Loading...

KLI-4104-DAA-CB-AE

Onsemi

KLI-4104-DAA-CB-AE by Onsemi

KLI-4104-DAA-CB-AE by Onsemi is an image sensor with 10x10 um pixel size, 4134 horizontal and vertical pixels. It operates b/w 0-70 °C, has a dynamic range of 60 dB, and outputs analog voltage in the range of 1.50-1.70V. This rectangular CCD sensor is ideal for applications requiring high-resolution imaging with a data rate of 30 Mbps.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 1,924 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,924

-

-

-

-

Digiode

USA . 1,524 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,524

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Kulean Microsystems

USA . 6,223 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,223

-

-

-

-

Problanco Electronics

Mexico . 2,842 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,842

-

-

-

-

Corphita

USA . 1,956 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,956

-

-

-

-

TANS Electronics

Latvia . 1,113 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,113

-

-

-

-

UHIMA Technologies

Türkiye . 767 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

767

-

-

-

-

SupplyDigital Components

Austria . 466 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

466

-

-

-

-

Corohmni

South Africa . 426 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

426

-

-

-

-

Overview

Capture every moment in stunning clarity with the KLI-4104-DAA-CB-AE Image Sensor by Onsemi. Manufactured by a trusted brand known for its top-quality products, this sensor offers unparalleled performance and reliability. Ideal for a wide range of applications, this sensor delivers crisp, high-resolution images with a wide dynamic range. Experience the value and benefits of superior image capture with the KLI-4104-DAA-CB-AE Image Sensor.

Feature Benefit Bullets

Pixel Size (um): 10X10

A smaller pixel size allows for higher resolution images to be captured, making this image sensor a good choice for detailed imaging applications.

Maximum Supply Voltage: 15.5 V

The higher maximum supply voltage allows for increased flexibility in power supply options, making this image sensor suitable for a variety of electronic systems.

Body Width: 10.16 inch

The compact body width of the image sensor makes it easy to integrate into different devices and systems without taking up too much space.

Sensors or Transducers Type: IMAGE SENSOR,CCD

Being a CCD image sensor, it offers high-quality imaging with low noise levels, making it ideal for applications where image accuracy is crucial.

Package Shape or Style: RECTANGULAR

The rectangular package shape makes the image sensor easy to handle and mount, improving the overall usability and integration of the product.

Minimum Supply Voltage: 14.5 V

The low minimum supply voltage requirement ensures efficient power consumption, making this image sensor a cost-effective choice for energy-efficient devices.

Maximum Operating Temperature: 70 °C

With a high maximum operating temperature, this image sensor can withstand a wide range of environmental conditions, making it suitable for use in various applications.

Output Range: 1.50-1.70V

The output voltage range provides a good signal-to-noise ratio, ensuring high-quality image outputs from the sensor.

Output Type: ANALOG VOLTAGE

An analog voltage output allows for easy interfacing with other analog systems, making this image sensor versatile and compatible with a wide range of applications.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature ensures reliable performance in cold environments, making this image sensor suitable for outdoor or industrial applications.

Housing: CERAMIC

The ceramic housing provides excellent durability and thermal stability, ensuring long-term reliability of the image sensor in harsh operating conditions.

Dynamic Range: 60 dB

A high dynamic range allows the image sensor to capture a wide range of light intensities accurately, making it ideal for applications requiring detailed image reproduction.

Data Rate: 30 Mbps

With a high data rate, this image sensor can capture and transmit data quickly, making it suitable for real-time imaging and high-speed applications.

Array Type: LINEAR

A linear array type allows for precise image capture with minimal distortion, making this image sensor a good choice for applications requiring accurate linear imaging.

Mounting Feature: THROUGH HOLE MOUNT

The through hole mounting feature makes it easy to install and secure the image sensor in place, ensuring stable operation and reliable performance.

Technical Specifications

Image Sensors KLI-4104-DAA-CB-AE attributes and parameters. Explore more Image Sensors devices from Onsemi

Specs

Additional Features:

SENSITIVITY IS 14 UV/ELECTRON

Array Type:

LINEAR

Body Width:

10.16 inch

Body Height:

3.81 mm

Body Length/Diameter:

60.96 mm

Data Rate:

30 Mbps

Dynamic Range:

60 dB

Horizontal Pixel:

4134

Housing:

CERAMIC

Mounting Feature:

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Output Range:

Output Type:

Package Shape or Style:

Pixel Size (um):

10X10

Sensors or Transducers Type:

Maximum Supply Voltage:

15.5 V

Minimum Supply Voltage:

14.5 V

Termination Type:

SOLDER

Vertical Pixel:

4134

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 20