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AR0238CSSC12SHRA0-DR1

Onsemi

AR0238CSSC12SHRA0-DR1 by Onsemi

Onsemi's AR0238CSSC12SHRA0-DR1 is a 3x3 um CMOS image sensor with 1928H x 1088V pixels. It operates at 48 MHz master clock, offers a dynamic range of 96 dB, and supports a frame rate of 60 fps. Ideal for applications requiring high-resolution imaging in automotive, surveillance, and industrial sectors.

Median Price

$11.300

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 1,470 parts In-Stock

1+ parts

-

100+ parts

$10.480

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10k+ parts

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1,470

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$10.480

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Flip Electronics (Authorized)

USA . 1,470 parts In-Stock

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1,470

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Rochester

USA . 152 parts In-Stock

1+ parts

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100+ parts

$11.300

1k+ parts

$10.110

10k+ parts

$9.510

152

-

$11.300

$10.110

$9.510

Verical

USA . 152 parts In-Stock

1+ parts

-

100+ parts

$14.125

1k+ parts

$12.637

10k+ parts

$11.887

152

-

$14.125

$12.637

$11.887

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 954 parts In-Stock

1+ parts

$10.480

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954

$10.480

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Digiode

USA . 2,234 parts In-Stock

1+ parts

$11.960

100+ parts

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2,234

$11.960

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Flip Electronics

USA . 1,470 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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10k+ parts

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1,470

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-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 208 parts In-Stock

1+ parts

$10.480

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-

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208

$10.480

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Corphita

USA . 2,452 parts In-Stock

1+ parts

$11.331

100+ parts

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2,452

$11.331

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Kulean Microsystems

USA . 5,645 parts In-Stock

1+ parts

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5,645

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TANS Electronics

Latvia . 3,701 parts In-Stock

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3,701

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Problanco Electronics

Mexico . 2,381 parts In-Stock

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2,381

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SupplyDigital Components

Austria . 2,120 parts In-Stock

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2,120

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Northwest PG Solutions

USA . 571 parts In-Stock

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571

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Native Components

USA . 485 parts In-Stock

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485

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UHIMA Technologies

Türkiye . 133 parts In-Stock

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133

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Overview

Discover the Onsemi AR0238CSSC12SHRA0-DR1 image sensor, a top-quality product that offers exceptional performance and reliability. Manufactured by Onsemi, a trusted leader in the industry, this sensor is perfect for a wide range of applications. With its advanced technology, compact design, and versatile features, the AR0238CSSC12SHRA0-DR1 delivers unmatched value and benefits to customers looking for high-quality imaging solutions. Elevate your projects with this innovative sensor and experience superior results like never before.

Feature Benefit Bullets

Pixel Size (um): 3X3

Small pixel size allows for high resolution images with sharp details.

Maximum Supply Voltage: 1.95 V

Higher supply voltage enables better performance and signal processing capabilities.

Master Clock: 48 MHz

High master clock frequency allows for fast image capturing and processing.

Body Width: 11.3 inch

Compact body width makes it suitable for integration into various devices and applications.

Sensors or Transducers Type: IMAGE SENSOR,CMOS

CMOS image sensor technology provides high sensitivity and low noise for superior image quality.

Body Height: 1.62 mm

Low body height enables slim design and easy integration into compact devices.

Package Shape or Style: SQUARE

Square package shape allows for efficient placement and alignment on PCBs.

Minimum Supply Voltage: 1.7 V

Low minimum supply voltage helps in conserving power and reducing heat dissipation.

Maximum Operating Temperature: 85 °C

Wide operating temperature range ensures reliable performance in various environmental conditions.

Horizontal Pixel: 1928

High horizontal pixel count provides detailed image capture and high resolution.

Output Range: -22-22mA

Wide output current range allows for flexibility in signal processing and compatibility with different systems.

Output Type: DIGITAL CURRENT

Digital current output simplifies data processing and transmission for seamless integration.

Minimum Operating Temperature: -30 °C

Low minimum operating temperature ensures functionality even in extreme cold conditions.

Maximum Operating Current: 130 mA

High maximum operating current supports power-hungry functions and features.

Housing: PLASTIC

Plastic housing offers durability, light weight, and cost-effectiveness.

Dynamic Range: 96 dB

High dynamic range allows for capturing both bright and dark areas with detail and accuracy.

Vertical Pixel: 1088

Vertical pixel count enhances image resolution and quality for better overall performance.

Body Length/Diameter: 11.3 mm

Compact body length/diameter makes it suitable for space-constrained applications and installations.

Optical Format (inch): 1/2.7

Standard optical format ensures compatibility with various lenses and optics.

Termination Type: SOLDER

Solder termination provides secure and reliable electrical connections for long-term usage.

Output Interface Type: 2-WIRE INTERFACE

2-wire interface simplifies connectivity and communication with external systems or devices.

Frame Rate: 60 fps

High frame rate enables smooth and real-time image capture for dynamic scenes or applications.

Array Type: FRAME

Frame array type allows for simultaneous capture of multiple frames for improved image processing and analysis.

Mounting Feature: SURFACE MOUNT

Surface mount capability provides easy and secure mounting on PCBs for streamlined production and installation.

Technical Specifications

Image Sensors AR0238CSSC12SHRA0-DR1 attributes and parameters. Explore more Image Sensors devices from Onsemi

Specs

Additional Features:

ELECTRONIC ROLLING SHUTTER; IT ALSO OPERATES AT 2.8V NOMINAL ANALOG SUPPLY VOLTAGE

Array Type:

FRAME

Body Width:

11.3 inch

Body Height:

1.62 mm

Body Length/Diameter:

11.3 mm

Dynamic Range:

96 dB

Frame Rate:

60 fps

Horizontal Pixel:

1928

Housing:

PLASTIC

Master Clock:

48 MHz

Mounting Feature:

Maximum Operating Current:

130 mA

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-30 Cel

Optical Format (inch):

1/2.7

Output Interface Type:

2-WIRE INTERFACE

Output Range:

Output Type:

Package Shape or Style:

Pixel Size (um):

3X3

Sensors or Transducers Type:

Maximum Supply Voltage:

1.95 V

Minimum Supply Voltage:

1.7 V

Termination Type:

SOLDER

Vertical Pixel:

1088

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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