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AR0522SRSM09SURA0-DP

Onsemi

AR0522SRSM09SURA0-DP by Onsemi

Onsemi's AR0522SRSM09SURA0-DP is a 12x1.62mm CMOS image sensor with 2592x1944 resolution, offering digital output via a 2-wire interface at 60fps. Ideal for surface mount applications, this sensor is housed in a plastic package and suitable for frame array imaging in various devices.

Median Price

$67.890

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

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DigiKey

USA . 1,087 parts In-Stock

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$27.780

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$22.174

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Chip1Stop

Japan . 4,775 parts In-Stock

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$108.000

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$50.800

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$33.800

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Digiode

USA . 217 parts In-Stock

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$26.391

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Vyrian

USA . 8,172 parts In-Stock

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Flip Electronics

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ComSIT Distribution GmbH

Germany . 56 parts In-Stock

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Northwest PG Solutions

USA . 1,866 parts In-Stock

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$3.168

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Corphita

USA . 1,290 parts In-Stock

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Corohmni

South Africa . 201 parts In-Stock

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Perfect Parts

USA . 25,486 parts In-Stock

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Kulean Microsystems

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TANS Electronics

Latvia . 4,987 parts In-Stock

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GreenTree Electronics

Israel . 4,875 parts In-Stock

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Authorized Procurement Solutions

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Problanco Electronics

Mexico . 4,221 parts In-Stock

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SupplyDigital Components

Austria . 1,271 parts In-Stock

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UHIMA Technologies

Türkiye . 514 parts In-Stock

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Native Components

USA . 145 parts In-Stock

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Overview

Capture every moment in stunning clarity with the AR0522SRSM09SURA0-DP image sensor from Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-notch quality and reliability. This CMOS image sensor boasts a high resolution of 2592 x 1944 pixels and a fast frame rate of 60 fps, making it perfect for applications such as surveillance cameras, automotive cameras, and industrial imaging. Experience exceptional value and performance with the AR0522SRSM09SURA0-DP, designed to exceed your expectations.

Feature Benefit Bullets

Body Width: 12 inch

The wide body width allows for better light capture and detection, resulting in high-quality image output.

Sensors or Transducers Type: IMAGE SENSOR, CMOS

CMOS sensors offer low power consumption and high sensitivity, making them ideal for capturing detailed images.

Body Height: 1.62 mm

The slim body height allows for compact integration into various devices without adding bulk.

Package Shape or Style: SQUARE

The square package shape provides a balanced design for easy installation and enhances overall aesthetics.

Horizontal Pixel: 2592

With a high horizontal pixel count, this sensor can capture images with excellent clarity and resolution.

Output Type: DIGITAL OUTPUT

Digital output simplifies data processing and transfer, ensuring compatibility with modern devices.

Housing: PLASTIC

The plastic housing offers durability and lightweight design, making it suitable for a wide range of applications.

Vertical Pixel: 1944

The vertical pixel count contributes to the sensor's ability to capture detailed and sharp images.

Body Length/Diameter: 12 mm

The compact body length allows for flexibility in installation and integration into various devices.

Optical Format (inch): 1/2.5

The optical format provides a good balance between sensor size and image quality, suitable for various applications.

Termination Type: SOLDER

Solder termination ensures secure and reliable connections for sustained performance.

Output Interface Type: 2-WIRE INTERFACE

The 2-wire interface simplifies connectivity and data transfer, enhancing user experience.

Frame Rate: 60 fps

The high frame rate enables smooth motion capture, making it suitable for applications requiring real-time imaging.

Array Type: FRAME

The frame array type allows for efficient image capture with high pixel density for detailed images.

Mounting Feature: SURFACE MOUNT

Surface mount capability offers easy and secure installation onto circuit boards, enhancing overall product reliability.

Technical Specifications

Image Sensors AR0522SRSM09SURA0-DP attributes and parameters. Explore more Image Sensors devices from Onsemi

Specs

Additional Features:

ROLLING SHUTTER

Array Type:

FRAME

Body Width:

12 inch

Body Height:

1.62 mm

Body Length/Diameter:

12 mm

Frame Rate:

60 fps

Horizontal Pixel:

2592

Housing:

PLASTIC

Mounting Feature:

Optical Format (inch):

1/2.5

Output Interface Type:

2-WIRE INTERFACE

Output Type:

Package Shape or Style:

Sensors or Transducers Type:

Termination Type:

SOLDER

Vertical Pixel:

1944

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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