Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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The Onsemi KAF-4301E is a CCD image sensor with 24x24 um pixel size, offering a dynamic range of 87 dB. With 2084 horizontal and vertical pixels, it operates at a data rate of 1 Mbps. Ideal for applications requiring high-quality imaging in the spectral response range of 350-1100 nm.
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The small pixel size allows for high resolution images to be captured with clear details.
Higher supply voltage allows for better signal-to-noise ratio and overall performance of the image sensor.
The compact size of the image sensor makes it suitable for integration into various devices without taking up too much space.
CCD sensors are known for their high quality image capturing capabilities, making this image sensor a good choice for applications requiring superior image quality.
The low profile design of the image sensor allows for easy integration into slim devices or tight spaces.
The rectangular shape of the package makes it easy to handle and mount in various configurations.
Even at lower supply voltages, this image sensor can still operate effectively, providing flexibility in power requirements.
High pixel count allows for detailed and high resolution images to be captured.
Analog output provides linear response and compatibility with a wide range of systems and applications.
Wide dynamic range allows for capturing both bright and dark areas in an image with high accuracy and detail.
High pixel count in both horizontal and vertical directions ensures sharp and clear images.
The overall dimensions of the image sensor are suitable for easy integration and mounting in various devices.
Wide spectral response range allows for capturing images under various lighting conditions and environments.
High data rate enables fast and efficient transmission of image data for real-time applications.
Solder termination provides secure and reliable connections for long-term use and stability.
Full frame array design allows for capturing images without any cropping or distortion, providing true representation of the scene.
Through hole mounting feature ensures secure attachment to circuit boards or other surfaces for stable and reliable operation.
Image Sensors KAF-4301E attributes and parameters. Explore more Image Sensors devices from Onsemi
Additional Features:
Array Type:
Body Width:
Body Height:
Body Length/Diameter:
Data Rate:
Dynamic Range:
Horizontal Pixel:
Mounting Feature:
Output Type:
Package Shape or Style:
Pixel Size (um):
Sensors or Transducers Type:
Spectral Response (nm):
Maximum Supply Voltage:
Minimum Supply Voltage:
Termination Type:
Vertical Pixel:
Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).
President, CEO
Hassane El-Khoury
Executive VP, CFO, Treasurer
Thad Trent
Senior VP
Ross F. Jatou
Aizu Fab
Fabrication
Fab Initiation
1995
Japan
Aizu Wakamatsu
Wafer Capacity
52,000
Si/EPI Fab
2018
Czech Republic
Rožnov pod Radhoštěm
10,000
Expansion Phase 1 for SiC / EPI
2019
14,500
Expansion Phase 2 for SiC / EPI
2024
SiC Fab
2022
USA
Hudson
Bucheon
2013
South Korea
61,000
ISMF - Malaysia
1990
Malaysia
Seremban
95,000
Roznov Device Fab
1987
80,000
Fab 10
2002
East Fishkill
15,000
Burlington
1986
Canada
Gresham
1998
45,000
Bucheon 150mm
2000
50,000
Rochester
1983
Nampa
Pennsylvania
1997
Mountain Top
36,000
ABS10-32.768KHZ-T
Abracon
Abracon's ABS10-32.768KHZ-T crystal oscillator offers 20 ppm frequency tolerance, 122% stability, and 70000 ohm series resistance. Ideal for applications requiring precise timing at 0.032768 MHz, such as IoT devices and wearables due to its compact size and low power consumption.
NUP2105LT1G
Onsemi
NUP2105LT1G by Onsemi is a Transient Suppression Device with 350W power dissipation, 29.1V breakdown voltage, and 44V clamping voltage. Commonly used in electronic circuits for surge protection due to its bidirectional polarity and silicon diode element material.
FDC5614P
MSKSEMI SEMICONDUCTOR
P-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): 2 W; Transistor Element Material: SILICON; Minimum DS Breakdown Voltage: 60 V;
2N7002
Itt Semiconductor
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Package Body Material: PLASTIC/EPOXY; Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR; Package Shape: RECTANGULAR;
KSZ9031RNXIC
Micrel
ETHERNET TRANSCEIVER; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 48; Package Code: HVQCCN; Package Shape: SQUARE;
SS495ASP
Micro Switch
The Micro Switch SS495ASP is an analog circuit IC with a supply voltage range of 4.5V to 10.5V, suitable for automotive applications. Its package body material is plastic/epoxy, and it has a rectangular shape with three terminals. Operating temperature ranges from -40°C to 125°C, making it ideal for various automotive sensor and control systems.
RC0402FR-0710KL
Yageo
Yageo's RC0402FR-0710KL is a 10000 ohm SMT fixed resistor with 1% tolerance, suitable for applications requiring a rated power dissipation of 0.0625 W. With a temperature coefficient of 100 ppm/°C, it operates b/w -55 to 155 °C, making it ideal for various electronic circuits.
2N2222A
Crimson Semiconductor
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
DS18B20U
Dallas Semiconductor
TEMPERATURE SENSOR,SWITCH/DIGITAL OUTPUT,SERIAL; Mounting Feature: SURFACE MOUNT; No. of Terminals: 8; Package Shape or Style: RECTANGULAR; Minimum Operating Temperature: -55 Cel; Package Equivalence Code: TSSOP8,.19;
SS14
Zowie Technology
RECTIFIER DIODE; Surface Mount: YES; No. of Phases: 1; Maximum Operating Temperature: 125 Cel; No. of Elements: 1; Maximum Non Repetitive Peak Forward Current: 30 A;
Good-ark Electronics
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): 1.8 W; Maximum Collector Current (IC): .8 A;
OPA2277UA
Texas Instruments
OPA2277UA by Texas Instruments is a dual operational amplifier with low-offset voltage of 100 uV and micropower consumption of 1.65 mA. Ideal for industrial applications, it offers high common mode rejection ratio of 140 dB and unity gain bandwidth of 1000 kHz in a small outline package.
Shanghai Lunsure Electronic Technology
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Collector Current (IC): .8 A; JESD-30 Code: O-MBCY-W3;
Diotec Semiconductor Ag
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 250 MHz; Maximum Collector Current (IC): .6 A; Maximum Time At Peak Reflow Temperature (s): 10;
STM32H743IIT6
STMicroelectronics
STM32H743IIT6 by STMicroelectronics is a 32-bit microcontroller with integrated cache and a max supply voltage of 3.6V. It is commonly used in industrial applications due to its wide temperature range (-40°C to 85°C) and various connectivity options (CAN, I2C, UART, USB).
LM317BD2TG
LM317BD2TG by Onsemi is an adjustable positive single output standard regulator with a max output current of 1.5A and a max load regulation of 5.8%. Operating temperature ranges from -40 to 125°C, making it suitable for various applications requiring precise voltage regulation in compact designs.
LM358N
Motorola
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
BSS84PH6327XTSA2
Infineon Technologies
BSS84PH6327XTSA2 by Infineon is a P-CHANNEL FET with 60V DS breakdown voltage, ideal for switching applications. It features a single configuration with built-in diode and operates in enhancement mode. With a max drain current of 0.17A and on-resistance of 8 ohm, it offers reliable performance in small outline packages.
Meritek Electronics
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
LM555CM
National Semiconductor
PULSE; RECTANGULAR; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Surface Mount: YES;
AR023ZCSC00SUEA0-DRBR
Onsemi's AR023ZCSC00SUEA0-DRBR is a 3x3 um CMOS image sensor with 1928H x 1088V pixels. It operates at 48 MHz master clock, offers 105 dB dynamic range, and has a frame rate of 60 fps. Ideal for applications requiring high-resolution imaging in a compact form factor.
KAI-04050-FBA-JB-B2
KAI-04050-FBA-JB-B2 by Onsemi is an image sensor with 5.5x5.5 um pixel size, 2336 horizontal pixels, and 1752 vertical pixels. It operates b/w -50 to 70°C, has a dynamic range of 64 dB, and requires a supply voltage of 14.5-15.5 V. This rectangular CCD sensor is ideal for applications requiring high-quality imaging in various environments.
AR0521SR2C09SURA0-DP
Onsemi's AR0521SR2C09SURA0-DP is a 12mm x 12mm CMOS image sensor with 2592x1944 resolution, suitable for high-speed imaging applications at 60fps. It features a square package style, solder termination, and a 1/2.5-inch optical format, making it ideal for surface mount frame array setups.
AR0220AT4B00XUEA2-VL-TPBR
The Onsemi AR0220AT4B00XUEA2-VL-TPBR is a CMOS image sensor with 1828x948 pixels, 1/1.8" optical format, and 60 fps frame rate. It features digital output via a 2-wire interface and is ideal for applications requiring high-resolution imaging in a compact form factor.
AR0238CSSC12SHRA0-DP1
Onsemi's AR0238CSSC12SHRA0-DP1 is a 3x3 um CMOS image sensor with 1928H x 1088V pixels, offering a dynamic range of 96 dB. Operating at 48 MHz master clock, it has a digital current output interface and supports frame rates up to 60 fps. Ideal for applications requiring high-resolution imaging in automotive, surveillance, and industrial sectors.
MT9M021IA3XTM-DPBR
MT9M021IA3XTM-DPBR by Onsemi is a 1/3-inch CMOS image sensor with 1280x960 pixels. It operates at 50 MHz master clock, offers 64 dB dynamic range, and has a frame rate of 45 fps. Ideal for digital voltage output applications in surveillance cameras, drones, and industrial imaging systems.
KAI-02150-QBA-FD-AE
KAI-02150-QBA-FD-AE by Onsemi is a 2/3 inch CCD image sensor with 1920x1080 pixels, 5.5um pixel size, and 64dB dynamic range. It operates b/w -50 to 70 °C, with supply voltage ranging from 14.5V to 15.5V. Ideal for applications requiring high-resolution imaging in industrial cameras and machine vision systems.
KAI-2020-ABA-CP-AE
KAI-2020-ABA-CP-AE by Onsemi is an image sensor with 7.4x7.4 um pixel size, 1600 horizontal pixels, and 1200 vertical pixels. It operates b/w -50 to 70 °C and has a dynamic range of 68 dB. Ideal for applications requiring high-resolution imaging in industrial or scientific settings.
TSL1402R
Ams Ag
TSL1402R by Ams Ag is an image sensor with a pixel size of 63.5X55.5 um and output range of 1.60-2.40V, suitable for applications requiring a dynamic range of 72 dB. With a spectral response of 300-1100 nm, this CCD sensor operates b/w temperatures of 0 to 70 °C, making it ideal for various imaging solutions.
NOIX2SN8000B-LTI1
NOIX2SN8000B-LTI1 by Onsemi is an Image Sensor with 3.2x3.2um Pixel Size, 32.4 MHz Master Clock, and 4096 Horizontal Pixels. Ideal for applications requiring high-resolution imaging such as surveillance cameras, industrial inspection systems, and medical imaging devices due to its 68dB Dynamic Range and I2C/SPI Interface for digital voltage output at a frame rate of 80 fps.
AR0220AT3C00XUEA0-DRBR-E
Onsemi's AR0220AT3C00XUEA0-DRBR-E is a CMOS image sensor with 4.2x4.2 um pixel size, 50 MHz master clock, and 120 dB dynamic range. Ideal for applications requiring high-resolution imaging at up to 60 fps in a compact rectangular package measuring 12mm x 9 inch x 1.65 mm.
MT9D131C12STC-TP
MT9D131C12STC-TP by Onsemi is an image sensor with 2.8x2.8 um pixel size, 80 MHz master clock, and 1/3.2 inch optical format. It operates at -30 to 70 °C with a dynamic range of 71 dB, suitable for digital cameras and surveillance systems due to its high sensitivity and frame rate of 30 fps.
AR0135AT2M25XUEA0-DPBR
Onsemi's AR0135AT2M25XUEA0-DPBR is a 1/3 inch CMOS image sensor with 3.75x3.75 um pixel size, offering 54 fps frame rate for high-speed imaging applications. Its square package shape and surface mounting feature make it ideal for compact camera designs in various industries.
ILX751B
Sony
Sony ILX751B is a 2048-pixel CCD image sensor with 14x14 um pixel size. It operates b/w -10 to 55 °C, offering a dynamic range of 76 dB and sensitivity of 40 V/lx.s. Ideal for applications requiring high-quality imaging in various lighting conditions.
KAC-06040-ABA-JD-BA
The Onsemi KAC-06040-ABA-JD-BA Image Sensor features 4.7x4.7 um pixel size, 50 MHz master clock, and 2832 horizontal pixels. Ideal for applications requiring high-resolution imaging with a max supply voltage of 2.1V and SPI interface output type at a frame rate of 160 fps.
AMIS-720639
Image Sensors; Minimum Operating Temperature: 0 Cel; Power Supplies (V): 5; Maximum Operating Temperature: 50 Cel; Horizontal Pixel: 192; Vertical Pixel: 1;
AR0134CSSM00SUEA0-DRBR
Onsemi's AR0134CSSM00SUEA0-DRBR is a 1/3" CMOS image sensor with 1280x960 resolution, 3.75um pixel size, and 64dB dynamic range. Ideal for applications requiring high-speed digital current output at up to 60fps frame rate, such as surveillance cameras and industrial machine vision systems.
TCD1254GFG(8Z,AA)
Toshiba
Toshiba TCD1254GFG(8Z,AA) Image Sensor features 5.25X64 um pixel size, 1.5-3.0V digital voltage output range, and 52.04 dB dynamic range. Ideal for applications requiring high sensitivity (103 V/lx.s), such as surface mount linear array CCD sensors in imaging systems with spectral response of 400-1100 nm.
AR0430CSSC14SMRA0-DP
The Onsemi AR0430CSSC14SMRA0-DP is a 1/3 inch CMOS image sensor with a frame rate of 120 fps. It features a square plastic package, suitable for surface mount applications. With dimensions of 10.16mm x 10.16mm x 1.625mm, it is ideal for compact imaging devices like smartphones and action cameras.
AS0142ATSC00XUSM0-DPBR-E
AS0142ATSC00XUSM0-DPBR-E by Onsemi is an image sensor with 3x3 um pixel size, 27 MHz master clock, and 1.89V max supply voltage. Ideal for digital cameras, surveillance systems, and automotive applications due to its high resolution and wide operating temperature range.
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KAF-40000-CXA-JD-AA
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Package Shape or Style: RECTANGULAR; Vertical Pixel: 5478; Pixel Size (um): 6X6; Body Length/Diameter: 57.5 mm;
KAF-40000-CXA-JD-AE
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Package Shape or Style: RECTANGULAR; Additional Features: IT HAS A SENSITIVITY OF 31 MICRO VOLT PER ELECTRON; Minimum Supply Voltage: 14.5 V; Body Length/Diameter: 57.5 mm;
KAF-40000-FXA-JD-AA
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Package Shape or Style: RECTANGULAR; Housing: CERAMIC; Additional Features: IT HAS A SENSITIVITY OF 31 MICRO VOLT PER ELECTRON; IT ALSO HAVE ESTIMATED LINEAR DYNAMIC RANGE 69.3; Array Type: FULL FRAME;
KAF-40000-FXA-JD-AE
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Package Shape or Style: RECTANGULAR; Vertical Pixel: 5478; Maximum Supply Voltage: 15.5 V; Maximum Operating Temperature: 60 Cel;
KAF-4301-AAA-JP-AE
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Package Shape or Style: RECTANGULAR; Maximum Operating Temperature: 50 Cel; Dynamic Range: 87 dB; Body Width: 58.42 inch;
KAF-4301-AAA-JP-B1
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Package Shape or Style: RECTANGULAR; Minimum Supply Voltage: 15 V; Maximum Supply Voltage: 17.5 V; Body Width: 58.42 inch;
KAF-4301-AAA-JP-B2
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Package Shape or Style: RECTANGULAR; Array Type: FULL FRAME; Additional Features: IT HAS OUTPUT SENSITIVITY OF 11 MICRO VOLT PER ELECTRON; Dynamic Range: 87 dB;
KAF-4320-AAA-CP-B1
Image Sensors;
KAF-4320-AAA-CP-B2
KAF-4320-AAA-JP-AE
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Additional Features: IT HAS A SENSITIVITY OF 10 MICRO VOLT PER ELECTRON; Horizontal Pixel: 2084; Spectral Response (nm): 300-1200; Data Rate: 3 Mbps;
KAF-4320-AAA-JP-B1
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Maximum Operating Temperature: 50 Cel; Array Type: FULL FRAME; Vertical Pixel: 2085; Pixel Size (um): 24X24;
KAF-4320-AAA-JP-B2
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Additional Features: IT HAS A SENSITIVITY OF 10 MICRO VOLT PER ELECTRON; Pixel Size (um): 24X24; Dynamic Range: 87.5 dB; Array Type: FULL FRAME;
KAF-4320E
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Package Shape or Style: SQUARE; Termination Type: SOLDER; Body Length/Diameter: 73.66 mm; Horizontal Pixel: 1084;
Truesense Imaging
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Package Shape or Style: RECTANGULAR; Maximum Supply Voltage: 17.5 V; Minimum Operating Temperature: -70 Cel; Pixel Size (um): 24X24;
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Package Shape or Style: RECTANGULAR; Array Type: FULL FRAME; Data Rate: 3 Mbps; Minimum Operating Temperature: -70 Cel;
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Package Shape or Style: RECTANGULAR; Vertical Pixel: 2084; Maximum Operating Temperature: 50 Cel; Array Type: FULL FRAME;
Kodak Image Sensor Solutions
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Package Shape or Style: RECTANGULAR; Additional Features: IT HAS A SENSITIVITY OF 11 MICRO VOLT PER ELECTRON; Horizontal Pixel: 2084; Dynamic Range: 87 dB;
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Package Shape or Style: RECTANGULAR; Body Width: 58.42 inch; Data Rate: 3 Mbps; Minimum Supply Voltage: 15 V;
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Package Shape or Style: RECTANGULAR; Pixel Size (um): 24X24; Body Length/Diameter: 70.1 mm; Data Rate: 3 Mbps;
KAF-4301E
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Output Type: ANALOG VOLTAGE; Package Shape or Style: RECTANGULAR; Body Height: 4.27 mm; Vertical Pixel: 2084;
Supply Digital Components
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