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KAF-37500-NXA-JH-AA

Onsemi

KAF-37500-NXA-JH-AA by Onsemi

The Onsemi KAF-37500-NXA-JH-AA is a 6x6 um pixel size image sensor with 7500 horizontal and 5000 vertical pixels. It operates b/w 0 to 60 °C, with a dynamic range of 69.3 dB. Ideal for applications requiring high-resolution imaging in industrial or scientific settings.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Digiode

USA . 1,738 parts In-Stock

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Vyrian

USA . 1,608 parts In-Stock

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Problanco Electronics

Mexico . 6,383 parts In-Stock

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SupplyDigital Components

Austria . 5,943 parts In-Stock

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Corphita

USA . 1,364 parts In-Stock

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Kulean Microsystems

USA . 1,340 parts In-Stock

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TANS Electronics

Latvia . 829 parts In-Stock

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UHIMA Technologies

Türkiye . 806 parts In-Stock

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Corohmni

South Africa . 122 parts In-Stock

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Overview

Elevate your imaging solutions with the KAF-37500-NXA-JH-AA by Onsemi. As a leading manufacturer in image sensors, Onsemi guarantees top-notch quality and reliability. This CCD image sensor boasts a high pixel count and wide dynamic range, making it perfect for a variety of applications such as industrial inspection, surveillance, and medical imaging. With its advanced features and superior performance, this product offers unmatched value and benefits to customers seeking exceptional image capture capabilities. Elevate your imaging solutions with Onsemi's KAF-37500-NXA-JH-AA.

Feature Benefit Bullets

Pixel Size (um): 6X6

Small pixel size allows for high resolution images and detailed photographs.

Maximum Supply Voltage: 15.5 V

Allows for a wide range of voltage inputs, making it versatile and compatible with various systems.

Body Width: 40.5 inch

Compact size makes it easy to integrate into different devices and equipment.

Sensors or Transducers Type: IMAGE SENSOR,CCD

CCD sensors are known for high image quality and low noise, making this product suitable for high-end imaging applications.

Body Height: 1.7 mm

Low profile design allows for flexibility in installation and placement within devices.

Package Shape or Style: RECTANGULAR

Traditional and commonly used packaging style for image sensors, ensuring compatibility with existing systems.

Minimum Supply Voltage: 14.5 V

Relatively low minimum supply voltage helps in reducing power consumption and increasing efficiency.

Maximum Operating Temperature: 60 °C

High maximum operating temperature allows for use in various environments and conditions without compromising performance.

Horizontal Pixel: 7500

High horizontal pixel count results in sharp and detailed images with accurate color representation.

Minimum Operating Temperature: 0 °C

Wide operating temperature range makes this product suitable for use in both indoor and outdoor settings.

Dynamic Range: 69.3 dB

High dynamic range ensures that the sensor can capture a wide range of light intensities, resulting in well-exposed images.

Vertical Pixel: 5000

High vertical pixel count allows for capturing detailed images with good depth and clarity.

Body Length/Diameter: 60.5 mm

Compact and ergonomic design makes this sensor easy to handle and install in various devices.

Termination Type: SOLDER

Solder termination provides a secure and reliable connection to the circuit board, ensuring stable performance.

Array Type: FULL FRAME

Full frame array design allows for maximum light capture and efficient image processing, resulting in high-quality images.

Mounting Feature: THROUGH HOLE MOUNT

Through hole mounting feature provides secure attachment to the circuit board and ensures stability during operation.

Technical Specifications

Image Sensors KAF-37500-NXA-JH-AA attributes and parameters. Explore more Image Sensors devices from Onsemi

Specs

Additional Features:

IT ALSO HAVE ESTIMATED LINEAR DYNAMIC RANGE 68.4 DB

Array Type:

FULL FRAME

Body Width:

40.5 inch

Body Height:

1.7 mm

Body Length/Diameter:

60.5 mm

Dynamic Range:

69.3 dB

Horizontal Pixel:

7500

Mounting Feature:

Maximum Operating Temperature:

60 Cel

Minimum Operating Temperature:

0 Cel

Package Shape or Style:

Pixel Size (um):

6X6

Sensors or Transducers Type:

Maximum Supply Voltage:

15.5 V

Minimum Supply Voltage:

14.5 V

Termination Type:

SOLDER

Vertical Pixel:

5000

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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