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AR0542MBSC25SUD20

Onsemi

AR0542MBSC25SUD20 by Onsemi

The Onsemi AR0542MBSC25SUD20 is a CMOS image sensor with 2592x1944 pixels, 1.40um pixel size, and 66dB dynamic range. It operates at a max supply voltage of 1.9V and features a master clock of 27MHz. Ideal for applications requiring digital output interface, such as surveillance cameras and industrial imaging systems.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Digiode

USA . 1,458 parts In-Stock

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Vyrian

USA . 1,372 parts In-Stock

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Distributors (Availability)

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Native Components

USA . 882 parts In-Stock

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$0.354

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$0.339

882

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$0.339

Northwest PG Solutions

USA . 430 parts In-Stock

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$0.389

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$0.343

430

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$0.343

Problanco Electronics

Mexico . 5,997 parts In-Stock

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SupplyDigital Components

Austria . 3,609 parts In-Stock

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Corphita

USA . 1,800 parts In-Stock

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Kulean Microsystems

USA . 1,741 parts In-Stock

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TANS Electronics

Latvia . 1,257 parts In-Stock

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Corohmni

South Africa . 318 parts In-Stock

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UHIMA Technologies

Türkiye . 286 parts In-Stock

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Overview

Capture every moment in stunning clarity with the AR0542MBSC25SUD20 image sensor from Onsemi. Designed with precision and excellence, this sensor delivers unparalleled quality and performance. Perfect for a wide range of applications, this sensor is ideal for use in cameras, security systems, and industrial imaging equipment. Experience the value and benefits of this cutting-edge technology, bringing sharpness and detail to your images like never before. Elevate your projects with the advantages that only Onsemi can provide.

Feature Benefit Bullets

Pixel Size (um) 1.40X1.40

The small pixel size allows for high-resolution images with detailed clarity.

Maximum Supply Voltage 1.9 V

Efficient power usage with a low maximum supply voltage.

Master Clock 27 MHz

A high master clock speed enables fast signal processing and data transfer.

Sensors or Transducers Type IMAGE SENSOR,CMOS

CMOS sensors are known for low power consumption and high image quality.

Minimum Supply Voltage 1.7 V

Operates at a low minimum supply voltage for energy efficiency.

Horizontal Pixel 2592

High horizontal pixel count for sharp and detailed images.

Output Type DIGITAL VOLTAGE

Digital output simplifies data processing and integration with other systems.

Dynamic Range 66 dB

Wide dynamic range captures both bright and dark areas with clarity and detail.

Vertical Pixel 1944

High vertical pixel count for crisp and clear image reproduction.

Optical Format (inch) 1/4

Compact optical format suitable for various imaging applications.

Output Interface Type 2-WIRE INTERFACE

Simple and efficient 2-wire interface for easy connectivity and communication.

Frame Rate 15 fps

Decent frame rate suitable for capturing standard video footage.

Array Type FRAME

Array type frame construction enhances structural integrity and durability.

Technical Specifications

Image Sensors AR0542MBSC25SUD20 attributes and parameters. Explore more Image Sensors devices from Onsemi

Specs

Additional Features:

ELECTRONIC ROLLING SHUTTER, IT ALSO OPERATES AT ANALOG SUPPLY VOLTAGE 2.60-3.10V

Array Type:

FRAME

Dynamic Range:

66 dB

Frame Rate:

15 fps

Horizontal Pixel:

2592

Master Clock:

27 MHz

Optical Format (inch):

1/4

Output Interface Type:

2-WIRE INTERFACE

Output Type:

Pixel Size (um):

1.40X1.40

Sensors or Transducers Type:

Maximum Supply Voltage:

1.9 V

Minimum Supply Voltage:

1.7 V

Vertical Pixel:

1944

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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