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AR0330CM1C12SHKA0-CR

Onsemi

AR0330CM1C12SHKA0-CR by Onsemi

Onsemi's AR0330CM1C12SHKA0-CR is a 1/3-inch CMOS image sensor with 2304x1296 pixels. It operates at -30 to 70 °C, with a dynamic range of 69.5 dB and output range of 0.40-1.40V. Ideal for applications requiring high-resolution imaging in varying light conditions, such as surveillance cameras or industrial machine vision systems.

Median Price

$14.262

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 6,000 parts In-Stock

1+ parts

-

100+ parts

$11.440

1k+ parts

$10.230

10k+ parts

$9.630

6,000

-

$11.440

$10.230

$9.630

DigiKey

USA . 6,000 parts In-Stock

1+ parts

-

100+ parts

$15.010

1k+ parts

-

10k+ parts

-

6,000

-

$15.010

-

-

Verical

USA . 6,000 parts In-Stock

1+ parts

-

100+ parts

$14.262

1k+ parts

$12.762

10k+ parts

$12.012

6,000

-

$14.262

$12.762

$12.012

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,482 parts In-Stock

1+ parts

$12.074

100+ parts

-

1k+ parts

-

10k+ parts

-

1,482

$12.074

-

-

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Vyrian

USA . 1,493 parts In-Stock

1+ parts

$12.710

100+ parts

-

1k+ parts

-

10k+ parts

-

1,493

$12.710

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 131 parts In-Stock

1+ parts

$0.192

100+ parts

-

1k+ parts

-

10k+ parts

$0.184

131

$0.192

-

-

$0.184

Northwest PG Solutions

USA . 1,160 parts In-Stock

1+ parts

$0.211

100+ parts

-

1k+ parts

-

10k+ parts

$0.186

1,160

$0.211

-

-

$0.186

Corphita

USA . 636 parts In-Stock

1+ parts

$11.439

100+ parts

-

1k+ parts

-

10k+ parts

-

636

$11.439

-

-

-

Corohmni

South Africa . 65 parts In-Stock

1+ parts

$12.710

100+ parts

-

1k+ parts

-

10k+ parts

-

65

$12.710

-

-

-

SupplyDigital Components

Austria . 6,730 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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6,730

-

-

-

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Problanco Electronics

Mexico . 3,269 parts In-Stock

1+ parts

-

100+ parts

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3,269

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TANS Electronics

Latvia . 2,886 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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2,886

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-

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Kepictronics

USA . 1,250 parts In-Stock

1+ parts

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1,250

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Kulean Microsystems

USA . 955 parts In-Stock

1+ parts

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955

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UHIMA Technologies

Türkiye . 461 parts In-Stock

1+ parts

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100+ parts

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461

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Formix International (Excess)

India . 360 parts In-Stock

1+ parts

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360

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Overview

Unlock the potential of your imaging projects with the AR0330CM1C12SHKA0-CR Image Sensor by Onsemi. As a leading manufacturer in the industry, Onsemi ensures top-notch quality and reliability in their products. This image sensor, with its high pixel resolution and wide dynamic range, is perfect for applications in surveillance systems, automotive cameras, and industrial imaging. Experience crisp and clear images with the AR0330CM1C12SHKA0-CR, enhancing the performance of your projects while providing exceptional value and benefits to customers. Elevate your imaging solutions with Onsemi's cutting-edge technology.

Feature Benefit Bullets

Pixel Size (um): 2.2X2.2

The small pixel size allows for detailed images with high resolution, making this image sensor suitable for applications requiring sharp and clear images.

Maximum Supply Voltage: 1.9 V

The low maximum supply voltage helps in reducing power consumption and heat generation, making this image sensor energy efficient.

Master Clock: 27 MHz

The high master clock speed enables fast data processing and image capture, making this image sensor suitable for applications requiring high-speed performance.

Horizontal Pixel: 2304

The high number of horizontal pixels allows for wide and detailed image capture, making this image sensor ideal for applications requiring high-resolution images.

Output Interface Type: 2-WIRE INTERFACE

The 2-wire interface simplifies the integration of this image sensor with other components, making it easier to use in various electronic devices.

Technical Specifications

Image Sensors AR0330CM1C12SHKA0-CR attributes and parameters. Explore more Image Sensors devices from Onsemi

Specs

Additional Features:

ELECTRONIC ROLLING SHUTTER, IT ALSO OPERATES AT ANALOG SUPPLY VOLTAGE 2.7-2.9V

Array Type:

FRAME

Body Width:

6.253 inch

Body Height:

.745 mm

Body Length/Diameter:

6.623 mm

Dynamic Range:

69.5 dB

Frame Rate:

60 fps

Horizontal Pixel:

2304

Housing:

PLASTIC

JESD-609 Code:

e1

Master Clock:

27 MHz

Mounting Feature:

Maximum Operating Current:

137 mA

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-30 Cel

Optical Format (inch):

1/3

Output Interface Type:

2-WIRE INTERFACE

Output Range:

Output Type:

Package Shape or Style:

Pixel Size (um):

2.2X2.2

Sensitivity (V/lx.s):

2 V/lx.s

Sensors or Transducers Type:

Maximum Supply Voltage:

1.9 V

Minimum Supply Voltage:

1.7 V

Terminal Finish:

Tin/Silver/Copper (Sn/Ag/Cu)

Termination Type:

SOLDER

Vertical Pixel:

1296

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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