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AR0543CSSC25SMW90

Onsemi

AR0543CSSC25SMW90 by Onsemi

The Onsemi AR0543CSSC25SMW90 image sensor features 2592x1944 pixels, 1.40um pixel size, and a 27 MHz master clock. Ideal for applications requiring high-resolution imaging with a max supply voltage of 1.25V and digital voltage output interface.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

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Digiode

USA . 951 parts In-Stock

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Kulean Microsystems

USA . 3,777 parts In-Stock

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SupplyDigital Components

Austria . 3,362 parts In-Stock

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Problanco Electronics

Mexico . 3,343 parts In-Stock

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TANS Electronics

Latvia . 2,344 parts In-Stock

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Native Components

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Northwest PG Solutions

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UHIMA Technologies

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Overview

Unlock the power of visual technology with the AR0543CSSC25SMW90 by Onsemi, a cutting-edge image sensor designed to deliver exceptional quality and reliability. Manufactured by industry leader Onsemi, this sensor is perfect for a variety of applications from security cameras to automotive systems. Offering a wide range of benefits including high resolution, low power consumption, and a compact design, this sensor provides unparalleled value for customers looking to enhance their imaging solutions. Trust Onsemi to bring you the latest in image sensor technology, and take your projects to the next level with the AR0543CSSC25SMW90.

Feature Benefit Bullets

Pixel Size (um): 1.40X1.40

Provides high resolution images with clear details.

Maximum Supply Voltage: 1.25 V

Efficient power usage and avoids damage from overvoltage.

Master Clock: 27 MHz

Enables fast processing and data transfer.

Body Width: 5.065 inch

Compact size for easy integration into devices.

Sensors or Transducers Type: IMAGE SENSOR,CMOS

CMOS technology offers high sensitivity and low noise.

Body Height: 0.7 mm

Slim profile for versatile mounting options.

Package Shape or Style: RECTANGULAR

Easy to handle and fit into designs.

Minimum Supply Voltage: 1.15 V

Low power consumption for prolonged battery life.

Maximum Operating Temperature: 70 °C

Can withstand high temperature environments.

Horizontal Pixel: 2592

Provides high resolution and sharp images.

Output Type: DIGITAL VOLTAGE

Readily compatible with digital systems.

Minimum Operating Temperature: -30 °C

Operates in cold temperatures without issues.

Maximum Operating Current: 44 mA

Efficient current usage for longer operation.

Dynamic Range: 66 dB

Captures a wide range of light intensities accurately.

Vertical Pixel: 1944

Complements the high horizontal pixel count for detailed images.

Body Length/Diameter: 5.256 mm

Compact size for easy integration into devices.

Optical Format (inch): 1/4

Standard format for compatibility with various lenses.

Data Rate: 840 Mbps

High data transfer speed for real-time image processing.

Termination Type: SOLDER

Secure and reliable connection for stable performance.

Output Interface Type: 2-WIRE INTERFACE

Simple interface for easy communication with other components.

Frame Rate: 15 fps

Decent frame rate for smooth video recording.

Array Type: FRAME

Organized pixel array structure for efficient image capture.

Sensitivity (V/lx.s): 0.82 V/lx.s

High sensitivity for capturing detailed images in low light.

Mounting Feature: SURFACE MOUNT

Easily mountable on PCBs for seamless integration.

Technical Specifications

Image Sensors AR0543CSSC25SMW90 attributes and parameters. Explore more Image Sensors devices from Onsemi

Specs

Additional Features:

ELECTRONIC ROLLING SHUTTER

Array Type:

FRAME

Body Width:

5.065 inch

Body Height:

.7 mm

Body Length/Diameter:

5.256 mm

Data Rate:

840 Mbps

Dynamic Range:

66 dB

Frame Rate:

15 fps

Horizontal Pixel:

2592

Master Clock:

27 MHz

Mounting Feature:

Maximum Operating Current:

44 mA

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-30 Cel

Optical Format (inch):

1/4

Output Interface Type:

2-WIRE INTERFACE

Output Type:

Package Shape or Style:

Pixel Size (um):

1.40X1.40

Sensitivity (V/lx.s):

.82 V/lx.s

Sensors or Transducers Type:

Maximum Supply Voltage:

1.25 V

Minimum Supply Voltage:

1.15 V

Termination Type:

SOLDER

Vertical Pixel:

1944

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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