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KLI-8023-DAA-ED-AE

Onsemi

KLI-8023-DAA-ED-AE by Onsemi

KLI-8023-DAA-ED-AE by Onsemi is an Image Sensor with 9x9 um pixel size, 8002 horizontal and vertical pixels. It operates b/w 0-70 °C, has a dynamic range of 84 dB, and outputs analog voltage in the range of 5.2-5.5V. Ideal for applications requiring high-resolution imaging such as industrial machine vision systems or medical imaging devices.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Digiode

USA . 2,294 parts In-Stock

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Vyrian

USA . 574 parts In-Stock

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SupplyDigital Components

Austria . 5,582 parts In-Stock

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TANS Electronics

Latvia . 4,758 parts In-Stock

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Kulean Microsystems

USA . 4,234 parts In-Stock

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Problanco Electronics

Mexico . 2,316 parts In-Stock

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Corphita

USA . 1,126 parts In-Stock

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UHIMA Technologies

Türkiye . 875 parts In-Stock

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Corohmni

South Africa . 469 parts In-Stock

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Overview

Enhance your imaging systems with the KLI-8023-DAA-ED-AE by Onsemi, a top-quality image sensor that offers exceptional performance and reliability. Manufactured by Onsemi, a trusted leader in the industry, this sensor is perfect for a wide range of applications. With its high pixel resolution, wide dynamic range, and optimal output voltage, this sensor delivers unparalleled clarity and precision in imaging. Invest in the KLI-8023-DAA-ED-AE and elevate your projects to new heights with superior image quality and innovative technology.

Feature Benefit Bullets

Pixel Size (um): 9X9

The small pixel size allows for higher resolution images to be captured with greater detail.

Maximum Supply Voltage: 15.5 V

The high maximum supply voltage ensures reliable and stable performance under varying power conditions.

Body Width: 15.49 inch

The compact body width makes this image sensor suitable for integration into various devices without taking up much space.

Sensors or Transducers Type: IMAGE SENSOR,CCD

CCD image sensors are known for their high-quality image capture and accurate color reproduction.

Package Shape or Style: RECTANGULAR

The rectangular package design allows for easy integration and mounting in different devices or systems.

Dynamic Range: 84 dB

The wide dynamic range enables the sensor to capture both bright and dark areas in a scene accurately, resulting in high-quality images.

Spectral Response (nm): 350-850

The broad spectral response range allows the sensor to capture a wide range of colors and light wavelengths, making it versatile for various imaging applications.

Technical Specifications

Image Sensors KLI-8023-DAA-ED-AE attributes and parameters. Explore more Image Sensors devices from Onsemi

Specs

Additional Features:

SENSITIVITY 14 UV/ELECTRON

Array Type:

LINEAR

Body Width:

15.49 inch

Body Height:

6.1 mm

Body Length/Diameter:

93.98 mm

Data Rate:

6 Mbps

Dynamic Range:

84 dB

Horizontal Pixel:

8002

Housing:

CERAMIC

Mounting Feature:

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Output Range:

Output Type:

Package Shape or Style:

Pixel Size (um):

9X9

Sensors or Transducers Type:

Spectral Response (nm):

350-850

Maximum Supply Voltage:

15.5 V

Minimum Supply Voltage:

14.5 V

Termination Type:

SOLDER

Vertical Pixel:

8002

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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