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LFBGA Other Function uPs,uCs & Peripheral ICs 334

Other Function uPs,uCs & Peripheral ICs
Part# Info Specs
Part RoHS Manufacturer Description ADC Channels Maximum Access Time Additional Features Address Bus Width Bit Size Boundary Scan Bus Compatibility CPU Family Maximum Clock Frequency DAC Channels DMA Channels External Data Bus Width Format Integrated Cache JESD-30 Code JESD-609 Code Length Low Power Mode Moisture Sensitivity Level (MSL) No. of Bits No. of DMA Channels No. of External Interrupts No. of I/O Lines No. of Ports No. of Serial I/Os No. of Terminals No. of Timers On Chip Data RAM Width On Chip Program ROM Width Maximum Operating Temperature Minimum Operating Temperature PWM Channels Package Body Material Package Code Package Equivalence Code Package Shape Package Style (Meter) Peak Reflow Temperature (C) Power Supplies (V) Qualification RAM Bytes RAM Words ROM Words ROM Programmability ROM Bits Size Screening Level Maximum Seated Height Speed Maximum Standby Current Sub-Category Maximum Supply Current Maximum Supply Voltage Minimum Supply Voltage Nominal Supply Voltage Surface Mount Technology Temperature Grade Terminal Finish Terminal Form Terminal Pitch Terminal Position Maximum Time At Peak Reflow Temperature (s) Ultraviolet Erasable Width Peripheral IC Type Data EEPROM Size Connectivity Peripherals Analog To Digital Convertors
TMS320DM335CZCE216 by Texas Instruments

TMS320DM335CZCE216

Texas Instruments

TMS320DM335CZCE216 by Texas Instruments is a 32-bit microprocessor with 8192 RAM words. Operating at 1.3-3.3V, it has a peak reflow temp of 260°C and operates b/w 0-85°C. Ideal for applications requiring a low-profile, fine-pitch grid array package style.

32

FIXED POINT

S-PBGA-B337

e1

13 mm

3

337

85 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

BGA337,19X19,25

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.3,1.8,3.3

Not Qualified

8192

1.3 mm

Digital Signal Processors

1.365 V

1.235 V

1.3 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

.65 mm

BOTTOM

30

13 mm

MICROPROCESSOR CIRCUIT

TMS320DM335DZCE135 by Texas Instruments

TMS320DM335DZCE135

Texas Instruments

TMS320DM335DZCE135 by Texas Instruments is a 32-bit microprocessor with 8192 RAM words. It operates at temperatures from 0 to 85°C and has a max supply voltage of 1.365V. This MICROPROCESSOR CIRCUIT is ideal for applications requiring low power consumption and high processing capabilities.

32

FIXED POINT

S-PBGA-B337

e1

13 mm

3

337

85 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

BGA337,19X19,25

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.3,1.8,3.3

Not Qualified

8192

1.3 mm

Digital Signal Processors

1.365 V

1.235 V

1.3 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

.65 mm

BOTTOM

30

13 mm

MICROPROCESSOR CIRCUIT

TMS320DM335DZCE216 by Texas Instruments

TMS320DM335DZCE216

Texas Instruments

MICROPROCESSOR CIRCUIT; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 337; Package Code: LFBGA; Package Shape: SQUARE;

32

I2C; SPI; UART; USB

32

FIXED POINT

S-PBGA-B337

e1

13 mm

3

337

85 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

BGA337,19X19,25

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.3,1.8,3.3

Not Qualified

8192

1.3 mm

Digital Signal Processors

1.365 V

1.235 V

1.3 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

.65 mm

BOTTOM

30

13 mm

MICROPROCESSOR CIRCUIT

OMAPL132BZWTA2E by Texas Instruments

OMAPL132BZWTA2E

Texas Instruments

OMAPL132BZWTA2E by Texas Instruments is a MICROPROCESSOR CIRCUIT with 361 terminals in a GRID ARRAY package. It operates at supply voltages ranging from 0.95V to 1.2V, making it suitable for low power applications. With a compact SQUARE shape and BALL terminal form, it is ideal for space-constrained designs requiring high performance.

ALSO OPERATES AT 1.2 V AND 1.1 V TYP

S-PBGA-B361

e1

16 mm

3

361

PLASTIC/EPOXY

LFBGA

BGA361,19X19,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.2,1.8/3.3

Not Qualified

1.4 mm

Other Microprocessor ICs

1.05 V

.95 V

1 V

YES

CMOS

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

16 mm

MICROPROCESSOR CIRCUIT

TMS320DM368ZCEDF by Texas Instruments

TMS320DM368ZCEDF

Texas Instruments

TMS320DM368ZCEDF by Texas Instruments is a 32-bit microprocessor with 8192 RAM words. It operates in industrial temperature range (-40 to 85 °C) and supports I2C, SPI, UART, USB buses. This MICROPROCESSOR CIRCUIT is ideal for applications requiring low profile and fine pitch package style.

32

I2C; SPI; UART; USB

32

FIXED POINT

S-PBGA-B338

e1

13 mm

3

338

85 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA338,19X19,25

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.35,1.8,3.3

Not Qualified

8192

1.3 mm

Digital Signal Processors

1.42 V

1.28 V

1.35 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.65 mm

BOTTOM

30

13 mm

MICROPROCESSOR CIRCUIT

OMAPL132BZWT2 by Texas Instruments

OMAPL132BZWT2

Texas Instruments

OMAPL132BZWT2 by Texas Instruments is a MICROPROCESSOR CIRCUIT with 361 terminals in a GRID ARRAY package. It operates at supply voltages ranging from 0.95V to 1.2V, making it suitable for low-power applications. With a compact size of 16mm x 16mm and surface-mount capability, it is ideal for space-constrained designs in various electronic devices.

ALSO OPERATES AT 1.2 V AND 1.1 V TYP

S-PBGA-B361

e1

16 mm

3

361

PLASTIC/EPOXY

LFBGA

BGA361,19X19,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.2,1.8/3.3

Not Qualified

1.4 mm

Other Microprocessor ICs

1.05 V

.95 V

1 V

YES

CMOS

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

16 mm

MICROPROCESSOR CIRCUIT

OMAPL132BZWTA2 by Texas Instruments

OMAPL132BZWTA2

Texas Instruments

OMAPL132BZWTA2 by Texas Instruments is a MICROPROCESSOR CIRCUIT with 361 terminals in a GRID ARRAY package. It operates at supply voltages ranging from 0.95V to 1.2V and is suitable for applications requiring low profile, fine pitch ICs. With CMOS technology and TIN SILVER COPPER finish, it offers high performance in compact designs.

ALSO OPERATES AT 1.2 V TYP

S-PBGA-B361

e1

16 mm

3

361

PLASTIC/EPOXY

LFBGA

BGA361,19X19,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.2,1.8/3.3

Not Qualified

1.4 mm

Other Microprocessor ICs

1.05 V

.95 V

1 V

YES

CMOS

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

16 mm

MICROPROCESSOR CIRCUIT

TMS320DM6441BZWT by Texas Instruments

TMS320DM6441BZWT

Texas Instruments

TMS320DM6441BZWT by Texas Instruments is a 32-bit microprocessor with 20480 RAM words, operating at -40 to 85°C. It supports Ethernet, I2C, SPI, UART, and USB buses for various applications like multimedia systems and industrial automation due to its low profile grid array package.

ALSO OPERATES AT 1.2 V AND 1.1 V TYP

32

ETHERNET; I2C; SPI; UART; USB

48

FIXED POINT

S-PBGA-B316

e1

16 mm

3

316

85 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

BGA361,19X19,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.05/1.2,1.8,3.3

Not Qualified

20480

1.4 mm

Digital Signal Processors

1.1 V

1 V

1.05 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

16 mm

MICROPROCESSOR CIRCUIT

TMS320DM6443BZWT by Texas Instruments

TMS320DM6443BZWT

Texas Instruments

TMS320DM6443BZWT by Texas Instruments is a 32-bit microprocessor with 20480 RAM words. It operates at 1.14-1.26 V, suitable for MICROPROCESSOR CIRCUIT applications like ETHERNET, I2C, SPI, UART, and USB interfaces. The package style is GRID ARRAY with low profile and fine pitch design for compact setups.

32

ETHERNET; I2C; SPI; UART; USB

48

FIXED POINT

S-PBGA-B316

e1

16 mm

3

316

85 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

BGA361,19X19,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.2,1.8/3.3

Not Qualified

20480

1.4 mm

Digital Signal Processors

1.26 V

1.14 V

1.2 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

16 mm

MICROPROCESSOR CIRCUIT

XC7Z010-1CLG400C by Xilinx

XC7Z010-1CLG400C

Xilinx

XC7Z010-1CLG400C by Xilinx is a 400-terminal, low-profile, fine-pitch grid array package with a max supply voltage of 1.05V. It is a system-on-chip (SoC) peripheral IC that operates in temperatures ranging from 0 to 85°C. This versatile device is commonly used in various applications requiring high-performance computing and integrated functionality.

S-PBGA-B400

e1

17 mm

3

400

85 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

BGA400,20X20,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

1.6 mm

1.05 V

.95 V

1 V

YES

CMOS

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

BALL

.8 mm

BOTTOM

17 mm

SYSTEM ON CHIP

XC7Z010-1CLG400I by Xilinx

XC7Z010-1CLG400I

Xilinx

The Xilinx XC7Z010-1CLG400I is a System on Chip with 400 terminals, operating b/w -40 to 100 °C. It features a low profile grid array package style and CMOS technology, suitable for various applications requiring high performance in a compact form factor. With a supply voltage range of 0.95V to 1.05V, it is ideal for projects demanding efficient power consumption and advanced processing capabilities.

S-PBGA-B400

e1

17 mm

3

400

100 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA400,20X20,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

1.6 mm

1.05 V

.95 V

1 V

YES

CMOS

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

BALL

.8 mm

BOTTOM

17 mm

SYSTEM ON CHIP

XC7Z010-2CLG400E by Xilinx

XC7Z010-2CLG400E

Xilinx

The Xilinx XC7Z010-2CLG400E is a System on Chip with 400 terminals in a low profile, fine pitch grid array package. It operates b/w 0-100°C with supply voltage range of 0.95-1.05V. Ideal for applications requiring high-performance processing in compact form factors.

S-PBGA-B400

e1

17 mm

3

400

100 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

BGA400,20X20,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

1.6 mm

1.05 V

.95 V

1 V

YES

CMOS

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

BALL

.8 mm

BOTTOM

17 mm

SYSTEM ON CHIP

XC7Z010-2CLG400I by Xilinx

XC7Z010-2CLG400I

Xilinx

XC7Z010-2CLG400I by Xilinx is a System on Chip with CMOS technology. It operates b/w -40 to 100 °C and has a supply voltage range of 0.95V to 1.05V. With 400 terminals in a low profile grid array package, it's ideal for various applications requiring high-performance processing capabilities.

S-PBGA-B400

e1

17 mm

3

400

100 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA400,20X20,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

1.6 mm

1.05 V

.95 V

1 V

YES

CMOS

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

BALL

.8 mm

BOTTOM

17 mm

SYSTEM ON CHIP

XC7Z010-3CLG400E by Xilinx

XC7Z010-3CLG400E

Xilinx

XC7Z010-3CLG400E by Xilinx is a System on Chip with CMOS technology. It operates b/w 0-100°C, with supply voltage ranging from 0.95V to 1.05V. This low-profile chip in a grid array package is ideal for various applications requiring high performance and compact design.

S-PBGA-B400

e1

17 mm

3

400

100 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

BGA400,20X20,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

1.6 mm

1.05 V

.95 V

1 V

YES

CMOS

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

BALL

.8 mm

BOTTOM

17 mm

SYSTEM ON CHIP

XC7Z020-1CLG400I by Xilinx

XC7Z020-1CLG400I

Xilinx

The Xilinx XC7Z020-1CLG400I is a System on Chip with CMOS technology. It operates b/w -40 to 100 °C and has a supply voltage range of 0.95V to 1.05V. With 400 terminals in a low profile grid array package, it's ideal for various applications requiring high-performance processing capabilities.

S-PBGA-B400

e1

17 mm

3

400

100 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA400,20X20,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

1.6 mm

1.05 V

.95 V

1 V

YES

CMOS

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

BALL

.8 mm

BOTTOM

17 mm

SYSTEM ON CHIP

XC7Z020-1CLG484C by Xilinx

XC7Z020-1CLG484C

Xilinx

XC7Z020-1CLG484C by Xilinx is a System on Chip with CMOS technology. It operates b/w 0-85°C, with supply voltage range of 0.95-1.05 V. This low profile, fine pitch chip in a grid array package is ideal for various applications requiring high performance and integration.

S-PBGA-B484

19 mm

484

85 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

BGA484,22X22,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

1.6 mm

1.05 V

.95 V

1 V

YES

CMOS

BALL

.8 mm

BOTTOM

19 mm

SYSTEM ON CHIP

XC7Z020-1CLG484I by Xilinx

XC7Z020-1CLG484I

Xilinx

XC7Z020-1CLG484I by Xilinx is a System on Chip with CMOS technology. It operates b/w -40 to 100 °C, with supply voltage range of 0.95V to 1.05V. This low profile chip in grid array package is ideal for various applications requiring high performance and compact design.

S-PBGA-B484

19 mm

484

100 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA484,22X22,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

1.6 mm

1.05 V

.95 V

1 V

YES

CMOS

BALL

.8 mm

BOTTOM

19 mm

SYSTEM ON CHIP

XC7Z020-2CLG400E by Xilinx

XC7Z020-2CLG400E

Xilinx

The Xilinx XC7Z020-2CLG400E is a System on Chip with 400 terminals in a low profile, fine pitch grid array package. It operates b/w 0-100°C with supply voltage range of 0.95-1.05V. Ideal for applications requiring high-performance processing in compact designs.

S-PBGA-B400

e1

17 mm

3

400

100 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

BGA400,20X20,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

1.6 mm

1.05 V

.95 V

1 V

YES

CMOS

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

BALL

.8 mm

BOTTOM

17 mm

SYSTEM ON CHIP

XC7Z020-2CLG484E by Xilinx

XC7Z020-2CLG484E

Xilinx

The Xilinx XC7Z020-2CLG484E is a System on Chip with CMOS technology. It operates b/w 0-100°C, with supply voltage range of 0.95-1.05V. With 484 terminals in a low profile grid array package, it's ideal for various embedded applications requiring high-performance processing capabilities.

S-PBGA-B484

19 mm

484

100 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

BGA484,22X22,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

1.6 mm

1.05 V

.95 V

1 V

YES

CMOS

BALL

.8 mm

BOTTOM

19 mm

SYSTEM ON CHIP

XC7Z020-2CLG484I by Xilinx

XC7Z020-2CLG484I

Xilinx

The Xilinx XC7Z020-2CLG484I is a System on Chip with CMOS technology. It operates b/w -40 to 100°C, with supply voltage ranging from 0.95V to 1.05V. Featuring a grid array package style, it is ideal for applications requiring low profile and fine pitch components in the Other Function uPs,uCs & Peripheral ICs category.

S-PBGA-B484

19 mm

484

100 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA484,22X22,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

1.6 mm

1.05 V

.95 V

1 V

YES

CMOS

BALL

.8 mm

BOTTOM

19 mm

SYSTEM ON CHIP

XC7Z020-3CLG400E by Xilinx

XC7Z020-3CLG400E

Xilinx

The Xilinx XC7Z020-3CLG400E is a System on Chip with CMOS technology. It operates b/w 0-100°C, with supply voltage range of 0.95-1.05V. Featuring a grid array package style, it's ideal for applications requiring low profile and fine pitch components in the Other Function uPs,uCs & Peripheral ICs category.

S-PBGA-B400

e1

17 mm

3

400

100 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

BGA400,20X20,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

1.6 mm

1.05 V

.95 V

1 V

YES

CMOS

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

BALL

.8 mm

BOTTOM

17 mm

SYSTEM ON CHIP

XC7Z020-3CLG484E by Xilinx

XC7Z020-3CLG484E

Xilinx

The Xilinx XC7Z020-3CLG484E is a System on Chip with CMOS technology. It operates b/w 0-100°C, with supply voltage range of 0.95-1.05V. This low profile chip in a square package is ideal for various applications requiring high performance and integration capabilities.

S-PBGA-B484

19 mm

484

100 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

BGA484,22X22,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

1.6 mm

1.05 V

.95 V

1 V

YES

CMOS

BALL

.8 mm

BOTTOM

19 mm

SYSTEM ON CHIP

TMS320DM368ZCE48 by Texas Instruments

TMS320DM368ZCE48

Texas Instruments

TMS320DM368ZCE48 by Texas Instruments is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w 0-85 °C and has a supply voltage range of 1.28-1.42 V, making it ideal for applications requiring low power consumption and high performance in compact designs.

S-PBGA-B338

e1

13 mm

3

338

85 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.3 mm

1.42 V

1.28 V

1.35 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

.65 mm

BOTTOM

30

13 mm

MICROPROCESSOR CIRCUIT

TMS320DM368ZCED48F by Texas Instruments

TMS320DM368ZCED48F

Texas Instruments

TMS320DM368ZCED48F by Texas Instruments is a 32-bit microprocessor with 338 terminals, operating at -40 to 85°C. It features a max supply voltage of 1.42V and supports I2C, SPI, UART, and USB buses. Ideal for industrial applications requiring a low-profile package with fine pitch grid array style.

32

I2C; SPI; UART; USB

32

FIXED POINT

S-PBGA-B338

e1

13 mm

3

338

85 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA338,19X19,25

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.35,1.8,3.3

Not Qualified

8192

1.3 mm

Digital Signal Processors

1.42 V

1.28 V

1.35 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.65 mm

BOTTOM

30

13 mm

MICROPROCESSOR CIRCUIT

TMS320DM369ZCEDF by Texas Instruments

TMS320DM369ZCEDF

Texas Instruments

TMS320DM369ZCEDF by Texas Instruments is a 32-bit microprocessor with 338 terminals, operating at temperatures from -40 to 85°C. It features 32768 RAM words, a 32-bit external data bus width, and supports Ethernet, I2C, SPI, UART, and USB buses. Ideal for industrial applications requiring a low-profile package with fine pitch grid array style.

32

ETHERNET; I2C; SPI; UART; USB

32

FIXED POINT

S-PBGA-B338

e1

13 mm

3

338

85 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA338,19X19,25

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.35,1.8,3.3

Not Qualified

32768

1.3 mm

Digital Signal Processors

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.65 mm

BOTTOM

30

13 mm

MICROPROCESSOR CIRCUIT

TMS320DM369ZCED by Texas Instruments

TMS320DM369ZCED

Texas Instruments

TMS320DM369ZCED by Texas Instruments is a 32-bit microprocessor with 338 terminals, operating at -40 to 85°C. It features 32768 RAM words, supports Ethernet, I2C, SPI, UART, and USB buses. Ideal for industrial applications requiring a low-profile grid array package with a 0.65mm terminal pitch.

32

ETHERNET; I2C; SPI; UART; USB

32

FIXED POINT

S-PBGA-B338

e1

13 mm

3

338

85 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA338,19X19,25

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.35,1.8,3.3

Not Qualified

32768

1.3 mm

Digital Signal Processors

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.65 mm

BOTTOM

30

13 mm

MICROPROCESSOR CIRCUIT

TMS320DM369ZCEF by Texas Instruments

TMS320DM369ZCEF

Texas Instruments

TMS320DM369ZCEF by Texas Instruments is a 32-bit microprocessor with 32768 RAM words. It operates at temperatures from -40 to 85 °C and supports Ethernet, I2C, SPI, UART, and USB buses. This low-profile IC in a square package is ideal for applications requiring high-speed data processing.

32

ETHERNET; I2C; SPI; UART; USB

32

FIXED POINT

S-PBGA-B338

e1

13 mm

3

338

85 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA338,19X19,25

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.35,1.8,3.3

Not Qualified

32768

1.3 mm

Digital Signal Processors

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

.65 mm

BOTTOM

30

13 mm

MICROPROCESSOR CIRCUIT

TMS320DM369ZCE by Texas Instruments

TMS320DM369ZCE

Texas Instruments

TMS320DM369ZCE by Texas Instruments is a 32-bit microprocessor with 338 terminals, operating b/w -40 to 85°C. It features 32768 RAM words, 0.65mm terminal pitch, and supports Ethernet, I2C, SPI, UART & USB buses. Ideal for applications requiring low profile grid array packages in CMOS technology.

32

ETHERNET; I2C; SPI; UART; USB

32

FIXED POINT

S-PBGA-B338

e1

13 mm

3

338

85 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA338,19X19,25

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.35,1.8,3.3

Not Qualified

32768

1.3 mm

Digital Signal Processors

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

.65 mm

BOTTOM

30

13 mm

MICROPROCESSOR CIRCUIT

XC7Z010-1CLG225C by Xilinx

XC7Z010-1CLG225C

Xilinx

The Xilinx XC7Z010-1CLG225C is a System on Chip with CMOS technology. It operates b/w 0-85°C, with supply voltage range of 0.95-1.05V. Ideal for applications requiring low profile, fine pitch grid array packages in plastic/epoxy material.

S-PBGA-B225

13 mm

225

85 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

BGA225,15X15,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

1.5 mm

1.05 V

.95 V

1 V

YES

CMOS

BALL

.8 mm

BOTTOM

13 mm

SYSTEM ON CHIP

XC7Z010-1CLG225I by Xilinx

XC7Z010-1CLG225I

Xilinx

The Xilinx XC7Z010-1CLG225I is a low-profile, fine-pitch grid array IC with 225 terminals. Operating b/w -40 to 100°C, it features a CMOS technology and requires a supply voltage of 0.95V to 1.05V. Ideal for System on Chip applications due to its compact size and ball terminal form factor.

S-PBGA-B225

13 mm

225

100 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA225,15X15,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

1.5 mm

1.05 V

.95 V

1 V

YES

CMOS

BALL

.8 mm

BOTTOM

13 mm

SYSTEM ON CHIP

XC7Z010-2CLG225I by Xilinx

XC7Z010-2CLG225I

Xilinx

XC7Z010-2CLG225I by Xilinx is a System on Chip with CMOS technology. It operates b/w -40 to 100 °C, with supply voltage range of 0.95V to 1.05V. Ideal for applications requiring low profile and fine pitch grid array packages in Other Function uPs,uCs & Peripheral ICs category.

S-PBGA-B225

13 mm

225

100 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA225,15X15,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

1.5 mm

1.05 V

.95 V

1 V

YES

CMOS

BALL

.8 mm

BOTTOM

13 mm

SYSTEM ON CHIP

XC7Z010-3CLG225E by Xilinx

XC7Z010-3CLG225E

Xilinx

The Xilinx XC7Z010-3CLG225E is a System on Chip with CMOS technology. It operates b/w 0-100°C, with supply voltage range of 0.95-1.05V. This low profile chip in a grid array package is ideal for various applications requiring high performance and compact design.

S-PBGA-B225

13 mm

225

100 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

BGA225,15X15,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

1.5 mm

1.05 V

.95 V

1 V

YES

CMOS

BALL

.8 mm

BOTTOM

13 mm

SYSTEM ON CHIP

CP3SP33SMR/NOPB by Texas Instruments

CP3SP33SMR/NOPB

Texas Instruments

CP3SP33SMR/NOPB by Texas Instruments is a 16-bit microprocessor with 32768 RAM bytes. Operating at speeds up to 96 rpm, it has a low profile grid array package style suitable for industrial applications. With a supply voltage range of 1.62V to 1.98V and operating temperature from -40°C to 85°C, it offers high performance in compact dimensions.

16

CR16C

S-PBGA-B144

e1

10 mm

3

144

85 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA144,12X12,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.8

Not Qualified

32768

1.4 mm

96 rpm

Microcontrollers

200 mA

1.98 V

1.62 V

1.8 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

10 mm

MICROPROCESSOR CIRCUIT

CP3SP33SMS/NOPB by Texas Instruments

CP3SP33SMS/NOPB

Texas Instruments

CP3SP33SMS/NOPB by Texas Instruments is a 16-bit microprocessor with 32-bit external data bus width, operating at speeds up to 96 rpm. It features a low profile grid array package style with 224 terminals and supports I2C, I2S, SPI, UART, and USB buses. Ideal for industrial applications requiring high-speed processing in a compact form factor.

16

I2C; I2S; SPI; UART; USB

CR16C

32

S-PBGA-B224

e0

13 mm

3

224

85 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA224,15X15,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.8

Not Qualified

32768

1.4 mm

96 rpm

Microcontrollers

200 mA

1.98 V

1.62 V

1.8 V

YES

CMOS

INDUSTRIAL

TIN LEAD

BALL

.8 mm

BOTTOM

30

13 mm

MICROPROCESSOR CIRCUIT

MTFC64GJVDN-4MIT by Micron Technology

MTFC64GJVDN-4MIT

Micron Technology

MTFC64GJVDN-4MIT by Micron Technology is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w -40 to 85 °C, with supply voltage range of 1.65V to 1.95V. This low profile, fine pitch GRID ARRAY package is ideal for industrial applications requiring high performance uPs and uCs.

IT ALSO OPERATES AT 3.3 VOLTS

R-PBGA-B169

e1

18 mm

169

85 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

RECTANGULAR

GRID ARRAY, LOW PROFILE, FINE PITCH

1.4 mm

1.95 V

1.65 V

1.8 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.5 mm

BOTTOM

14 mm

MICROPROCESSOR CIRCUIT

MTFC64GJDDN-4MIT by Micron Technology

MTFC64GJDDN-4MIT

Micron Technology

MTFC64GJDDN-4MIT by Micron Technology is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w -40 to 85 °C and has a supply voltage range of 1.65V to 1.95V, making it ideal for industrial applications requiring low profile, fine pitch GRID ARRAY package style.

IT ALSO OPERATES AT 3.3 VOLTS

R-PBGA-B169

e1

18 mm

169

85 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

RECTANGULAR

GRID ARRAY, LOW PROFILE, FINE PITCH

1.4 mm

1.95 V

1.65 V

1.8 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.5 mm

BOTTOM

14 mm

MICROPROCESSOR CIRCUIT

ADUCM350BBCZ by Analog Devices

ADUCM350BBCZ

Analog Devices

ADUCM350BBCZ by Analog Devices is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w -40 to 85 °C and has a supply voltage range of 2.5V to 3.6V, making it ideal for INDUSTRIAL applications requiring low profile, fine pitch GRID ARRAY package style.

S-PBGA-B120

e1

8 mm

3

120

85 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.35 mm

3.6 V

2.5 V

3 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.5 mm

BOTTOM

30

8 mm

MICROPROCESSOR CIRCUIT

TMS320DM368ZCEF by Texas Instruments

TMS320DM368ZCEF

Texas Instruments

TMS320DM368ZCEF by Texas Instruments is a 32-bit microprocessor with 8192 RAM words, operating b/w 0-85 °C. It supports I2C, SPI, UART, USB buses and has a terminal pitch of 0.65 mm. Ideal for applications requiring low profile, fine pitch package style in CMOS technology.

32

I2C; SPI; UART; USB

32

FIXED POINT

S-PBGA-B338

e1

13 mm

3

338

85 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

BGA338,19X19,25

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.35,1.8,3.3

Not Qualified

8192

1.3 mm

Digital Signal Processors

1.42 V

1.28 V

1.35 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

.65 mm

BOTTOM

30

13 mm

MICROPROCESSOR CIRCUIT

TMS320DM368ZCE by Texas Instruments

TMS320DM368ZCE

Texas Instruments

TMS320DM368ZCE by Texas Instruments is a 32-bit microprocessor with 8192 RAM words, operating at temperatures from 0 to 85°C. It supports I2C, SPI, UART, and USB buses for various applications requiring low profile and fine pitch package style. The processor has a supply voltage range of 1.28-1.8V and features a grid array package with a terminal pitch of 0.65mm.

32

I2C; SPI; UART; USB

32

FIXED POINT

S-PBGA-B338

e1

13 mm

3

338

85 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

BGA338,19X19,25

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.35,1.8,3.3

Not Qualified

8192

1.3 mm

Digital Signal Processors

1.42 V

1.28 V

1.35 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

.65 mm

BOTTOM

30

13 mm

MICROPROCESSOR CIRCUIT

TMS320DM355ZCE270 by Texas Instruments

TMS320DM355ZCE270

Texas Instruments

TMS320DM355ZCE270 by Texas Instruments is a 32-bit microprocessor with 337 terminals, operating at temperatures from 0 to 85°C. It features a max supply voltage of 1.365V and RAM words of 32768, suitable for applications requiring high processing power in compact spaces like embedded systems and IoT devices.

32

FIXED POINT

S-PBGA-B337

e1

13 mm

3

337

85 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

BGA337,19X19,25

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.3,1.8,3.3

Not Qualified

32768

1.3 mm

Digital Signal Processors

1.365 V

1.235 V

1.3 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

.65 mm

BOTTOM

30

13 mm

MICROPROCESSOR CIRCUIT

TMS320DM365ZCE21 by Texas Instruments

TMS320DM365ZCE21

Texas Instruments

MICROPROCESSOR CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 338; Package Code: LFBGA; Package Shape: SQUARE;

32

I2C; SPI; UART; USB

32

FIXED POINT

S-PBGA-B338

e1

13 mm

3

338

85 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA338,19X19,25

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.2,1.8,3.3

Not Qualified

8192

1.3 mm

Digital Signal Processors

1.26 V

1.14 V

1.2 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.65 mm

BOTTOM

30

13 mm

MICROPROCESSOR CIRCUIT

TMS320DM365ZCE30 by Texas Instruments

TMS320DM365ZCE30

Texas Instruments

TMS320DM365ZCE30 by Texas Instruments is a 32-bit microprocessor circuit with a max supply voltage of 1.42V. It is used in industrial applications and supports I2C, SPI, UART, and USB bus compatibility.

32

I2C; SPI; UART; USB

32

FIXED POINT

S-PBGA-B338

e1

13 mm

3

338

85 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA338,19X19,25

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.35,1.8,3.3

Not Qualified

8192

1.3 mm

Digital Signal Processors

1.42 V

1.28 V

1.35 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.65 mm

BOTTOM

30

13 mm

MICROPROCESSOR CIRCUIT

TMS320DM365ZCEF by Texas Instruments

TMS320DM365ZCEF

Texas Instruments

TMS320DM365ZCEF by Texas Instruments is a 32-bit microprocessor with 8192 RAM words. It operates at temperatures from -40 to 85 °C and supports I2C, SPI, UART, and USB buses. This industrial-grade chip has a package style of grid array with low profile and fine pitch terminals.

32

I2C; SPI; UART; USB

32

FIXED POINT

S-PBGA-B338

e1

13 mm

3

338

85 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA338,19X19,25

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.2,1.8,3.3

Not Qualified

8192

1.3 mm

Digital Signal Processors

1.26 V

1.14 V

1.2 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.65 mm

BOTTOM

30

13 mm

MICROPROCESSOR CIRCUIT

TMX320DM365BZCE by Texas Instruments

TMX320DM365BZCE

Texas Instruments

MICROPROCESSOR CIRCUIT; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 338; Package Code: LFBGA; Package Shape: SQUARE;

32

FIXED POINT

S-PBGA-B338

13 mm

338

85 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

BGA338,19X19,25

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

NOT SPECIFIED

1.2,1.8,3.3

Not Qualified

8192

1.3 mm

Digital Signal Processors

1.26 V

1.14 V

1.2 V

YES

CMOS

OTHER

BALL

.65 mm

BOTTOM

NOT SPECIFIED

13 mm

MICROPROCESSOR CIRCUIT

DM355SDZCE135 by Texas Instruments

DM355SDZCE135

Texas Instruments

The Texas Instruments DM355SDZCE135 is a 32-bit microprocessor with 8192 RAM words. It operates at temperatures from 0 to 85°C and has a max supply voltage of 1.365V. Ideal for applications requiring a low-profile, fine-pitch package style in CMOS technology.

IT ALSO OPERATES AT 1.8V AND 3.3V SUPPLY FOR I/O

32

FIXED POINT

S-PBGA-B337

e1

13 mm

3

337

85 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

BGA337,19X19,25

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.3,1.8,3.3

Not Qualified

8192

1.3 mm

Digital Signal Processors

1.365 V

1.235 V

1.3 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

.65 mm

BOTTOM

30

13 mm

MICROPROCESSOR CIRCUIT

DM355SDZCE216 by Texas Instruments

DM355SDZCE216

Texas Instruments

MICROPROCESSOR CIRCUIT; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 337; Package Code: LFBGA; Package Shape: SQUARE;

IT ALSO OPERATES AT 1.8V AND 3.3V SUPPLY FOR I/O

32

FIXED POINT

S-PBGA-B337

e1

13 mm

3

337

85 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

BGA337,19X19,25

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.3,1.8,3.3

Not Qualified

8192

1.3 mm

Digital Signal Processors

1.365 V

1.235 V

1.3 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

.65 mm

BOTTOM

30

13 mm

MICROPROCESSOR CIRCUIT

DM355SDZCE270 by Texas Instruments

DM355SDZCE270

Texas Instruments

The Texas Instruments DM355SDZCE270 is a 32-bit microprocessor with 8192 RAM words. It operates at temperatures from 0 to 85°C and has a max supply voltage of 1.365V. This MICROPROCESSOR CIRCUIT is ideal for applications requiring low profile, fine pitch package styles in surface mount configurations.

IT ALSO OPERATES AT 1.8V AND 3.3V SUPPLY FOR I/O

32

FIXED POINT

S-PBGA-B337

e1

13 mm

3

337

85 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

BGA337,19X19,25

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.3,1.8,3.3

Not Qualified

8192

1.3 mm

Digital Signal Processors

1.365 V

1.235 V

1.3 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

.65 mm

BOTTOM

30

13 mm

MICROPROCESSOR CIRCUIT

DM355SDZCEA216 by Texas Instruments

DM355SDZCEA216

Texas Instruments

DM355SDZCEA216 by Texas Instruments is a 32-bit microprocessor circuit with a max supply voltage of 1.365V. It is used in industrial applications and supports I2C, SPI, UART, and USB bus compatibility.

IT ALSO OPERATES AT 1.8V AND 3.3V SUPPLY FOR I/O

32

I2C; SPI; UART; USB

32

FIXED POINT

S-PBGA-B337

e1

13 mm

3

337

100 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA337,19X19,25

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.3,1.8,3.3

Not Qualified

8192

1.3 mm

Digital Signal Processors

1.365 V

1.235 V

1.3 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.65 mm

BOTTOM

30

13 mm

MICROPROCESSOR CIRCUIT