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KAF-4301E

Onsemi

KAF-4301E by Onsemi

The Onsemi KAF-4301E is a CCD image sensor with 24x24 um pixel size, offering a dynamic range of 87 dB. With 2084 horizontal and vertical pixels, it operates at a data rate of 1 Mbps. Ideal for applications requiring high-quality imaging in the spectral response range of 350-1100 nm.

Median Price

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Lifecycle Status

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Digiode

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Vyrian

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TANS Electronics

Latvia . 6,340 parts In-Stock

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SupplyDigital Components

Austria . 5,319 parts In-Stock

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Kulean Microsystems

USA . 2,947 parts In-Stock

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Corphita

USA . 1,976 parts In-Stock

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Problanco Electronics

Mexico . 1,301 parts In-Stock

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UHIMA Technologies

Türkiye . 827 parts In-Stock

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Corohmni

South Africa . 264 parts In-Stock

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Overview

Unleash the power of crystal-clear imaging with the innovative KAF-4301E image sensor by Onsemi. Crafted by a trusted manufacturer known for its superior quality, this sensor is designed to elevate your imaging experience to new heights. Perfect for a wide range of applications, from industrial automation to medical imaging, this sensor offers unparalleled value and performance. Say goodbye to blurry images and hello to stunning clarity with the KAF-4301E by Onsemi.

Feature Benefit Bullets

Pixel Size (um): 24X24

The small pixel size allows for high resolution images to be captured with clear details.

Maximum Supply Voltage: 17.5 V

Higher supply voltage allows for better signal-to-noise ratio and overall performance of the image sensor.

Body Width: 58.42 inch

The compact size of the image sensor makes it suitable for integration into various devices without taking up too much space.

Sensors or Transducers Type: IMAGE SENSOR,CCD

CCD sensors are known for their high quality image capturing capabilities, making this image sensor a good choice for applications requiring superior image quality.

Body Height: 4.27 mm

The low profile design of the image sensor allows for easy integration into slim devices or tight spaces.

Package Shape or Style: RECTANGULAR

The rectangular shape of the package makes it easy to handle and mount in various configurations.

Minimum Supply Voltage: 15 V

Even at lower supply voltages, this image sensor can still operate effectively, providing flexibility in power requirements.

Horizontal Pixel: 2084

High pixel count allows for detailed and high resolution images to be captured.

Output Type: ANALOG VOLTAGE

Analog output provides linear response and compatibility with a wide range of systems and applications.

Dynamic Range: 87 dB

Wide dynamic range allows for capturing both bright and dark areas in an image with high accuracy and detail.

Vertical Pixel: 2084

High pixel count in both horizontal and vertical directions ensures sharp and clear images.

Body Length/Diameter: 70.11 mm

The overall dimensions of the image sensor are suitable for easy integration and mounting in various devices.

Spectral Response (nm): 350-1100

Wide spectral response range allows for capturing images under various lighting conditions and environments.

Data Rate: 1 Mbps

High data rate enables fast and efficient transmission of image data for real-time applications.

Termination Type: SOLDER

Solder termination provides secure and reliable connections for long-term use and stability.

Array Type: FULL FRAME

Full frame array design allows for capturing images without any cropping or distortion, providing true representation of the scene.

Mounting Feature: THROUGH HOLE MOUNT

Through hole mounting feature ensures secure attachment to circuit boards or other surfaces for stable and reliable operation.

Technical Specifications

Image Sensors KAF-4301E attributes and parameters. Explore more Image Sensors devices from Onsemi

Specs

Additional Features:

SENSITIVITY IS 11.5 MICRO V/ELECTRON

Array Type:

FULL FRAME

Body Width:

58.42 inch

Body Height:

4.27 mm

Body Length/Diameter:

70.11 mm

Data Rate:

1 Mbps

Dynamic Range:

87 dB

Horizontal Pixel:

2084

Mounting Feature:

Output Type:

Package Shape or Style:

Pixel Size (um):

24X24

Sensors or Transducers Type:

Spectral Response (nm):

350-1100

Maximum Supply Voltage:

17.5 V

Minimum Supply Voltage:

15 V

Termination Type:

SOLDER

Vertical Pixel:

2084

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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