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AR0431CSSC14SMRA0-DP1

Onsemi

AR0431CSSC14SMRA0-DP1 by Onsemi

Onsemi's AR0431CSSC14SMRA0-DP1 is a 10.16mm x 10.16mm CMOS image sensor with 2312x1746 pixels, offering an optical format of 1/3.2 inch and a frame rate of 120 fps. This SQUARE package sensor is ideal for high-resolution imaging applications requiring surface mounting features in plastic housings.

Median Price

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Lifecycle Status

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Vyrian

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Digiode

USA . 1,648 parts In-Stock

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AZTECH Wire

Italy . 843 parts In-Stock

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Native Components

USA . 806 parts In-Stock

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Northwest PG Solutions

USA . 1,627 parts In-Stock

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TANS Electronics

Latvia . 8,207 parts In-Stock

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SupplyDigital Components

Austria . 4,036 parts In-Stock

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Problanco Electronics

Mexico . 3,168 parts In-Stock

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Authorized Procurement Solutions

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UHIMA Technologies

Türkiye . 502 parts In-Stock

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Corohmni

South Africa . 454 parts In-Stock

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Kulean Microsystems

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Corphita

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Overview

Capture every moment in stunning clarity with the AR0431CSSC14SMRA0-DP1 Image Sensor by Onsemi. Known for their exceptional quality and reliability, Onsemi delivers cutting-edge technology that exceeds expectations. Ideal for a wide range of applications, this CMOS image sensor offers unparalleled performance and precision. Whether used in automotive, security, or consumer electronics, the AR0431CSSC14SMRA0-DP1 provides unmatched value, delivering crystal-clear images at a rapid 120 frames per second. Upgrade your imaging experience with Onsemi's innovative technology today.

Feature Benefit Bullets

Body Width: 10.16 inch

Larger body width allows for a larger sensor size, potentially resulting in higher resolution images.

Sensors or Transducers Type: IMAGE SENSOR,CMOS

CMOS sensors are known for their low power consumption and high signal-to-noise ratio, making them suitable for a wide range of imaging applications.

Body Height: 1.625 mm

Compact body height allows for easy integration into various devices or systems without taking up much space.

Package Shape or Style: SQUARE

Square package shape provides a symmetrical design that can facilitate easier mounting and alignment during assembly.

Horizontal Pixel: 2312

Higher horizontal pixel count allows for capturing more detailed images with increased clarity and sharpness.

Housing: PLASTIC

Plastic housing offers a lightweight and cost-effective solution for the sensor while providing adequate protection and insulation.

Vertical Pixel: 1746

Higher vertical pixel count contributes to better image quality and improved resolution, especially for capturing details in the vertical dimension.

Body Length/Diameter: 10.16 mm

Compact body length or diameter enables the sensor to be easily integrated into smaller devices or systems.

Optical Format (inch): 1/3.2

This optical format indicates the sensor's compatibility with a variety of lenses and accessories designed for similar formats, offering flexibility in imaging setups.

Termination Type: SOLDER

Solder termination provides a reliable and secure connection for the sensor, ensuring consistent and stable performance.

Frame Rate: 120 fps

High frame rate of 120 fps allows for capturing fast-moving objects or dynamic scenes with smooth motion and reduced motion blur.

Array Type: FRAME

Frame type array design provides efficient image capture using rows and columns of pixels arranged in a grid pattern for optimal image processing.

Mounting Feature: SURFACE MOUNT

Surface mounting feature offers easy and secure attachment of the sensor to circuit boards or substrates, simplifying the integration process.

Technical Specifications

Image Sensors AR0431CSSC14SMRA0-DP1 attributes and parameters. Explore more Image Sensors devices from Onsemi

Specs

Array Type:

FRAME

Body Width:

10.16 inch

Body Height:

1.625 mm

Body Length/Diameter:

10.16 mm

Frame Rate:

120 fps

Horizontal Pixel:

2312

Housing:

PLASTIC

Mounting Feature:

Optical Format (inch):

1/3.2

Package Shape or Style:

Sensors or Transducers Type:

Termination Type:

SOLDER

Vertical Pixel:

1746

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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