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KLI-8023-AAA-ED-AE

Onsemi

KLI-8023-AAA-ED-AE by Onsemi

KLI-8023-AAA-ED-AE by Onsemi is an Image Sensor with 9x9 um pixel size, 8002 horizontal and vertical pixels. It operates b/w 0 to 70 °C with a dynamic range of 84 dB. Ideal for applications requiring high-resolution imaging in industrial or scientific settings.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Digiode

USA . 1,779 parts In-Stock

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Vyrian

USA . 704 parts In-Stock

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Problanco Electronics

Mexico . 4,273 parts In-Stock

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SupplyDigital Components

Austria . 3,466 parts In-Stock

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Kulean Microsystems

USA . 2,261 parts In-Stock

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Corphita

USA . 1,206 parts In-Stock

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UHIMA Technologies

Türkiye . 748 parts In-Stock

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TANS Electronics

Latvia . 499 parts In-Stock

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Corohmni

South Africa . 86 parts In-Stock

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Overview

Capture every detail with the KLI-8023-AAA-ED-AE Image Sensor by Onsemi. Renowned for their superior quality and cutting-edge technology, Onsemi delivers top-of-the-line products that set the standard in the industry. Perfect for a wide range of applications, this sensor offers unmatched precision and clarity, making it the go-to choice for professionals seeking exceptional results. Elevate your projects with the KLI-8023-AAA-ED-AE and experience the value and benefits it brings to your work.

Feature Benefit Bullets

Pixel Size (um) 9X9

Smaller pixel size allows for higher resolution images to be captured, making this image sensor ideal for applications requiring detailed image quality.

Maximum Supply Voltage 15.5 V

Higher maximum supply voltage provides flexibility in power supply options and ensures stable performance even under varying voltage conditions.

Body Width 15.49 inch

Compact body width allows for easy integration into various devices or systems without taking up too much space.

Sensors or Transducers Type IMAGE SENSOR,CCD

CCD sensors are known for their high-quality imaging capabilities and low noise performance, making this image sensor suitable for demanding imaging applications.

Body Height 6.1 mm

Low body height enables the image sensor to be used in slim devices or applications where space is limited.

Package Shape or Style RECTANGULAR

Rectangular package shape allows for easier handling and mounting within systems or devices.

Minimum Supply Voltage 14.5 V

The minimum supply voltage ensures that the image sensor can operate effectively even with lower voltage power sources, increasing its versatility.

Maximum Operating Temperature 70 °C

High maximum operating temperature range makes the image sensor suitable for use in various environmental conditions without sacrificing performance.

Horizontal Pixel 8002

High horizontal pixel count provides excellent image resolution and sharpness, making this image sensor ideal for capturing detailed images.

Output Range 5.2-5.5V

Wide output voltage range allows for compatibility with various devices or systems, providing flexibility in integration.

Output Type ANALOG VOLTAGE

Analog output allows for easy interfacing with analog signal processing circuits or systems, making this image sensor suitable for analog signal applications.

Minimum Operating Temperature 0 °C

Low minimum operating temperature ensures that the image sensor can perform reliably even in cold environments, expanding its usability.

Housing CERAMIC

Ceramic housing provides excellent durability and thermal stability, making this image sensor suitable for rugged environments or applications with high temperature requirements.

Dynamic Range 84 dB

High dynamic range allows the image sensor to capture a wide range of light intensities accurately, ensuring consistent image quality in various lighting conditions.

Vertical Pixel 8002

High vertical pixel count complements the high horizontal pixel count, ensuring detailed and high-resolution image capture.

Body Length/Diameter 93.98 mm

Long body length provides ample space for sensor components and allows for efficient heat dissipation, ensuring optimal performance.

Spectral Response (nm) 350-850

Wide spectral response range allows the image sensor to capture a broad spectrum of light, making it versatile for various imaging applications.

Data Rate 6 Mbps

High data rate enables fast and efficient data transfer, making this image sensor suitable for applications requiring real-time image processing or high-speed data transmission.

Termination Type SOLDER

Solder termination provides secure and reliable connections, ensuring stable operation of the image sensor in demanding conditions.

Array Type LINEAR

Linear array type allows for efficient line-by-line image capture, making this image sensor suitable for applications requiring linear image scanning or detection.

Mounting Feature THROUGH HOLE MOUNT

Through-hole mounting feature provides secure and stable mounting of the image sensor onto circuit boards or other surfaces, ensuring proper alignment and connection.

Technical Specifications

Image Sensors KLI-8023-AAA-ED-AE attributes and parameters. Explore more Image Sensors devices from Onsemi

Specs

Additional Features:

SENSITIVITY 14 UV/ELECTRON

Array Type:

LINEAR

Body Width:

15.49 inch

Body Height:

6.1 mm

Body Length/Diameter:

93.98 mm

Data Rate:

6 Mbps

Dynamic Range:

84 dB

Horizontal Pixel:

8002

Housing:

CERAMIC

Mounting Feature:

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Output Range:

Output Type:

Package Shape or Style:

Pixel Size (um):

9X9

Sensors or Transducers Type:

Spectral Response (nm):

350-850

Maximum Supply Voltage:

15.5 V

Minimum Supply Voltage:

14.5 V

Termination Type:

SOLDER

Vertical Pixel:

8002

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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