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KLI-4104-DAA-CB-AA

Onsemi

KLI-4104-DAA-CB-AA by Onsemi

KLI-4104-DAA-CB-AA by Onsemi is an Image Sensor with 10x10 um pixel size, 4134 horizontal and vertical pixels. It operates b/w 0-70 °C, has a dynamic range of 60 dB, and outputs analog voltage in the range of 1.50-1.70V. This rectangular CCD sensor is ideal for applications requiring high-resolution imaging such as industrial machine vision systems or medical imaging devices.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 1,744 parts In-Stock

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Digiode

USA . 315 parts In-Stock

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TANS Electronics

Latvia . 4,262 parts In-Stock

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Problanco Electronics

Mexico . 3,689 parts In-Stock

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Kulean Microsystems

USA . 1,795 parts In-Stock

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Corphita

USA . 1,080 parts In-Stock

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SupplyDigital Components

Austria . 1,024 parts In-Stock

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Corohmni

South Africa . 261 parts In-Stock

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UHIMA Technologies

Türkiye . 7 parts In-Stock

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Overview

Capture every moment with the KLI-4104-DAA-CB-AA by Onsemi, a cutting-edge image sensor that delivers unparalleled quality and precision. Manufactured by industry leader Onsemi, this sensor promises reliability and innovation in every frame. Ideal for a wide range of applications, from surveillance systems to medical imaging, this sensor offers customers unmatched value and benefits. Say goodbye to blurry images and hello to crystal-clear detail with the KLI-4104-DAA-CB-AA - your perfect choice for all your imaging needs.

Feature Benefit Bullets

Pixel Size (um): 10X10

The small pixel size allows for high resolution images with detailed information.

Maximum Supply Voltage: 15.5 V

Allows for a wide operating range and flexibility in power supply options.

Body Width: 10.16 inch

Compact design makes it easy to integrate into various systems or devices.

Sensors or Transducers Type: IMAGE SENSOR, CCD

CCD sensors provide high-quality image capture with low noise levels, making it ideal for applications requiring precise imaging.

Package Shape or Style: RECTANGULAR

Standard rectangular shape for easy mounting and integration.

Minimum Supply Voltage: 14.5 V

Ensures the sensor operates efficiently even at lower power supply levels.

Maximum Operating Temperature: 70 °C

Can withstand high temperature environments without compromising performance.

Output Range: 1.50-1.70V

Consistent output range for accurate image processing and analysis.

Output Type: ANALOG VOLTAGE

Analog output allows for easy interface with other systems or devices.

Minimum Operating Temperature: 0 °C

Operates effectively in low temperature conditions.

Housing: CERAMIC

Durable ceramic housing ensures longevity and protection for the sensor.

Dynamic Range: 60 dB

Wide dynamic range for capturing both bright and dark areas in an image.

Data Rate: 30 Mbps

High data rate for fast image transfer and processing.

Array Type: LINEAR

Linear array configuration for capturing images with uniform resolution.

Mounting Feature: THROUGH HOLE MOUNT

Secure mounting option for stability and reliability in different applications.

Technical Specifications

Image Sensors KLI-4104-DAA-CB-AA attributes and parameters. Explore more Image Sensors devices from Onsemi

Specs

Additional Features:

SENSITIVITY IS 14 UV/ELECTRON

Array Type:

LINEAR

Body Width:

10.16 inch

Body Height:

3.81 mm

Body Length/Diameter:

60.96 mm

Data Rate:

30 Mbps

Dynamic Range:

60 dB

Horizontal Pixel:

4134

Housing:

CERAMIC

Mounting Feature:

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Output Range:

Output Type:

Package Shape or Style:

Pixel Size (um):

10X10

Sensors or Transducers Type:

Maximum Supply Voltage:

15.5 V

Minimum Supply Voltage:

14.5 V

Termination Type:

SOLDER

Vertical Pixel:

4134

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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