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KAF-40000-CXA-JD-AA

Onsemi

KAF-40000-CXA-JD-AA by Onsemi

The Onsemi KAF-40000-CXA-JD-AA is a CCD image sensor with 6x6 um pixel size, 7304 horizontal pixels, and 5478 vertical pixels. It operates b/w 0-60 °C with a dynamic range of 70.2 dB. Ideal for high-resolution imaging applications requiring precise color reproduction and low light sensitivity.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 2,332 parts In-Stock

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Digiode

USA . 1,143 parts In-Stock

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Kulean Microsystems

USA . 7,506 parts In-Stock

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SupplyDigital Components

Austria . 7,478 parts In-Stock

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Problanco Electronics

Mexico . 4,416 parts In-Stock

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TANS Electronics

Latvia . 1,773 parts In-Stock

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Corphita

USA . 1,454 parts In-Stock

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UHIMA Technologies

Türkiye . 431 parts In-Stock

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431

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Corohmni

South Africa . 229 parts In-Stock

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Overview

Get ready to experience the next level of imaging with the KAF-40000-CXA-JD-AA by Onsemi. Known for their top-notch quality and innovation, Onsemi's image sensors are a cut above the rest. This CCD sensor boasts a high pixel density and wide dynamic range, making it ideal for applications such as industrial inspection, medical imaging, and scientific research. Say goodbye to blurry images and hello to crystal-clear visuals with this cutting-edge sensor. Upgrade your imaging system today and see the difference for yourself!

Feature Benefit Bullets

Pixel Size (um): 6X6

Small pixel size allows for high resolution imaging and detailed image capture.

Maximum Supply Voltage: 15.5 V

Higher supply voltage ensures stable performance and reliable operation.

Body Width: 49 inch

Compact body width makes it suitable for various imaging applications where space is limited.

Sensors or Transducers Type: IMAGE SENSOR,CCD

CCD sensors offer high image quality, low noise, and accurate color reproduction.

Package Shape or Style: RECTANGULAR

Rectangular shape allows for easy integration and compatibility with existing equipment.

Minimum Supply Voltage: 14.5 V

Low minimum supply voltage helps in reducing power consumption and increasing efficiency.

Maximum Operating Temperature: 60 °C

Wide operating temperature range ensures reliable performance in various environmental conditions.

Minimum Operating Temperature: 0 °C

Ability to operate at low temperatures makes it suitable for diverse applications.

Housing: CERAMIC

Ceramic housing provides durability, thermal stability, and electrical insulation.

Dynamic Range: 70.2 dB

High dynamic range allows for capturing both shadow details and highlights accurately in the image.

Vertical Pixel: 5478

High vertical pixel count enables capturing detailed and sharp images with excellent resolution.

Data Rate: 18 Mbps

High data rate facilitates fast image capturing and transfer, making it suitable for real-time applications.

Array Type: FULL FRAME

Full frame array ensures maximum image coverage and high-quality image capture without any cropping.

Mounting Feature: THROUGH HOLE MOUNT

Through hole mounting provides secure and stable installation, suitable for rugged environments.

Technical Specifications

Image Sensors KAF-40000-CXA-JD-AA attributes and parameters. Explore more Image Sensors devices from Onsemi

Specs

Additional Features:

IT HAS A SENSITIVITY OF 31 MICRO VOLT PER ELECTRON

Array Type:

FULL FRAME

Body Width:

49 inch

Body Length/Diameter:

57.5 mm

Data Rate:

18 Mbps

Dynamic Range:

70.2 dB

Horizontal Pixel:

7304

Housing:

CERAMIC

Mounting Feature:

Maximum Operating Temperature:

60 Cel

Minimum Operating Temperature:

0 Cel

Package Shape or Style:

Pixel Size (um):

6X6

Sensors or Transducers Type:

Spectral Response (nm):

350-1100

Maximum Supply Voltage:

15.5 V

Minimum Supply Voltage:

14.5 V

Termination Type:

SOLDER

Vertical Pixel:

5478

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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