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CYIL1SE3000AA-GZDC

Cypress Semiconductor

CYIL1SE3000AA-GZDC by Cypress Semiconductor

IMAGE SENSOR,CMOS; Mounting Feature: THROUGH HOLE MOUNT; Output Type: DIGITAL OUTPUT; Package Shape or Style: RECTANGULAR; Housing: CERAMIC; Minimum Operating Temperature: 0 Cel;

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Digiode

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Technical Specifications

Image Sensors CYIL1SE3000AA-GZDC attributes and parameters. Explore more Image Sensors devices from Cypress Semiconductor

Specs

Additional Features:

ITS ALSO OPERATES 2.5V

Array Type:

FULL FRAME

Body Width:

27 inch

Body Height:

4.3 mm

Body Length/Diameter:

31 mm

Dynamic Range:

80 dB

Frame Rate:

485 fps

Horizontal Pixel:

1696

Housing:

CERAMIC

Master Clock:

206 MHz

Mounting Feature:

Maximum Operating Temperature:

60 Cel

Minimum Operating Temperature:

0 Cel

Optical Format (inch):

1

Output Type:

Package Shape or Style:

Pixel Size (um):

8X8

Sensors or Transducers Type:

Maximum Supply Voltage:

3.465 V

Minimum Supply Voltage:

3.135 V

Termination Type:

SOLDER

Vertical Pixel:

1710

Manufacturer Highlights

Cypress Semiconductor

Cypress Semiconductor was an American semiconductor design and manufacturing company. It offered NOR flash memories, F-RAM and SRAM Traveo microcontrollers, PSoC programmable system-on-chip solutions, analog and PMIC Power Management ICs, CapSense capacitive touch-sensing controllers, Wireless BLE Bluetooth Low-Energy and USB connectivity solutions. Its headquarters were in San Jose, California, with operations in the United States, Ireland, India and the Philippines. In April 2016, Cypress Semiconductors announced the acquisition of Broadcom’s Wireless Internet of Things Business. The deal was closed in July 2016. In June 2019, Infineon Technologies announced it would acquire Cypress for $9.4 billion.The deal closed in April 2020, making Infineon one of the world's top 10 semiconductor manufacturers. Some of its main competitors included Microchip Technology, NXP Semiconductors, Renesas Electronics and Micron Technology.

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