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TC285SPD-30

Texas Instruments

TC285SPD-30 by Texas Instruments

TC285SPD-30 by Texas Instruments is an image sensor with 8x8 um pixel size, 1004 horizontal pixels, and 1002 vertical pixels. Operating at temperatures from -10 to 55 °C, it requires a power supply of 14V. Ideal for applications requiring high-resolution imaging in various environments.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 2,122 parts In-Stock

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Digiode

USA . 603 parts In-Stock

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603

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,579 parts In-Stock

1+ parts

$1.556

100+ parts

-

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$2.202

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1,579

$1.556

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$2.202

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DigiPath Technology Company

USA . 1,295 parts In-Stock

1+ parts

$1.713

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1,295

$1.713

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ChromeModa Solutions

Germany . 5,706 parts In-Stock

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$1.748

100+ parts

$1.433

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5,706

$1.748

$1.433

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IDEA Electronic Components Group

UK . 1,943 parts In-Stock

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$1.748

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$1.573

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1,943

$1.748

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$1.573

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AZTECH Wire

Italy . 199 parts In-Stock

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$5.002

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199

$5.002

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Semicontronic

India . 182 parts In-Stock

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$5.750

100+ parts

$5.606

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$5.578

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182

$5.750

$5.606

$5.578

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One Stop Electronics

USA . 478 parts In-Stock

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$6.750

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478

$6.750

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Ampacity Inc.

Singapore . 935 parts In-Stock

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$34.750

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935

$34.750

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Corphita

USA . 3,526 parts In-Stock

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Corohmni

South Africa . 400 parts In-Stock

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Overview

Experience the superior quality and reliability of Texas Instruments with the TC285SPD-30 Image Sensor. This cutting-edge technology offers unmatched precision and performance, making it ideal for a wide range of applications. From industrial automation to security systems, this sensor provides clear and accurate image capture in any environment. Trust Texas Instruments to deliver value, benefits, and advantages that exceed your expectations. Upgrade your projects with the TC285SPD-30 and see the difference for yourself.

Feature Benefit Bullets

Pixel Size (um): 8X8

With a small pixel size of 8X8 um, this image sensor can capture fine details and provide high resolution images with clarity.

Power Supplies (V): 14

Operating at a low power supply of 14V, this image sensor is energy-efficient and helps in reducing power consumption in electronic devices.

Maximum Operating Temperature: 55 °C

With a maximum operating temperature of 55°C, this image sensor can withstand high temperatures and perform reliably in various environmental conditions.

Horizontal Pixel: 1004

Having a high horizontal pixel count of 1004, this image sensor offers wide coverage and ensures detailed horizontal image capture.

Minimum Operating Temperature: -10 °C

With a minimum operating temperature of -10°C, this image sensor can function effectively in cold weather conditions without any performance issues.

Vertical Pixel: 1002

The vertical pixel count of 1002 ensures comprehensive coverage and sharp image quality in the vertical direction, making this image sensor suitable for various imaging applications.

Mounting Feature: THROUGH HOLE MOUNT

The through-hole mounting feature simplifies the installation process and provides a secure and stable mounting for this image sensor in electronic devices.

Technical Specifications

Image Sensors TC285SPD-30 attributes and parameters. Explore more Image Sensors devices from Texas Instruments

Specs

Horizontal Pixel:

1004

Mounting Feature:

Maximum Operating Temperature:

55 Cel

Minimum Operating Temperature:

-10 Cel

Pixel Size (um):

8X8

Power Supplies (V):

14

Sub-Category:

CCD Image Sensors

Vertical Pixel:

1002

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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