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ASX342ATSC00XPED0-DR

Onsemi

ASX342ATSC00XPED0-DR by Onsemi

ASX342ATSC00XPED0-DR by Onsemi is an image sensor with 5.6x5.6 um pixel size, 27 MHz master clock, and 1/4 inch optical format. It operates at -40 to 105 °C and has a dynamic range of 87 dB. Ideal for applications requiring high-resolution imaging with a digital voltage output interface.

Median Price

$11.660

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 2,587 parts In-Stock

1+ parts

$11.660

100+ parts

$9.053

1k+ parts

$8.444

10k+ parts

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2,587

$11.660

$9.053

$8.444

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 439 parts In-Stock

1+ parts

$11.077

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-

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439

$11.077

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Vyrian

USA . 2,050 parts In-Stock

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$11.660

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2,050

$11.660

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Distributors (Availability)

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Native Components

USA . 63 parts In-Stock

1+ parts

$0.555

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63

$0.555

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Northwest PG Solutions

USA . 999 parts In-Stock

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$0.611

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999

$0.611

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Corphita

USA . 2,411 parts In-Stock

1+ parts

$10.494

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2,411

$10.494

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Corohmni

South Africa . 56 parts In-Stock

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$11.660

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56

$11.660

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Perfect Parts

USA . 20,317 parts In-Stock

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Authorized Procurement Solutions

USA . 7,500 parts In-Stock

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7,500

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TANS Electronics

Latvia . 7,484 parts In-Stock

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Kepictronics

USA . 5,000 parts In-Stock

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5,000

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Kulean Microsystems

USA . 3,664 parts In-Stock

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GreenTree Electronics

Israel . 3,624 parts In-Stock

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3,624

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Problanco Electronics

Mexico . 2,869 parts In-Stock

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Futuretech Components

Singapore . 2,600 parts In-Stock

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2,600

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SupplyDigital Components

Austria . 2,296 parts In-Stock

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RC Electronics

USA . 2,242 parts In-Stock

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UHIMA Technologies

Türkiye . 638 parts In-Stock

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638

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Overview

Elevate your imaging experience with the ASX342ATSC00XPED0-DR by Onsemi. As a leading manufacturer of image sensors, Onsemi delivers top-notch quality and cutting-edge technology in every product. The ASX342ATSC00XPED0-DR is perfect for a wide range of applications, offering unparalleled value and benefits to customers. Capture stunning images with ease and precision, thanks to the advanced features and superior performance of this image sensor. Upgrade your imaging system today and unlock endless possibilities with Onsemi's ASX342ATSC00XPED0-DR.

Feature Benefit Bullets

Pixel Size (um): 5.6X5.6

This small pixel size allows for higher resolution images to be captured with more detail.

Maximum Supply Voltage: 1.95 V

Provides a wide range of voltage input options for flexibility in usage.

Master Clock: 27 MHz

High master clock frequency enables fast data processing and image capture capabilities.

Body Width: 7.5 inch

Compact size allows for easy integration into various devices or systems.

Sensors or Transducers Type: IMAGE SENSOR,CMOS

CMOS image sensors are known for their low power consumption and high-quality image output.

Vertical Pixel: 560

Higher vertical pixel count enables better image resolution and quality.

Dynamic Range: 87 dB

Provides a wide dynamic range for capturing both bright and dark areas in an image accurately.

Output Interface Type: 2-WIRE INTERFACE

Allows for easy communication with other devices or systems without requiring complex interfaces.

Frame Rate: 60 fps

High frame rate allows for smooth video recording and fast-paced image capture.

Technical Specifications

Image Sensors ASX342ATSC00XPED0-DR attributes and parameters. Explore more Image Sensors devices from Onsemi

Specs

Additional Features:

IT ALSO HAVE ANALOG VOLTAGE FROM 2.66 TO 2.94V, ELECTRONIC ROLLING SHUTTER

Array Type:

FRAME

Body Width:

7.5 inch

Body Height:

1.28 mm

Body Length/Diameter:

7.5 mm

Data Rate:

27 Mbps

Dynamic Range:

87 dB

Frame Rate:

60 fps

Horizontal Pixel:

728

Housing:

PLASTIC

JESD-609 Code:

e1

Master Clock:

27 MHz

Mounting Feature:

Maximum Operating Current:

50 mA

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Optical Format (inch):

1/4

Output Interface Type:

2-WIRE INTERFACE

Output Range:

Output Type:

Package Shape or Style:

Pixel Size (um):

5.6X5.6

Sensors or Transducers Type:

Maximum Supply Voltage:

1.95 V

Minimum Supply Voltage:

1.7 V

Terminal Finish:

Tin/Silver/Copper (Sn/Ag/Cu)

Termination Type:

SOLDER

Vertical Pixel:

560

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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