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KLI-8023-SAA-ED-AA

Onsemi

KLI-8023-SAA-ED-AA by Onsemi

KLI-8023-SAA-ED-AA by Onsemi is an Image Sensor with 9x9 um pixel size, 8002 horizontal and vertical pixels. It operates b/w 0-70 °C, has a dynamic range of 87 dB, and outputs analog voltage in the range of 5.2-5.5V. Ideal for applications requiring high-resolution imaging such as industrial machine vision systems or medical imaging devices.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 2,920 parts In-Stock

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Digiode

USA . 844 parts In-Stock

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AZTECH Wire

Italy . 202 parts In-Stock

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$16.490

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Problanco Electronics

Mexico . 8,217 parts In-Stock

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SupplyDigital Components

Austria . 7,365 parts In-Stock

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TANS Electronics

Latvia . 6,508 parts In-Stock

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UHIMA Technologies

Türkiye . 845 parts In-Stock

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Kulean Microsystems

USA . 580 parts In-Stock

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Corohmni

South Africa . 308 parts In-Stock

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Corphita

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Overview

Capture every detail with the KLI-8023-SAA-ED-AA by Onsemi, a top-of-the-line image sensor that promises unparalleled quality and precision. Manufactured by Onsemi, a trusted name in the industry, this sensor is perfect for a wide range of applications. Experience the benefits of its advanced technology, from stunning image clarity to reliable performance. Don't settle for less when you can have the best with the KLI-8023-SAA-ED-AA.

Feature Benefit Bullets

Pixel Size (um): 9X9

The small pixel size allows for higher resolution images to be captured, making this product suitable for applications requiring detailed image quality.

Maximum Supply Voltage: 15.5 V

The high maximum supply voltage allows for flexibility in power supply options and ensures reliable performance under varying voltage conditions.

Body Width: 15.24 inch

The compact body width makes this image sensor easy to integrate into different devices without taking up much space.

Sensors or Transducers Type: IMAGE SENSOR, CCD

Being a CCD type image sensor, it offers high-quality image capture with low noise, making it ideal for professional imaging applications.

Package Shape or Style: RECTANGULAR

The rectangular package shape allows for easy mounting and alignment within devices, enhancing overall usability.

Minimum Supply Voltage: 14.5 V

The low minimum supply voltage helps in reducing power consumption and enhancing energy efficiency of the product.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature ensures the sensor can function reliably in various environmental conditions without overheating.

Output Range: 5.2-5.5V

The stable output range ensures consistent and accurate signal transmission, leading to high-quality image output.

Output Type: ANALOG VOLTAGE

Analog voltage output allows for easy interfacing with other analog devices, making it versatile in a wide range of applications.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature ensures the sensor can still function effectively in colder environments without performance degradation.

Housing: CERAMIC

The ceramic housing provides durability and protection to the sensor, making it suitable for long-term use and harsh operating conditions.

Dynamic Range: 87 dB

The high dynamic range allows for capturing images with a wide range of tones and details, ensuring superior image quality.

Vertical Pixel: 8002

The high vertical pixel count enables capturing detailed images with high resolution, making it ideal for applications requiring precise image reproduction.

Mounting Feature: THROUGH HOLE MOUNT

The through-hole mounting feature ensures secure and stable mounting of the sensor within devices, preventing any movement or misalignment during operation.

Technical Specifications

Image Sensors KLI-8023-SAA-ED-AA attributes and parameters. Explore more Image Sensors devices from Onsemi

Specs

Additional Features:

IT HAS OUTPUT SENSITIVITY OF 14 MICRO VOLT PER ELECTRON; IT ALSO HAVE DYNAMIC RANGE 82 DB

Array Type:

LINEAR

Body Width:

15.24 inch

Body Height:

6.1 mm

Body Length/Diameter:

93.98 mm

Data Rate:

6 Mbps

Dynamic Range:

87 dB

Horizontal Pixel:

8002

Housing:

CERAMIC

Mounting Feature:

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Output Range:

Output Type:

Package Shape or Style:

Pixel Size (um):

9X9

Sensors or Transducers Type:

Spectral Response (nm):

350-850

Maximum Supply Voltage:

15.5 V

Minimum Supply Voltage:

14.5 V

Termination Type:

SOLDER

Vertical Pixel:

8002

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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