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TC241-80

Texas Instruments

TC241-80 by Texas Instruments

TC241-80 by Texas Instruments is an image sensor with 754x244 pixels, pixel size of 11.5x27 um, and operates at temperatures from -10 to 45 °C. It requires a power supply of 12V and features THROUGH HOLE MOUNT for easy installation. Ideal for applications requiring high-resolution imaging in various environments.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 5,223 parts In-Stock

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Digiode

USA . 2,600 parts In-Stock

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2,600

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Distributors (Availability)

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Parana Technologies

USA . 1,424 parts In-Stock

1+ parts

$1.655

100+ parts

-

1k+ parts

$2.266

10k+ parts

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1,424

$1.655

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$2.266

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DigiPath Technology Company

USA . 1,293 parts In-Stock

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$1.823

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$1.823

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IDEA Electronic Components Group

UK . 1,279 parts In-Stock

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$1.860

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$1.674

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1,279

$1.860

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$1.674

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ChromeModa Solutions

Germany . 343 parts In-Stock

1+ parts

$1.860

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$1.525

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343

$1.860

$1.525

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Semicontronic

India . 534 parts In-Stock

1+ parts

$7.750

100+ parts

$7.556

1k+ parts

$7.518

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534

$7.750

$7.556

$7.518

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AZTECH Wire

Italy . 757 parts In-Stock

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$18.486

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757

$18.486

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One Stop Electronics

USA . 1,345 parts In-Stock

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$26.750

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$26.750

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Ampacity Inc.

Singapore . 479 parts In-Stock

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$31.750

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479

$31.750

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Corphita

USA . 604 parts In-Stock

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Corohmni

South Africa . 443 parts In-Stock

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Overview

Experience exceptional image quality with the TC241-80 by Texas Instruments, a leading manufacturer in the industry. Perfect for various applications in image sensors, this product offers unparalleled value and benefits to customers. With its advanced technology and reliable performance, this sensor ensures high-quality images and precise data capture. Upgrade your imaging system today with the TC241-80 and enjoy the advantages it brings to your projects.

Feature Benefit Bullets

Pixel Size (um): 11.5X27

A larger pixel size allows for more light to be captured, resulting in higher image quality and better low-light performance.

Power Supplies (V): 12

A standard power supply requirement of 12V makes it easy to integrate into existing systems without the need for additional power sources.

Maximum Operating Temperature: 45 °C

With a high maximum operating temperature of 45°C, this sensor can withstand harsh environmental conditions without compromising performance.

Horizontal Pixel: 754

A high horizontal pixel count of 754 ensures detailed and high-resolution images, making it suitable for applications that require precise image capture.

Minimum Operating Temperature: -10 °C

The low minimum operating temperature of -10°C allows this sensor to be used in a wide range of environments, including cold temperatures.

Vertical Pixel: 244

The vertical pixel count of 244 provides a good balance between resolution and processing speed, making it a versatile choice for various applications.

Mounting Feature: THROUGH HOLE MOUNT

The through-hole mounting feature simplifies the installation process and ensures secure attachment, making it suitable for applications where stability is crucial.

Technical Specifications

Image Sensors TC241-80 attributes and parameters. Explore more Image Sensors devices from Texas Instruments

Specs

Horizontal Pixel:

754

Mounting Feature:

Maximum Operating Temperature:

45 Cel

Minimum Operating Temperature:

-10 Cel

Pixel Size (um):

11.5X27

Power Supplies (V):

12

Sub-Category:

CCD Image Sensors

Vertical Pixel:

244

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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