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KAF-16200-ABA-CD-AE

Onsemi

KAF-16200-ABA-CD-AE by Onsemi

The Onsemi KAF-16200-ABA-CD-AE is a CCD image sensor with 6x6 um pixel size, offering 4500 horizontal and 3600 vertical pixels. With a dynamic range of 69.3 dB, it operates b/w 0 to 60 °C and requires a min supply voltage of 14.5 V. This rectangular sensor housed in ceramic is ideal for high-resolution imaging applications requiring precise color reproduction and low light sensitivity.

Median Price

$2,326.887

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 1 parts In-Stock

1+ parts

$1,861.510

100+ parts

$1,749.820

1k+ parts

$1,638.130

10k+ parts

-

1

$1,861.510

$1,749.820

$1,638.130

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Verical

USA . 1 parts In-Stock

1+ parts

$2,326.887

100+ parts

$2,187.275

1k+ parts

$2,047.662

10k+ parts

-

1

$2,326.887

$2,187.275

$2,047.662

-

DigiKey

USA . 1 parts In-Stock

1+ parts

$2,326.890

100+ parts

-

1k+ parts

-

10k+ parts

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1

$2,326.890

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-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,099 parts In-Stock

1+ parts

$2,058.498

100+ parts

-

1k+ parts

-

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2,099

$2,058.498

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Vyrian

USA . 3,353 parts In-Stock

1+ parts

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3,353

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DigiKey Marketplace

USA . 1 parts In-Stock

1+ parts

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1

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 2,054 parts In-Stock

1+ parts

$1,950.156

100+ parts

-

1k+ parts

-

10k+ parts

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2,054

$1,950.156

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-

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Corohmni

South Africa . 379 parts In-Stock

1+ parts

$2,166.840

100+ parts

-

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379

$2,166.840

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TANS Electronics

Latvia . 7,957 parts In-Stock

1+ parts

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7,957

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Kulean Microsystems

USA . 4,573 parts In-Stock

1+ parts

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4,573

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Problanco Electronics

Mexico . 4,377 parts In-Stock

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4,377

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SupplyDigital Components

Austria . 2,522 parts In-Stock

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2,522

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UHIMA Technologies

Türkiye . 104 parts In-Stock

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104

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Overview

Elevate your imaging experience with the KAF-16200-ABA-CD-AE image sensor by Onsemi. Crafted with meticulous attention to detail, this CCD sensor offers unrivaled quality and performance in capturing crystal-clear images. Ideal for a wide range of applications, from industrial inspection to scientific research, this sensor delivers exceptional results every time. Trust in Onsemi's expertise in image sensor technology and invest in the KAF-16200-ABA-CD-AE for unparalleled value, benefits, and advantages that will take your projects to the next level.

Feature Benefit Bullets

Pixel Size (um): 6X6

Smaller pixel size allows for higher resolution images to be captured, resulting in clearer and more detailed pictures.

Body Width: 35.81 inch

Compact size makes the sensor easy to integrate into various devices without taking up too much space.

Sensors or Transducers Type: IMAGE SENSOR,CCD

CCD sensors are known for their high-quality image capture capabilities, making this sensor ideal for applications requiring precision imaging.

Body Height: 4.92 mm

Low profile design allows for a slim device form factor and enables flexible placement options.

Package Shape or Style: RECTANGULAR

Rectangular shape makes it easier to mount and align the sensor in various applications.

Minimum Supply Voltage: 14.5 V

Requires a relatively low supply voltage, which helps in reducing power consumption and extending the battery life of the device.

Maximum Operating Temperature: 60 °C

Can operate efficiently within a wide temperature range, making it suitable for use in different environments and conditions.

Horizontal Pixel: 4500

High horizontal pixel count enables the sensor to capture wide-angle images with excellent resolution and detail.

Minimum Operating Temperature: 0 °C

Can still function effectively at low temperatures, ensuring reliable performance even in cold environments.

Housing: CERAMIC

Ceramic housing provides durability and thermal stability, protecting the sensor from external factors and ensuring consistent performance.

Dynamic Range: 69.3 dB

Wide dynamic range allows the sensor to capture both bright and dark areas in the scene accurately, resulting in high-quality images with minimal noise.

Vertical Pixel: 3600

High vertical pixel count enables the sensor to capture detailed images with fine resolution and sharpness.

Body Length/Diameter: 38.6 mm

Compact body length/diameter makes the sensor easy to install and integrate into different devices or systems.

Data Rate: 24 Mbps

High data rate allows for fast and efficient transfer of image data, ensuring real-time image processing and analysis.

Termination Type: SOLDER

Solder termination provides reliable and secure connections, ensuring stable and consistent performance of the sensor in various applications.

Array Type: FULL FRAME

Full frame array type enables the sensor to capture the entire scene without cropping or distortion, making it ideal for applications requiring a wide field of view.

Mounting Feature: THROUGH HOLE MOUNT

Through hole mounting feature offers secure and stable installation, allowing the sensor to be easily mounted on circuit boards or other surfaces.

Technical Specifications

Image Sensors KAF-16200-ABA-CD-AE attributes and parameters. Explore more Image Sensors devices from Onsemi

Specs

Additional Features:

IT HAS A SENSITIVITY OF 31 MICRO VOLT PER ELECTRON

Array Type:

FULL FRAME

Body Width:

35.81 inch

Body Height:

4.92 mm

Body Length/Diameter:

38.6 mm

Data Rate:

24 Mbps

Dynamic Range:

69.3 dB

Horizontal Pixel:

4500

Housing:

CERAMIC

Mounting Feature:

Maximum Operating Temperature:

60 Cel

Minimum Operating Temperature:

0 Cel

Package Shape or Style:

Pixel Size (um):

6X6

Sensors or Transducers Type:

Minimum Supply Voltage:

14.5 V

Termination Type:

SOLDER

Vertical Pixel:

3600

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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