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KLI-4104-RAA-CP-AA

Onsemi

KLI-4104-RAA-CP-AA by Onsemi

KLI-4104-RAA-CP-AA by Onsemi is an Image Sensor with 10x10 um pixel size, 60 dB dynamic range, and 30 Mbps data rate. It is ideal for applications requiring voltage output, such as industrial imaging systems or surveillance cameras.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 6,773 parts In-Stock

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Digiode

USA . 2,472 parts In-Stock

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AZTECH Wire

Italy . 681 parts In-Stock

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$12.650

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SupplyDigital Components

Austria . 6,829 parts In-Stock

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TANS Electronics

Latvia . 3,405 parts In-Stock

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Problanco Electronics

Mexico . 2,072 parts In-Stock

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Corphita

USA . 1,788 parts In-Stock

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Kulean Microsystems

USA . 1,423 parts In-Stock

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Corohmni

South Africa . 233 parts In-Stock

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UHIMA Technologies

Türkiye . 28 parts In-Stock

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Overview

Enhance your imaging applications with the high-quality KLI-4104-RAA-CP-AA image sensor by Onsemi. This cutting-edge device offers superior performance and reliability, thanks to Onsemi's renowned expertise in sensor technology. Ideal for a wide range of applications, this sensor provides exceptional value by delivering crisp images with a wide dynamic range. Elevate your projects with the precision and efficiency of the KLI-4104-RAA-CP-AA, setting new standards in image sensor technology.

Feature Benefit Bullets

Pixel Size (um): 10X10

Small pixel size allows for high resolution images to be captured with fine detail.

Maximum Supply Voltage: 15.5 V

Allows for flexibility in power supply options, accommodating a wide range of voltage inputs.

Body Width: 10.16 inch

Compact size makes it easy to integrate into various devices and systems.

Sensors or Transducers Type: IMAGE SENSOR,CCD

The use of CCD image sensor technology ensures high-quality image output with accurate color reproduction.

Body Height: 5.89 mm

Low profile design makes it suitable for applications with limited space constraints.

Package Shape or Style: RECTANGULAR

Rectangular shape offers easy mounting and integration into electronic devices.

Minimum Supply Voltage: 14.5 V

Allows for operation at lower voltage levels, increasing energy efficiency.

Maximum Operating Temperature: 70 °C

Wide operating temperature range ensures reliability in various environmental conditions.

Output Type: VOLTAGE OUTPUT

Voltage output simplifies interface with other electronic components for signal processing.

Minimum Operating Temperature: 0 °C

Operable in low-temperature environments, making it suitable for a wide range of applications.

Housing: CERAMIC

Ceramic material provides durability and protects the internal components from external factors.

Dynamic Range: 60 dB

High dynamic range allows for capturing both bright and dark areas in the same image without loss of detail.

Body Length/Diameter: 60.96 mm

Optimal size for fitting into various devices while still providing enough surface area for efficient heat dissipation.

Data Rate: 30 Mbps

High data rate enables quick transfer of image data for real-time processing and analysis.

Termination Type: SOLDER

Solder termination offers secure and reliable connection for long-term usage.

Array Type: LINEAR

Linear array configuration allows for capturing images with high spatial resolution along a single axis.

Mounting Feature: THROUGH HOLE MOUNT

Through-hole mounting provides stability and ease of installation in electronic circuit boards.

Technical Specifications

Image Sensors KLI-4104-RAA-CP-AA attributes and parameters. Explore more Image Sensors devices from Onsemi

Specs

Additional Features:

SENSITIVITY IS 11.5 MICRO VOLT PER ELECTRON LUMA, 14 MICRO VOLT PER ELECTRON CHROMA; IT ALSO HAVE PIXEL SIZE LUMA 5 X 5 UM

Array Type:

LINEAR

Body Width:

10.16 inch

Body Height:

5.89 mm

Body Length/Diameter:

60.96 mm

Data Rate:

30 Mbps

Dynamic Range:

60 dB

Housing:

CERAMIC

Mounting Feature:

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Output Type:

Package Shape or Style:

Pixel Size (um):

10X10

Sensors or Transducers Type:

Maximum Supply Voltage:

15.5 V

Minimum Supply Voltage:

14.5 V

Termination Type:

SOLDER

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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