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KAI-2020-ABA-CD-AE

Onsemi

KAI-2020-ABA-CD-AE by Onsemi

KAI-2020-ABA-CD-AE by Onsemi is an image sensor with 7.4x7.4 um pixel size, 1600 horizontal pixels, and 1200 vertical pixels. It has a dynamic range of 60 dB and outputs analog voltage data at a rate of 40 Mbps. This rectangular CCD sensor is suitable for applications requiring high-quality imaging in industrial or scientific settings.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 1,384 parts In-Stock

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Digiode

USA . 1,346 parts In-Stock

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TANS Electronics

Latvia . 4,688 parts In-Stock

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Problanco Electronics

Mexico . 4,349 parts In-Stock

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SupplyDigital Components

Austria . 1,888 parts In-Stock

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Corphita

USA . 1,112 parts In-Stock

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Corohmni

South Africa . 480 parts In-Stock

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Kulean Microsystems

USA . 476 parts In-Stock

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UHIMA Technologies

Türkiye . 116 parts In-Stock

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Overview

Experience superior image quality and performance with the KAI-2020-ABA-CD-AE by Onsemi. As a trusted manufacturer in the industry, Onsemi's image sensors are known for their reliability and precision. Ideal for a wide range of applications such as industrial imaging and surveillance, this CCD sensor offers a high dynamic range and fast data rate, ensuring crisp and clear images every time. Trust in Onsemi to deliver top-notch quality and innovation with the KAI-2020-ABA-CD-AE.

Feature Benefit Bullets

Pixel Size (um) 7.4X7.4

The small pixel size allows for high resolution images to be captured with fine detail.

Maximum Supply Voltage 15.5 V

Higher supply voltage ensures stable and efficient operation of the image sensor.

Body Width 20.32 inch

Compact body width makes it suitable for various applications where space is limited.

Sensors or Transducers Type IMAGE SENSOR,CCD

CCD image sensor type provides high-quality and low-noise images, ideal for professional applications.

Body Height 4.44 mm

Low body height allows for easy integration into slim devices or camera modules.

Package Shape or Style RECTANGULAR

Rectangular package shape provides easy mounting and alignment in electronic systems.

Minimum Supply Voltage 14.5 V

Low minimum supply voltage helps in reducing power consumption and heat generation.

Horizontal Pixel 1600

High horizontal pixel count enables capturing wide and detailed images with rich color accuracy.

Output Type ANALOG VOLTAGE

Analog voltage output simplifies interfacing with other analog processing circuits.

Dynamic Range 60 dB

Wide dynamic range allows for capturing both dark and bright regions in the same scene with details preserved.

Vertical Pixel 1200

High vertical pixel count ensures good image resolution in the vertical direction.

Body Length/Diameter 33.02 mm

A moderate body length/diameter ratio provides a balance between compact size and functionality.

Data Rate 40 Mbps

High data rate enables fast image transfer and processing, ideal for real-time applications.

Termination Type SOLDER

Solder termination ensures secure and reliable electrical connections with other components.

Array Type INTERLINE

Interline array type offers high-speed readout and reduced image lag for capturing fast-moving objects.

Mounting Feature THROUGH HOLE MOUNT

Through hole mounting feature provides sturdy mechanical support and easy assembly on PCBs or camera modules.

Technical Specifications

Image Sensors KAI-2020-ABA-CD-AE attributes and parameters. Explore more Image Sensors devices from Onsemi

Specs

Additional Features:

SENSITIVITY IS 30 UV/ELECTRON

Array Type:

INTERLINE

Body Width:

20.32 inch

Body Height:

4.44 mm

Body Length/Diameter:

33.02 mm

Data Rate:

40 Mbps

Dynamic Range:

60 dB

Horizontal Pixel:

1600

Mounting Feature:

Output Type:

Package Shape or Style:

Pixel Size (um):

7.4X7.4

Sensors or Transducers Type:

Maximum Supply Voltage:

15.5 V

Minimum Supply Voltage:

14.5 V

Termination Type:

SOLDER

Vertical Pixel:

1200

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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