Loading...

KAI-02150-QBA-FD-BA

Onsemi

KAI-02150-QBA-FD-BA by Onsemi

Onsemi's KAI-02150-QBA-FD-BA is a 2/3 inch CCD image sensor with 1920x1080 pixels, 5.5um pixel size, and 64dB dynamic range. It operates b/w -50 to 70 °C, suitable for surface mount applications in various imaging systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,342 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,342

-

-

-

-

Digiode

USA . 1,055 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,055

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 1,004 parts In-Stock

1+ parts

$9.510

100+ parts

-

1k+ parts

-

10k+ parts

-

1,004

$9.510

-

-

-

Kulean Microsystems

USA . 7,460 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,460

-

-

-

-

SupplyDigital Components

Austria . 5,683 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,683

-

-

-

-

Problanco Electronics

Mexico . 3,505 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,505

-

-

-

-

TANS Electronics

Latvia . 2,322 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,322

-

-

-

-

Corphita

USA . 1,713 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,713

-

-

-

-

Corohmni

South Africa . 481 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

481

-

-

-

-

UHIMA Technologies

Türkiye . 255 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

255

-

-

-

-

Overview

Unlock a world of crystal-clear imaging with the KAI-02150-QBA-FD-BA by Onsemi. As a leading manufacturer in the industry, Onsemi guarantees top-notch quality and reliability in their image sensors. Perfect for applications in surveillance, industrial inspection, and medical imaging, this CCD sensor offers unmatched performance and precision. Experience the value of sharp, detailed images with the KAI-02150-QBA-FD-BA, providing customers with cutting-edge technology and superior results every time.

Feature Benefit Bullets

Pixel Size (um): 5.5X5.5

Smaller pixel size allows for higher resolution images and better low-light performance.

Maximum Supply Voltage: 15.5 V

Higher maximum supply voltage allows for better signal-to-noise ratio and overall performance.

Sensors or Transducers Type: IMAGE SENSOR,CCD

CCD sensors are known for their high image quality and low noise performance, making this product a good choice for high-quality imaging applications.

Package Shape or Style: RECTANGULAR

Rectangular package shape allows for easy integration into various devices and systems.

Minimum Supply Voltage: 14.5 V

Lower minimum supply voltage allows for energy-efficient operation.

Maximum Operating Temperature: 70 °C

Wide operating temperature range allows for operation in various environments.

Horizontal Pixel: 1920

Higher number of horizontal pixels allows for detailed images with high resolution.

Minimum Operating Temperature: -50 °C

Wide operating temperature range allows for operation in extreme cold conditions.

Housing: CERAMIC

Ceramic housing provides durability and heat resistance for long-term use.

Dynamic Range: 64 dB

High dynamic range allows for capturing both dark and bright areas in the same scene without losing details.

Vertical Pixel: 1080

Higher number of vertical pixels allows for capturing detailed images with good depth.

Optical Format (inch): 2/3

2/3 inch optical format is a popular standard size for image sensors, making this product versatile and compatible with many systems.

Termination Type: SOLDER

Solder termination provides secure and reliable connection for long-term use.

Array Type: INTERLINE

Interline array type allows for faster readout speeds and reduced image lag, making this product suitable for high-speed imaging applications.

Mounting Feature: SURFACE MOUNT

Surface mounting feature allows for easy installation on PCBs and compact designs.

Technical Specifications

Image Sensors KAI-02150-QBA-FD-BA attributes and parameters. Explore more Image Sensors devices from Onsemi

Specs

Additional Features:

IT HAS OUTPUT SENSITIVITY OF 34 MICRO VOLT PER ELECTRON

Array Type:

INTERLINE

Dynamic Range:

64 dB

Horizontal Pixel:

1920

Housing:

CERAMIC

Mounting Feature:

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-50 Cel

Optical Format (inch):

2/3

Package Shape or Style:

Pixel Size (um):

5.5X5.5

Sensors or Transducers Type:

Maximum Supply Voltage:

15.5 V

Minimum Supply Voltage:

14.5 V

Termination Type:

SOLDER

Vertical Pixel:

1080

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 20