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TMS320DM355ZCEA216

Texas Instruments

TMS320DM355ZCEA216 by Texas Instruments

TMS320DM355ZCEA216 by Texas Instruments is a 32-bit microprocessor with 337 terminals and 32768 RAM words. Operating temperature ranges from -40 to 100°C, making it suitable for industrial applications. With a max supply voltage of 1.365V, this CMOS technology-based device is ideal for various embedded systems requiring high processing power in a compact form factor.

Median Price

$31.843

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 59 parts In-Stock

1+ parts

$5.131

100+ parts

-

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59

$5.131

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Verical

USA . 59 parts In-Stock

1+ parts

$28.686

100+ parts

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59

$28.686

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Chip1Stop

Japan . 59 parts In-Stock

1+ parts

$35.000

100+ parts

$29.070

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10k+ parts

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59

$35.000

$29.070

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DigiKey

USA . 190 parts In-Stock

1+ parts

$56.730

100+ parts

$44.248

1k+ parts

$40.797

10k+ parts

-

190

$56.730

$44.248

$40.797

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Distributors (In-Stock)

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Digiode

USA . 426 parts In-Stock

1+ parts

$29.326

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426

$29.326

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Vyrian

USA . 8,878 parts In-Stock

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8,878

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Chip Stock

USA . 2,900 parts In-Stock

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2,900

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K-1 Technologies

USA . 500 parts In-Stock

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500

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Euro-Tech

UK . 140 parts In-Stock

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140

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Netsource Technology, Inc.

USA . 42 parts In-Stock

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42

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Cyclops Electronics Ltd

UK . 10 parts In-Stock

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10

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Distributors (Availability)

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Parana Technologies

USA . 251 parts In-Stock

1+ parts

$19.387

100+ parts

-

1k+ parts

$19.401

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251

$19.387

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$19.401

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ChromeModa Solutions

Germany . 5,221 parts In-Stock

1+ parts

$21.783

100+ parts

$17.862

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5,221

$21.783

$17.862

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IDEA Electronic Components Group

UK . 1,411 parts In-Stock

1+ parts

$21.783

100+ parts

$20.694

1k+ parts

$19.605

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1,411

$21.783

$20.694

$19.605

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Corphita

USA . 4,004 parts In-Stock

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$27.783

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4,004

$27.783

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Corohmni

South Africa . 968 parts In-Stock

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$28.145

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968

$28.145

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DigiPath Technology Company

USA . 1,721 parts In-Stock

1+ parts

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$19.640

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1,721

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$19.640

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Perfect Parts

USA . 604 parts In-Stock

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604

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Overview

Unlock the potential of your electronic designs with the TMS320DM355ZCEA216 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers high-quality products that ensure reliability and performance. This versatile microprocessor circuit is perfect for a wide range of applications, offering customers value and benefits such as efficient processing power, low profile packaging, and industrial-grade temperature tolerance. Elevate your projects with the TMS320DM355ZCEA216 and experience the advantages of cutting-edge technology at your fingertips.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Allows for a lightweight and durable design, ideal for portable and rugged applications.

Surface Mount: YES

Enables easy and efficient assembly onto circuit boards, saving time and effort in manufacturing.

Maximum Supply Voltage: 1.365 V

Provides a stable power supply for reliable operation within safe voltage limits.

Package Shape: SQUARE

Facilitates a compact and uniform layout on the circuit board, optimizing space usage.

Bit Size: 32

Offers high processing power and data handling capabilities for complex tasks and applications.

Power Supplies (V): 1.3,1.8,3.3

Supports a wide range of power supply options, allowing flexibility in different operating environments.

No. of Terminals: 337

Provides ample connectivity for interfacing with various external components and peripherals.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

Enhances reliability and signal integrity, especially in high-density circuit designs.

Minimum Supply Voltage: 1.235 V

Ensures stable operation even under low voltage conditions, improving performance efficiency.

Maximum Operating Temperature: 100 °C

Suitable for industrial environments with high temperature requirements, ensuring robust operation.

Minimum Operating Temperature: -40 °C

Capable of functioning in cold temperatures without compromising performance or reliability.

Terminal Finish: TIN SILVER COPPER

Provides excellent conductivity and corrosion resistance for long-term durability and signal integrity.

Terminal Position: BOTTOM

Facilitates easier and more efficient PCB layout and assembly, saving space and reducing complexity.

Maximum Seated Height: 1.3 mm

Allows for a low-profile design, suitable for space-constrained applications where height is a limitation.

RAM Words: 32768

Provides ample memory capacity for storing and accessing data, enhancing processing capabilities.

Width: 13 mm

Compact size allows for efficient use of PCB real estate, accommodating smaller form factor devices.

Maximum Time At Peak Reflow Temperature (s): 30

Ensures proper solder reflow process during assembly, guaranteeing reliable connections and performance.

Peak Reflow Temperature °C: 260

Meets industry-standard reflow temperature requirements for soldering, ensuring proper bonding of components.

Length: 13 mm

Compact form factor enables space-efficient layouts on PCBs, suitable for small-scale electronic devices.

Temperature Grade: INDUSTRIAL

Designed to withstand harsh industrial environments with temperature fluctuations, ensuring long-term reliability.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

Incorporates advanced processing capabilities for enhanced functionality and performance in various applications.

Technology: CMOS

Utilizes low power consumption and high noise immunity characteristics, ideal for energy-efficient and reliable operation.

Terminal Form: BALL

Facilitates easy soldering and reliable electrical connections during assembly, ensuring proper functionality.

Nominal Supply Voltage: 1.3 V

Optimal voltage for stable and efficient operation, ensuring reliable performance under normal conditions.

Terminal Pitch: 0.65 mm

Allows for fine-pitch connections on the PCB, enabling high-density mounting for compact electronic devices.

Format: FIXED POINT

Suitable for applications requiring precise calculations and data processing, ensuring accurate results.

Moisture Sensitivity Level (MSL): 3

Designed to withstand moderate moisture exposure during storage and handling, maintaining product integrity.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs TMS320DM355ZCEA216 attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

Bit Size:

32

Format:

FIXED POINT

JESD-30 Code:

S-PBGA-B337

JESD-609 Code:

e1

Length:

13 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

337

Maximum Operating Temperature:

100 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA337,19X19,25

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.3,1.8,3.3

Qualification:

Not Qualified

RAM Words:

32768

Maximum Seated Height:

1.3 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.365 V

Minimum Supply Voltage:

1.235 V

Nominal Supply Voltage:

1.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

13 mm

Peripheral IC Type:

Trade Compliance

TMS320DM355ZCEA216 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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