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LFBGA Other Function uPs,uCs & Peripheral ICs 334

Other Function uPs,uCs & Peripheral ICs
Part# Info Specs
Part RoHS Manufacturer Description ADC Channels Maximum Access Time Additional Features Address Bus Width Bit Size Boundary Scan Bus Compatibility CPU Family Maximum Clock Frequency DAC Channels DMA Channels External Data Bus Width Format Information Access Method Integrated Cache Interrupt Capability JESD-30 Code JESD-609 Code Length Low Power Mode Moisture Sensitivity Level (MSL) No. of Bits No. of DMA Channels No. of External Interrupts No. of I/O Lines No. of Ports No. of Serial I/Os No. of Terminals No. of Timers On Chip Data RAM Width On Chip Program ROM Width Maximum Operating Temperature Minimum Operating Temperature PWM Channels Package Body Material Package Code Package Equivalence Code Package Shape Package Style (Meter) Peak Reflow Temperature (C) Power Supplies (V) Qualification RAM Bytes RAM Words ROM Words ROM Programmability ROM Bits Size Screening Level Maximum Seated Height Speed Maximum Standby Current Sub-Category Maximum Supply Current Maximum Supply Voltage Minimum Supply Voltage Nominal Supply Voltage Surface Mount Technology Temperature Grade Terminal Finish Terminal Form Terminal Pitch Terminal Position Minimum Time Maximum Time At Peak Reflow Temperature (s) Total Dose (V) Ultraviolet Erasable Volatile Width Peripheral IC Type Data EEPROM Size Connectivity Peripherals Analog To Digital Convertors
TNETV6446AINZWT by Texas Instruments

TNETV6446AINZWT

Texas Instruments

TNETV6446AINZWT by Texas Instruments is a MICROPROCESSOR CIRCUIT with 361 terminals in a GRID ARRAY package. It operates b/w 0-85 °C with supply voltage range of 1.14-1.26 V, making it ideal for low profile applications requiring high processing power and fine pitch connections.

S-PBGA-B361

e1

16 mm

3

361

85 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.4 mm

1.26 V

1.14 V

1.2 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

16 mm

MICROPROCESSOR CIRCUIT

DM365ZCES by Texas Instruments

DM365ZCES

Texas Instruments

DM365ZCES by Texas Instruments is a microprocessor circuit with a 32-bit external data bus width. It operates on a supply voltage range of 1.28V to 1.42V and has a max operating temperature of 85°C. This peripheral IC is suitable for applications requiring I2C, SPI, UART, and USB bus compatibility.

I2C; SPI; UART; USB

32

S-PBGA-B338

e1

13 mm

3

338

85 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.3 mm

1.42 V

1.28 V

1.35 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

.65 mm

BOTTOM

30

13 mm

MICROPROCESSOR CIRCUIT

DM365ZCEW by Texas Instruments

DM365ZCEW

Texas Instruments

The Texas Instruments DM365ZCEW is a MICROPROCESSOR CIRCUIT with 32-bit External Data Bus Width. It operates b/w 0-85 °C and has a supply voltage range of 1.28-1.42 V, making it suitable for applications requiring low power consumption and high performance in various electronic devices. Its package style is GRID ARRAY, LOW PROFILE, FINE PITCH, ideal for compact designs that require surface mount technology.

I2C; SPI; UART; USB

32

S-PBGA-B338

e1

13 mm

3

338

85 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.3 mm

1.42 V

1.28 V

1.35 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

.65 mm

BOTTOM

30

13 mm

MICROPROCESSOR CIRCUIT

DM365ZCEZ by Texas Instruments

DM365ZCEZ

Texas Instruments

The Texas Instruments DM365ZCEZ is a MICROPROCESSOR CIRCUIT with 32-bit External Data Bus Width, suitable for I2C, SPI, UART, and USB bus compatibility. It operates b/w 0-85 °C with a supply voltage range of 1.28-1.42 V. The package style is GRID ARRAY with 338 terminals in a SQUARE shape, making it ideal for various embedded applications.

I2C; SPI; UART; USB

32

S-PBGA-B338

e1

13 mm

3

338

85 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.3 mm

1.42 V

1.28 V

1.35 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

.65 mm

BOTTOM

30

13 mm

MICROPROCESSOR CIRCUIT

TMS320DM365ZCEZ by Texas Instruments

TMS320DM365ZCEZ

Texas Instruments

TMS320DM365ZCEZ by Texas Instruments is a MICROPROCESSOR CIRCUIT with 32-bit External Data Bus Width. It operates b/w 0-85 °C, with supply voltage range of 1.28-1.42 V. Ideal for applications requiring I2C, SPI, UART, USB bus compatibility in a compact GRID ARRAY package style.

I2C; SPI; UART; USB

32

S-PBGA-B338

e1

13 mm

3

338

85 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.3 mm

1.42 V

1.28 V

1.35 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

.65 mm

BOTTOM

30

13 mm

MICROPROCESSOR CIRCUIT

VCBU65WMCE30 by Texas Instruments

VCBU65WMCE30

Texas Instruments

VCBU65WMCE30 by Texas Instruments is a MICROPROCESSOR CIRCUIT with 32-bit External Data Bus Width. It operates b/w 0-85 °C and supports I2C, SPI, UART, USB bus compatibility. The package style is GRID ARRAY with 338 terminals in a SQUARE shape measuring 13mm x 13mm.

I2C; SPI; UART; USB

32

S-PBGA-B338

e1

13 mm

3

338

85 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.3 mm

1.42 V

1.28 V

1.35 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

.65 mm

BOTTOM

30

13 mm

MICROPROCESSOR CIRCUIT

VCBU68WMCE30 by Texas Instruments

VCBU68WMCE30

Texas Instruments

VCBU68WMCE30 by Texas Instruments is a MICROPROCESSOR CIRCUIT with 338 terminals in a GRID ARRAY package. It operates b/w 0-85 °C and has a supply voltage range of 1.28-1.42 V, making it ideal for low-power applications requiring high processing capabilities. The PLASTIC/EPOXY body material and BALL terminal form ensure durability and reliability in various electronic devices.

S-PBGA-B338

e1

13 mm

3

338

85 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.3 mm

1.42 V

1.28 V

1.35 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

.65 mm

BOTTOM

30

13 mm

MICROPROCESSOR CIRCUIT

VS3673UNION by Texas Instruments

VS3673UNION

Texas Instruments

VS3673UNION by Texas Instruments is a 338-terminal microprocessor circuit with CMOS technology. It operates b/w 0-85°C, with supply voltage range of 1.28-1.42V. Suitable for I2C, SPI, UART, and USB bus compatibility applications due to its low profile grid array package style.

I2C; SPI; UART; USB

32

S-PBGA-B338

e1

13 mm

3

338

85 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.3 mm

1.42 V

1.28 V

1.35 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

.65 mm

BOTTOM

30

13 mm

MICROPROCESSOR CIRCUIT

VS3674UNION by Texas Instruments

VS3674UNION

Texas Instruments

VS3674UNION by Texas Instruments is a MICROPROCESSOR CIRCUIT with CMOS technology. It features 338 terminals in a GRID ARRAY package style, suitable for applications requiring low profile and fine pitch components. With a supply voltage range of 1.28V to 1.42V and operating temperature from 0°C to 85°C, it offers versatility in various electronic designs.

S-PBGA-B338

e1

13 mm

3

338

85 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.3 mm

1.42 V

1.28 V

1.35 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

.65 mm

BOTTOM

30

13 mm

MICROPROCESSOR CIRCUIT

DM355SZCE135 by Texas Instruments

DM355SZCE135

Texas Instruments

The Texas Instruments DM355SZCE135 is a 32-bit microprocessor with 337 terminals and 32768 RAM words. Operating b/w 0-85°C, it has a supply voltage range of 1.235-3.3V and peak reflow temperature of 260°C. Ideal for applications requiring a low-profile, fine-pitch grid array package in CMOS technology.

32

FIXED POINT

S-PBGA-B337

e1

13 mm

3

337

85 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

BGA337,19X19,25

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.3,1.8,3.3

Not Qualified

32768

1.3 mm

Digital Signal Processors

1.365 V

1.235 V

1.3 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

.65 mm

BOTTOM

30

13 mm

MICROPROCESSOR CIRCUIT

DM355SZCE270 by Texas Instruments

DM355SZCE270

Texas Instruments

Texas Instruments DM355SZCE270 is a 32-bit microprocessor with 337 terminals. Operating b/w 0-85°C, it has a max supply voltage of 1.365V and RAM words of 32768. Ideal for applications requiring a low-profile, fine-pitch package style in CMOS technology.

32

FIXED POINT

S-PBGA-B337

e1

13 mm

3

337

85 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

BGA337,19X19,25

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.3,1.8,3.3

Not Qualified

32768

1.3 mm

Digital Signal Processors

1.365 V

1.235 V

1.3 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

.65 mm

BOTTOM

30

13 mm

MICROPROCESSOR CIRCUIT

DM355SZCEA135 by Texas Instruments

DM355SZCEA135

Texas Instruments

Texas Instruments DM355SZCEA135 is a 32-bit microprocessor with 337 terminals, operating at temperatures from -40 to 100°C. It has a max supply voltage of 1.365V and RAM words of 32768, suitable for industrial applications requiring high processing power in a compact form factor.

32

FIXED POINT

S-PBGA-B337

e1

13 mm

3

337

100 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA337,19X19,25

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.3,1.8,3.3

Not Qualified

32768

1.3 mm

Digital Signal Processors

1.365 V

1.235 V

1.3 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.65 mm

BOTTOM

30

13 mm

MICROPROCESSOR CIRCUIT

DM355SZCEA216 by Texas Instruments

DM355SZCEA216

Texas Instruments

The Texas Instruments DM355SZCEA216 is a 32-bit microprocessor with 337 terminals, operating at temperatures from -40 to 100°C. It has a max supply voltage of 1.365V and RAM capacity of 32768 words. Ideal for industrial applications requiring high processing power in a compact form factor.

32

FIXED POINT

S-PBGA-B337

e1

13 mm

3

337

100 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA337,19X19,25

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.3,1.8,3.3

Not Qualified

32768

1.3 mm

Digital Signal Processors

1.365 V

1.235 V

1.3 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.65 mm

BOTTOM

30

13 mm

MICROPROCESSOR CIRCUIT

TMS320DM355ZCEA216 by Texas Instruments

TMS320DM355ZCEA216

Texas Instruments

TMS320DM355ZCEA216 by Texas Instruments is a 32-bit microprocessor with 337 terminals and 32768 RAM words. Operating temperature ranges from -40 to 100°C, making it suitable for industrial applications. With a max supply voltage of 1.365V, this CMOS technology-based device is ideal for various embedded systems requiring high processing power in a compact form factor.

32

FIXED POINT

S-PBGA-B337

e1

13 mm

3

337

100 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA337,19X19,25

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.3,1.8,3.3

Not Qualified

32768

1.3 mm

Digital Signal Processors

1.365 V

1.235 V

1.3 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.65 mm

BOTTOM

30

13 mm

MICROPROCESSOR CIRCUIT

TMS320DM365ZCED30 by Texas Instruments

TMS320DM365ZCED30

Texas Instruments

TMS320DM365ZCED30 by Texas Instruments is a 32-bit microprocessor with 338 terminals, operating at -40 to 85°C. It features a 32-bit external data bus width and supports I2C, SPI, UART, and USB buses. Ideal for industrial applications requiring a low-profile package style with a grid array layout.

32

I2C; SPI; UART; USB

32

FIXED POINT

S-PBGA-B338

e1

13 mm

3

338

85 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA338,19X19,25

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.35,1.8,3.3

Not Qualified

8192

1.3 mm

Digital Signal Processors

1.42 V

1.28 V

1.35 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.65 mm

BOTTOM

30

13 mm

MICROPROCESSOR CIRCUIT

OMAP3503DCUS72 by Texas Instruments

OMAP3503DCUS72

Texas Instruments

OMAP3503DCUS72 by Texas Instruments is a System on Chip with 423 terminals, operating at 0-90°C. It has a supply voltage range of 1.71-1.91V and uses CMOS technology. This IC is suitable for applications requiring low profile, fine pitch packages in various electronic devices.

S-PBGA-B423

16 mm

423

90 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

BGA423,24X24,25

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

NOT SPECIFIED

1.1,1.2,1.8,1.8/3

Not Qualified

1.4 mm

Graphics Processors

1.91 V

1.71 V

1.8 V

YES

CMOS

OTHER

BALL

.8 mm

BOTTOM

NOT SPECIFIED

16 mm

SYSTEM ON CHIP

OMAP3503DCUSA by Texas Instruments

OMAP3503DCUSA

Texas Instruments

OMAP3503DCUSA by Texas Instruments is a 423-terminal IC with max supply voltage of 1.91V and operating temp up to 105°C. Ideal for industrial applications, it features a system-on-chip design, CMOS technology, and low-profile grid array package style.

S-PBGA-B423

e1

16 mm

4

423

105 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA423,24X24,25

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.1,1.2,1.8,1.8/3

Not Qualified

1.4 mm

Graphics Processors

1.91 V

1.71 V

1.8 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

16 mm

SYSTEM ON CHIP

OMAP3515DCUS by Texas Instruments

OMAP3515DCUS

Texas Instruments

OMAP3515DCUS by Texas Instruments is a System on Chip with 423 terminals, operating at 0-90°C. It features supply voltages of 1.1V, 1.8V, and 3.3V for various applications in Other Function uPs,uCs & Peripheral ICs requiring a compact GRID ARRAY package style with 0.65mm terminal pitch.

S-PBGA-B423

16 mm

423

90 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

BGA423,24X24,25

SQUARE

GRID ARRAY

NOT SPECIFIED

1.1,1.8,3.3

Not Qualified

1.4 mm

Graphics Processors

1.89 V

1.71 V

1.8 V

YES

CMOS

OTHER

BALL

.65 mm

BOTTOM

NOT SPECIFIED

16 mm

SYSTEM ON CHIP

TMS320DM355ZCEA135 by Texas Instruments

TMS320DM355ZCEA135

Texas Instruments

TMS320DM355ZCEA135 by Texas Instruments is a 32-bit microprocessor with 337 terminals, operating at -40 to 100°C. It features a max supply voltage of 1.365V and RAM of 32768 words. Ideal for industrial applications requiring a low-profile, fine-pitch package style.

32

FIXED POINT

S-PBGA-B337

e1

13 mm

3

337

100 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA337,19X19,25

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.3,1.8,3.3

Not Qualified

32768

1.3 mm

Digital Signal Processors

1.365 V

1.235 V

1.3 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.65 mm

BOTTOM

30

13 mm

MICROPROCESSOR CIRCUIT

SM320DM6446AZWTA by Texas Instruments

SM320DM6446AZWTA

Texas Instruments

Texas Instruments SM320DM6446AZWTA is a 32-bit microprocessor with 20480 RAM words, operating at max 27 MHz clock frequency. Ideal for industrial applications, it supports I2C, SPI, UART, and USB bus compatibility in a low-profile grid array package.

ITS ALSO OPERATES AT 1.8/3.3 V SUPPLY

32

I2C; SPI; UART; USB

27 MHz

48

FIXED POINT

S-PBGA-B361

e1

16 mm

3

361

105 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA361,19X19,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.2

Not Qualified

20480

1.4 mm

Digital Signal Processors

1.26 V

1.14 V

1.2 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

16 mm

MICROPROCESSOR CIRCUIT

STA2058EXATR by STMicroelectronics

STA2058EXATR

STMicroelectronics

STA2058EXATR by STMicroelectronics is a low-profile microprocessor circuit designed for industrial applications. It operates b/w 2.97V and 3.63V, with a max temp of 85 °C and features a compact 10mm x 10mm grid array package. Ideal for space-constrained environments, it ensures reliable performance in demanding conditions.

S-PBGA-B144

10 mm

144

85 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

NOT SPECIFIED

Not Qualified

1.7 mm

3.63 V

2.97 V

3.3 V

YES

CMOS

INDUSTRIAL

BALL

.8 mm

BOTTOM

NOT SPECIFIED

10 mm

MICROPROCESSOR CIRCUIT

STA2058EXA by STMicroelectronics

STA2058EXA

STMicroelectronics

STA2058EXA by STMicroelectronics is a low-profile microprocessor circuit designed for industrial applications. It operates b/w 2.97V and 3.63V, with a max temp of 85 °C and features a compact 10mm x 10mm grid array package. Ideal for space-constrained environments, it ensures reliable performance in demanding conditions.

S-PBGA-B144

10 mm

144

85 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

NOT SPECIFIED

Not Qualified

1.7 mm

3.63 V

2.97 V

3.3 V

YES

CMOS

INDUSTRIAL

BALL

.8 mm

BOTTOM

NOT SPECIFIED

10 mm

MICROPROCESSOR CIRCUIT

STA2058EXTR by STMicroelectronics

STA2058EXTR

STMicroelectronics

STA2058EXTR by STMicroelectronics is a low-profile microprocessor circuit designed for industrial applications. It operates b/w 2.97V and 3.63V, with a max temp of 85 °C and features a compact 10mm x 10mm grid array package. Ideal for space-constrained environments, it ensures reliable performance in demanding conditions.

S-PBGA-B144

10 mm

144

85 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

NOT SPECIFIED

Not Qualified

1.7 mm

3.63 V

2.97 V

3.3 V

YES

CMOS

INDUSTRIAL

BALL

.8 mm

BOTTOM

NOT SPECIFIED

10 mm

MICROPROCESSOR CIRCUIT

STA2058EX by STMicroelectronics

STA2058EX

STMicroelectronics

STA2058EX by STMicroelectronics is a low-profile microprocessor circuit with a supply voltage range of 2.97V to 3.63V and operates in extreme temperatures from -40 °C to 85 °C. It features a compact 10mm x 10mm grid array package with 144 terminals. Ideal for industrial applications, it ensures reliable performance in demanding environments.

S-PBGA-B144

e1

10 mm

3

144

85 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

Not Qualified

1.7 mm

3.63 V

2.97 V

3.3 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

10 mm

MICROPROCESSOR CIRCUIT

MCIMX6DP5EYM1AB by NXP Semiconductors

MCIMX6DP5EYM1AB

NXP Semiconductors

SoC; Terminal Form: BALL; No. of Terminals: 624; Package Code: LFBGA; Package Shape: SQUARE; Package Body Material: PLASTIC/EPOXY;

EACH GPIO MODULE SUPPORTS 32 BITS OF I/O.

S-PBGA-B624

e1

21 mm

3

624

105 Cel

-20 Cel

PLASTIC/EPOXY

LFBGA

BGA624,25X25,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.6 mm

1.5 V

1.35 V

1.4 V

YES

CMOS

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

40

21 mm

SoC

MCIMX6G2CVK05AB by NXP Semiconductors

MCIMX6G2CVK05AB

NXP Semiconductors

MCIMX6G2CVK05AB by NXP Semiconductors is a SYSTEM ON CHIP with CMOS technology. It operates b/w -40 to 105 °C, with supply voltage range of 1.15V to 1.3V. This IC has 272 terminals and is ideal for industrial applications requiring low profile, fine pitch components.

S-PBGA-B272

9 mm

3

272

105 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.23 mm

1.3 V

1.15 V

YES

CMOS

INDUSTRIAL

BALL

.5 mm

BOTTOM

40

9 mm

SYSTEM ON CHIP

MCIMX6G3CVK05AB by NXP Semiconductors

MCIMX6G3CVK05AB

NXP Semiconductors

SYSTEM ON CHIP; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 272; Package Code: LFBGA; Package Shape: SQUARE;

S-PBGA-B272

9 mm

3

272

105 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.23 mm

1.3 V

1.15 V

YES

CMOS

INDUSTRIAL

BALL

.5 mm

BOTTOM

40

9 mm

SYSTEM ON CHIP

MCIMX6QP5EYM1AB by NXP Semiconductors

MCIMX6QP5EYM1AB

NXP Semiconductors

SoC; Terminal Form: BALL; No. of Terminals: 624; Package Code: LFBGA; Package Shape: SQUARE; Peak Reflow Temperature (C): 260;

EACH GPIO MODULE SUPPORTS 32 BITS OF I/O.

S-PBGA-B624

e1

21 mm

3

624

105 Cel

-20 Cel

PLASTIC/EPOXY

LFBGA

BGA624,25X25,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.6 mm

1.5 V

1.35 V

1.4 V

YES

CMOS

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

40

21 mm

SoC

MCIMX6S5DVM10AD by NXP Semiconductors

MCIMX6S5DVM10AD

NXP Semiconductors

MCIMX6S5DVM10AD by NXP Semiconductors is a low-profile, fine-pitch grid array SoC with 624 terminals. It operates on a supply voltage range of 1.35V to 1.5V and has a max operating temperature of 95°C. This IC is commonly used in applications requiring high-performance computing and advanced connectivity capabilities.

S-PBGA-B624

e1

21 mm

3

624

95 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

BGA624,25X25,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.6 mm

1.5 V

1.35 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

40

21 mm

SoC

MCIMX6S5EVM10AD by NXP Semiconductors

MCIMX6S5EVM10AD

NXP Semiconductors

MCIMX6S5EVM10AD by NXP Semiconductors is a SoC with CMOS technology, featuring 624 terminals in a low profile grid array package. It operates b/w -20 to 105 °C and has a supply voltage range of 1.35V to 1.5V. Ideal for applications requiring high performance and compact design.

S-PBGA-B624

e1

21 mm

3

624

105 Cel

-20 Cel

PLASTIC/EPOXY

LFBGA

BGA624,25X25,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.6 mm

1.5 V

1.35 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

40

21 mm

SoC

MCIMX6S8DVM10AD by NXP Semiconductors

MCIMX6S8DVM10AD

NXP Semiconductors

SYSTEM ON CHIP; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 624; Package Code: LFBGA; Package Shape: SQUARE;

S-PBGA-B624

e1

21 mm

3

624

95 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

BGA624,25X25,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.6 mm

1.5 V

1.35 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

40

21 mm

SYSTEM ON CHIP

MCIMX6U5DVM10AD by NXP Semiconductors

MCIMX6U5DVM10AD

NXP Semiconductors

MCIMX6U5DVM10AD by NXP Semiconductors is a System on Chip with 624 terminals, operating at 0-95°C. It features a low profile grid array package style, 0.8mm terminal pitch, and tin silver copper finish. Ideal for applications requiring high performance in compact spaces.

S-PBGA-B624

e1

21 mm

3

624

95 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

BGA624,25X25,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.6 mm

1.5 V

1.35 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

40

21 mm

SYSTEM ON CHIP

MCIMX6U8DVM10AD by NXP Semiconductors

MCIMX6U8DVM10AD

NXP Semiconductors

SYSTEM ON CHIP; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 624; Package Code: LFBGA; Package Shape: SQUARE;

S-PBGA-B624

e1

21 mm

3

624

95 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

BGA624,25X25,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.6 mm

1.5 V

1.35 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

40

21 mm

SYSTEM ON CHIP

MCIMX6X1CVO08AC by NXP Semiconductors

MCIMX6X1CVO08AC

NXP Semiconductors

SYSTEM ON CHIP; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 400; Package Code: LFBGA; Package Shape: SQUARE;

24MHZ NOMINAL FREQUENCY AVAILABLE

S-PBGA-B400

e1

17 mm

3

400

105 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA400,20X20,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.53 mm

1.5 V

1.275 V

1.8 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

40

17 mm

SYSTEM ON CHIP

MCIMX6X3CVK08AC by NXP Semiconductors

MCIMX6X3CVK08AC

NXP Semiconductors

SYSTEM ON CHIP; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 400; Package Code: LFBGA; Package Shape: SQUARE;

24MHZ NOMINAL FREQUENCY AVAILABLE

S-PBGA-B400

e1

14 mm

3

400

105 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA400,20X20,25

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.3 mm

1.5 V

1.275 V

1.8 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.65 mm

BOTTOM

40

14 mm

SYSTEM ON CHIP

MCIMX6X4CVM08AC by NXP Semiconductors

MCIMX6X4CVM08AC

NXP Semiconductors

MCIMX6X4CVM08AC by NXP Semiconductors is a low-profile, fine-pitch grid array SoC with 529 terminals. It operates b/w -40 to 105°C and has a supply voltage range of 1.275V to 1.5V. Ideal for industrial applications requiring high-performance computing in compact spaces.

S-PBGA-B529

e1

19 mm

3

529

105 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA529,23X23,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.52 mm

1.5 V

1.275 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

40

19 mm

SoC

66AK2G12ABY100 by Texas Instruments

66AK2G12ABY100

Texas Instruments

The Texas Instruments 66AK2G12ABY100 is a System on Chip with CMOS technology. It operates b/w 0-70°C, with supply voltage range of 0.95-1.05V. With 625 terminals in a low profile grid array package, it's ideal for various commercial applications requiring high performance and integration capabilities.

S-PBGA-B625

e1

21 mm

3

625

70 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

BGA625,25X25,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.56 mm

1.05 V

.95 V

1 V

YES

CMOS

COMMERCIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

21 mm

SYSTEM ON CHIP

66AK2G12ABY60 by Texas Instruments

66AK2G12ABY60

Texas Instruments

The Texas Instruments 66AK2G12ABY60 is a System on Chip with CMOS technology. It operates b/w 0-70°C, has a supply voltage range of 0.855-0.945V, and features a grid array package with 625 terminals. Ideal for applications requiring low profile, fine pitch ICs in commercial-grade environments.

S-PBGA-B625

e1

21 mm

3

625

70 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

BGA625,25X25,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.56 mm

.945 V

.855 V

.9 V

YES

CMOS

COMMERCIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

21 mm

SYSTEM ON CHIP

66AK2G12ABYA100E by Texas Instruments

66AK2G12ABYA100E

Texas Instruments

The Texas Instruments 66AK2G12ABYA100E is a SYSTEM ON CHIP with CMOS technology. It operates b/w -40 to 105 °C and has a supply voltage range of 0.95V to 1.05V. With 625 terminals in a GRID ARRAY package, it's ideal for industrial applications requiring low profile and fine pitch components.

S-PBGA-B625

e1

21 mm

3

625

105 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA625,25X25,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.56 mm

1.05 V

.95 V

1 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

21 mm

SYSTEM ON CHIP

66AK2G12ABYA100 by Texas Instruments

66AK2G12ABYA100

Texas Instruments

The Texas Instruments 66AK2G12ABYA100 is a System on Chip with CMOS technology. It operates b/w -40 to 105°C, with supply voltage ranging from 0.95V to 1.05V. With 625 terminals in a low profile grid array package, it's ideal for industrial applications requiring high performance and compact design.

S-PBGA-B625

e1

21 mm

3

625

105 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA625,25X25,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.56 mm

1.05 V

.95 V

1 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

21 mm

SYSTEM ON CHIP

66AK2G12ABYA60E by Texas Instruments

66AK2G12ABYA60E

Texas Instruments

The Texas Instruments 66AK2G12ABYA60E is a System on Chip with CMOS technology. It operates b/w -40 to 105 °C and has a supply voltage range of 0.855V to 0.945V. With 625 terminals in a low profile grid array package, it's ideal for industrial applications requiring high performance and compact design.

S-PBGA-B625

e1

21 mm

3

625

105 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA625,25X25,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.56 mm

.945 V

.855 V

.9 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

21 mm

SYSTEM ON CHIP

66AK2G12ABYA60 by Texas Instruments

66AK2G12ABYA60

Texas Instruments

The Texas Instruments 66AK2G12ABYA60 is a SYSTEM ON CHIP with CMOS technology. It operates b/w -40 to 105 °C and has a supply voltage range of 0.855V to 0.945V. With 625 terminals in a GRID ARRAY package, it's ideal for industrial applications requiring low profile and fine pitch components.

S-PBGA-B625

e1

21 mm

3

625

105 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA625,25X25,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.56 mm

.945 V

.855 V

.9 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

21 mm

SYSTEM ON CHIP

MIMXRT1052CVL5A by NXP Semiconductors

MIMXRT1052CVL5A

NXP Semiconductors

The NXP Semiconductors MIMXRT1052CVL5A is a System on Chip with CMOS technology. It operates b/w -40 to 105 °C, with supply voltage ranging from 1.15V to 1.26V. This low-profile, fine-pitch chip is ideal for industrial applications requiring high performance in a compact form factor.

24MHZ NOMINAL CRYSTAL FREQUENCY AVAILABLE

S-PBGA-B196

10 mm

196

105 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA196,14X14,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

1.52 mm

1.26 V

1.15 V

YES

CMOS

INDUSTRIAL

BALL

.65 mm

BOTTOM

10 mm

SYSTEM ON CHIP

MIMXRT1052CVL5B by NXP Semiconductors

MIMXRT1052CVL5B

NXP Semiconductors

The NXP Semiconductors MIMXRT1052CVL5B is a System on Chip with 196 terminals in a low profile, fine pitch grid array package. It operates b/w -40 to 105°C, with supply voltage range of 1.15V to 1.26V. Ideal for industrial applications requiring high performance and compact design.

24MHZ NOMINAL CRYSTAL FREQUENCY AVAILABLE

S-PBGA-B196

e1

10 mm

3

196

105 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA196,14X14,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.52 mm

1.26 V

1.15 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.65 mm

BOTTOM

40

10 mm

SYSTEM ON CHIP

MIMXRT1061CVJ5A by NXP Semiconductors

MIMXRT1061CVJ5A

NXP Semiconductors

The NXP Semiconductors MIMXRT1061CVJ5A is a low-profile, fine-pitch grid array SoC with 196 terminals. It operates in industrial temperatures from -40 to 105°C and has a supply voltage range of 1.15V to 1.26V. Ideal for applications requiring high-performance computing in compact spaces.

S-PBGA-B196

e2

12 mm

3

196

105 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA196,14X14,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.52 mm

1.26 V

1.15 V

YES

CMOS

INDUSTRIAL

TIN SILVER

BALL

.8 mm

BOTTOM

40

12 mm

SoC

MIMXRT1062CVJ5A by NXP Semiconductors

MIMXRT1062CVJ5A

NXP Semiconductors

MIMXRT1062CVJ5A by NXP Semiconductors is a CMOS SoC with 196 terminals in a low profile, fine pitch grid array package. It operates in industrial temperature range (-40 to 105 °C) and has a max supply voltage of 1.26 V. This IC is suitable for various applications requiring high-performance microcontrollers.

S-PBGA-B196

e2

12 mm

3

196

105 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA196,14X14,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.52 mm

1.26 V

1.15 V

YES

CMOS

INDUSTRIAL

TIN SILVER

BALL

.8 mm

BOTTOM

40

12 mm

SoC

MIMXRT1062CVL5A by NXP Semiconductors

MIMXRT1062CVL5A

NXP Semiconductors

The NXP Semiconductors MIMXRT1062CVL5A is a SoC with CMOS technology, featuring 196 terminals in a low profile grid array package. It operates b/w -40 to 105 °C and has a supply voltage range of 1.15V to 1.26V. Ideal for industrial applications requiring high performance uPs/uCs & peripheral ICs in compact form factors.

S-PBGA-B196

e1

10 mm

3

196

105 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA196,14X14,25

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.43 mm

1.26 V

1.15 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.65 mm

BOTTOM

40

10 mm

SoC

MIMXRT1051CVJ5B by NXP Semiconductors

MIMXRT1051CVJ5B

NXP Semiconductors

NXP Semiconductors' MIMXRT1051CVJ5B is a System on Chip with CMOS technology, operating at -40 to 105 °C. It features 196 terminals in a low profile grid array package style. Ideal for industrial applications requiring uPs and uCs with a supply voltage range of 1.15V to 1.26V.

S-PBGA-B196

e2

12 mm

3

196

105 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA196,14X14,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.52 mm

1.26 V

1.15 V

YES

CMOS

INDUSTRIAL

TIN SILVER

BALL

.8 mm

BOTTOM

40

12 mm

SYSTEM ON CHIP