parts

$10.660

10k+ parts

$10.030

13,229

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$11.910

$10.660

$10.030

DigiKey

USA . 13,229 parts In-Stock

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$13.790

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13,229

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$13.790

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Flip Electronics (Authorized)

USA . 1,000 parts In-Stock

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Digiode

USA . 1,001 parts In-Stock

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$12.597

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$12.597

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Vyrian

USA . 2,150 parts In-Stock

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$13.260

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$13.260

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Flip Electronics

USA . 1,000 parts In-Stock

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Distributors (Availability)

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Corphita

USA . 1,114 parts In-Stock

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$11.934

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1,114

$11.934

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Corohmni

South Africa . 164 parts In-Stock

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$13.260

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164

$13.260

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TANS Electronics

Latvia . 6,749 parts In-Stock

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6,749

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Problanco Electronics

Mexico . 5,324 parts In-Stock

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Kulean Microsystems

USA . 4,542 parts In-Stock

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Northwest PG Solutions

USA . 2,314 parts In-Stock

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SupplyDigital Components

Austria . 2,004 parts In-Stock

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Native Components

USA . 327 parts In-Stock

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UHIMA Technologies

Türkiye . 252 parts In-Stock

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Overview

Capture stunning images with the AR0330CM1C00SHKA0-CP Image Sensor by Onsemi. Known for their top-notch quality and reliability, Onsemi delivers cutting-edge technology in the field of image sensors. Ideal for a wide range of applications, this sensor offers exceptional value and benefits to customers looking to enhance their imaging capabilities. Whether you're a professional photographer or a tech enthusiast, the AR0330CM1C00SHKA0-CP is sure to impress with its superior performance and advanced features. Elevate your imaging experience with Onsemi's state-of-the-art image sensor today!

Feature Benefit Bullets

Pixel Size (um): 2.2X2.2

Small pixel size allows for high resolution and detail in captured images.

Maximum Supply Voltage: 1.9 V

Operates efficiently at a low voltage, reducing power consumption.

Master Clock: 27 MHz

High master clock frequency enables fast data processing and image capture.

Body Width: 6.253 inch

Compact size makes it suitable for integration into various devices or systems.

Sensors or Transducers Type: IMAGE SENSOR, CMOS

CMOS sensor technology provides high image quality and low power consumption.

Minimum Operating Temperature: -30 °C

Can operate effectively in cold environments without any performance issues.

Frame Rate: 60 fps

High frame rate allows for smooth and fluid video recording or streaming.

Mounting Feature: SURFACE MOUNT

Surface mount design simplifies the installation process and allows for easy integration.

Technical Specifications

Image Sensors AR0330CM1C00SHKA0-CP attributes and parameters. Explore more Image Sensors devices from Onsemi

Specs

Additional Features:

ELECTRONIC ROLLING SHUTTER, IT ALSO OPERATES AT ANALOG SUPPLY VOLTAGE 2.7-2.9V

Array Type:

FRAME

Body Width:

6.253 inch

Body Height:

.745 mm

Body Length/Diameter:

6.623 mm

Dynamic Range:

69.5 dB

Frame Rate:

60 fps

Horizontal Pixel:

2304

Housing:

PLASTIC

JESD-609 Code:

e1

Master Clock:

27 MHz

Mounting Feature:

Maximum Operating Current:

137 mA

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-30 Cel

Optical Format (inch):

1/3

Output Interface Type:

2-WIRE INTERFACE

Output Range:

Output Type:

Package Shape or Style:

Pixel Size (um):

2.2X2.2

Sensitivity (V/lx.s):

2 V/lx.s

Sensors or Transducers Type:

Maximum Supply Voltage:

1.9 V

Minimum Supply Voltage:

1.7 V

Terminal Finish:

Tin/Silver/Copper (Sn/Ag/Cu)

Termination Type:

SOLDER

Vertical Pixel:

1296

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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