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KLI-8023-SAA-ED-AE

Onsemi

KLI-8023-SAA-ED-AE by Onsemi

KLI-8023-SAA-ED-AE by Onsemi is an Image Sensor with 9x9 um pixel size, 8002 horizontal and vertical pixels. It operates b/w 0-70 °C, has a dynamic range of 87 dB, and outputs analog voltage in the range of 5.2-5.5V. This rectangular CCD sensor is ideal for applications requiring high-resolution imaging in various industries.

Median Price

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Lifecycle Status

EOL

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Digiode

USA . 2,291 parts In-Stock

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Vyrian

USA . 1,754 parts In-Stock

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Problanco Electronics

Mexico . 7,456 parts In-Stock

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TANS Electronics

Latvia . 6,458 parts In-Stock

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SupplyDigital Components

Austria . 4,247 parts In-Stock

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Kulean Microsystems

USA . 3,162 parts In-Stock

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UHIMA Technologies

Türkiye . 791 parts In-Stock

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Corphita

USA . 427 parts In-Stock

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Corohmni

South Africa . 325 parts In-Stock

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Overview

Capture every detail with the KLI-8023-SAA-ED-AE by Onsemi, a top-tier manufacturer known for excellence in image sensors. Ideal for a wide range of applications, this CCD sensor offers unmatched quality and precision. Experience crystal-clear imaging and reliable performance with this rectangular sensor that delivers an analog voltage output within a 5.2-5.5V range. From industrial inspections to medical imaging, this sensor provides exceptional value, reliability, and versatility for all your imaging needs. Elevate your projects with the superior technology of Onsemi.

Feature Benefit Bullets

Pixel Size (um): 9X9

Small pixel size allows for high resolution imaging and better image detail.

Maximum Supply Voltage: 15.5 V

Provides a wide voltage range for flexibility in power supply options.

Body Width: 15.24 inch

Compact body width for easy integration into various devices.

Sensors or Transducers Type: IMAGE SENSOR,CCD

CCD sensors are known for their high-quality image capture capabilities.

Body Height: 6.1 mm

Low profile design for space-constrained applications.

Package Shape or Style: RECTANGULAR

Rectangular shape allows for easier placement and mounting.

Minimum Supply Voltage: 14.5 V

Ensures stable operation even at lower voltage levels.

Maximum Operating Temperature: 70 °C

Wide temperature range for operation in various environmental conditions.

Horizontal Pixel: 8002

High horizontal pixel count for detailed and sharp images.

Output Range: 5.2-5.5V

Stable output voltage range for reliable signal transmission.

Output Type: ANALOG VOLTAGE

Analog output for high-quality image capture with minimal signal interference.

Minimum Operating Temperature: 0 °C

Can operate in cold temperatures without compromising performance.

Housing: CERAMIC

Durable ceramic housing for protection and longevity.

Dynamic Range: 87 dB

Wide dynamic range for capturing both bright and dark areas in the image.

Vertical Pixel: 8002

High vertical pixel count for detailed and clear image capture.

Body Length/Diameter: 93.98 mm

Optimal length for easy integration and installation.

Spectral Response (nm): 350-850

Wide spectral response range for capturing a variety of colors and wavelengths.

Data Rate: 6 Mbps

High data rate for fast and efficient image transfer.

Termination Type: SOLDER

Solder termination for secure and reliable connections.

Array Type: LINEAR

Linear array for precise and accurate image capture.

Mounting Feature: THROUGH HOLE MOUNT

Easy and secure mounting through hole mount feature.

Technical Specifications

Image Sensors KLI-8023-SAA-ED-AE attributes and parameters. Explore more Image Sensors devices from Onsemi

Specs

Additional Features:

IT HAS OUTPUT SENSITIVITY OF 14 MICRO VOLT PER ELECTRON; IT ALSO HAVE DYNAMIC RANGE 82 DB

Array Type:

LINEAR

Body Width:

15.24 inch

Body Height:

6.1 mm

Body Length/Diameter:

93.98 mm

Data Rate:

6 Mbps

Dynamic Range:

87 dB

Horizontal Pixel:

8002

Housing:

CERAMIC

Mounting Feature:

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Output Range:

Output Type:

Package Shape or Style:

Pixel Size (um):

9X9

Sensors or Transducers Type:

Spectral Response (nm):

350-850

Maximum Supply Voltage:

15.5 V

Minimum Supply Voltage:

14.5 V

Termination Type:

SOLDER

Vertical Pixel:

8002

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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