Loading...

KAF-40000-FXA-JD-AA

Onsemi

KAF-40000-FXA-JD-AA by Onsemi

The Onsemi KAF-40000-FXA-JD-AA is a CCD image sensor with 6x6 um pixel size, offering 7304 (H) x 5478 (V) resolution. With a dynamic range of 70.2 dB and spectral response of 350-1100 nm, it's ideal for high-resolution imaging applications in industrial and scientific fields. Operating b/w 0-60 °C, this rectangular sensor has a data rate of 18 Mbps and requires a supply voltage b/w 14.5-15.5 V for optimal performance.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,299 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,299

-

-

-

-

Digiode

USA . 1,527 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,527

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 636 parts In-Stock

1+ parts

$13.620

100+ parts

-

1k+ parts

-

10k+ parts

-

636

$13.620

-

-

-

Kulean Microsystems

USA . 8,142 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,142

-

-

-

-

SupplyDigital Components

Austria . 6,557 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,557

-

-

-

-

Problanco Electronics

Mexico . 5,943 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,943

-

-

-

-

TANS Electronics

Latvia . 4,740 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,740

-

-

-

-

UHIMA Technologies

Türkiye . 846 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

846

-

-

-

-

Corphita

USA . 293 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

293

-

-

-

-

Corohmni

South Africa . 124 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

124

-

-

-

-

Overview

Discover the power of superior imaging technology with Onsemi's KAF-40000-FXA-JD-AA Image Sensor. Designed to deliver unparalleled quality and precision, this cutting-edge sensor offers a wide range of applications in various industries. From capturing vivid images to enhancing surveillance systems, this sensor provides unbeatable value and performance. Trust Onsemi, a renowned manufacturer in the industry, to bring you the latest in image sensor technology that exceeds expectations. Experience the benefits of clarity, accuracy, and reliability with the KAF-40000-FXA-JD-AA Image Sensor today.

Feature Benefit Bullets

Pixel Size (um): 6X6

Smaller pixel size allows for higher resolution images to be captured, making this image sensor ideal for detailed imaging applications.

Maximum Supply Voltage: 15.5 V

With a high maximum supply voltage, this image sensor can handle power fluctuations without compromising performance, ensuring reliable operation.

Body Width: 49 inch

The compact body width of 49 inches allows for easy integration into various devices and systems, offering flexibility in design and installation.

Sensors or Transducers Type: IMAGE SENSOR, CCD

CCD image sensors are known for their high-quality image capture, making this product suitable for applications where image clarity is crucial.

Body Height: 3.43 mm

The slim body height of 3.43 mm facilitates compact system designs and allows for easy placement in space-constrained environments.

Package Shape or Style: RECTANGULAR

The rectangular package shape offers a standardized form factor for easy compatibility with existing mounting and integration solutions.

Minimum Supply Voltage: 14.5 V

The low minimum supply voltage ensures efficient power usage and extends the operating range of this image sensor for versatile applications.

Maximum Operating Temperature: 60 °C

With a high maximum operating temperature of 60 °C, this image sensor can withstand harsh environmental conditions, enhancing its durability.

Horizontal Pixel: 7304

The high horizontal pixel count of 7304 enables detailed and high-resolution image capture, making this sensor suitable for demanding imaging tasks.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature of 0 °C ensures reliable performance even in extreme cold conditions, expanding the range of applications for this sensor.

Housing: CERAMIC

The ceramic housing provides thermal stability and durability, protecting the internal components of the image sensor and ensuring long-term reliability.

Dynamic Range: 70.2 dB

The high dynamic range of 70.2 dB allows for accurate and detailed image reproduction, making this sensor ideal for high-contrast imaging scenarios.

Vertical Pixel: 5478

With a vertical pixel count of 5478, this image sensor can capture detailed images with high resolution, making it suitable for applications that require precise image quality.

Body Length/Diameter: 57.5 mm

The moderate body length/diameter of 57.5 mm offers a good balance between compactness and usability, making this sensor easy to integrate into various systems.

Spectral Response (nm): 350-1100

The wide spectral response range of 350-1100 nanometers allows this image sensor to capture a broad range of wavelengths, making it versatile for different imaging applications.

Data Rate: 18 Mbps

With a high data rate of 18 Mbps, this image sensor can transmit image data quickly and efficiently, ensuring real-time image capture and processing.

Termination Type: SOLDER

The solder termination type provides a reliable connection for the image sensor, ensuring stable performance and secure integration into electronic circuits.

Array Type: FULL FRAME

The full-frame array type offers a larger image sensor area for improved light detection, resulting in better image quality and accuracy.

Mounting Feature: THROUGH HOLE MOUNT

The through-hole mounting feature simplifies the installation process and ensures secure attachment of the image sensor to circuit boards or mounting surfaces.

Technical Specifications

Image Sensors KAF-40000-FXA-JD-AA attributes and parameters. Explore more Image Sensors devices from Onsemi

Specs

Additional Features:

IT HAS A SENSITIVITY OF 31 MICRO VOLT PER ELECTRON; IT ALSO HAVE ESTIMATED LINEAR DYNAMIC RANGE 69.3

Array Type:

FULL FRAME

Body Width:

49 inch

Body Height:

3.43 mm

Body Length/Diameter:

57.5 mm

Data Rate:

18 Mbps

Dynamic Range:

70.2 dB

Horizontal Pixel:

7304

Housing:

CERAMIC

Mounting Feature:

Maximum Operating Temperature:

60 Cel

Minimum Operating Temperature:

0 Cel

Package Shape or Style:

Pixel Size (um):

6X6

Sensors or Transducers Type:

Spectral Response (nm):

350-1100

Maximum Supply Voltage:

15.5 V

Minimum Supply Voltage:

14.5 V

Termination Type:

SOLDER

Vertical Pixel:

5478

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 15