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LFBGA Other Function uPs,uCs & Peripheral ICs 334

Other Function uPs,uCs & Peripheral ICs
Part# Info Specs
Part RoHS Manufacturer Description ADC Channels Maximum Access Time Additional Features Address Bus Width Bit Size Boundary Scan Bus Compatibility CPU Family Maximum Clock Frequency DAC Channels DMA Channels External Data Bus Width Format Information Access Method Integrated Cache Interrupt Capability JESD-30 Code JESD-609 Code Length Low Power Mode Moisture Sensitivity Level (MSL) No. of Bits No. of DMA Channels No. of External Interrupts No. of I/O Lines No. of Ports No. of Serial I/Os No. of Terminals No. of Timers On Chip Data RAM Width On Chip Program ROM Width Maximum Operating Temperature Minimum Operating Temperature PWM Channels Package Body Material Package Code Package Equivalence Code Package Shape Package Style (Meter) Peak Reflow Temperature (C) Power Supplies (V) Qualification RAM Bytes RAM Words ROM Words ROM Programmability ROM Bits Size Screening Level Maximum Seated Height Speed Maximum Standby Current Sub-Category Maximum Supply Current Maximum Supply Voltage Minimum Supply Voltage Nominal Supply Voltage Surface Mount Technology Temperature Grade Terminal Finish Terminal Form Terminal Pitch Terminal Position Minimum Time Maximum Time At Peak Reflow Temperature (s) Total Dose (V) Ultraviolet Erasable Volatile Width Peripheral IC Type Data EEPROM Size Connectivity Peripherals Analog To Digital Convertors
AM4378BZDNA80 by Texas Instruments

AM4378BZDNA80

Texas Instruments

AM4378BZDNA80 by Texas Instruments is a SYSTEM ON CHIP with CMOS technology. It operates b/w -40 to 105 °C, with a supply voltage range of 1.21V to 1.326V. Ideal for applications requiring low profile and fine pitch package style in industrial settings.

S-PBGA-B491

e1

17 mm

3

491

105 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA491,25X25,25

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.3 mm

1.326 V

1.21 V

1.26 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.65 mm

BOTTOM

30

17 mm

SYSTEM ON CHIP

AM4378BZDND100 by Texas Instruments

AM4378BZDND100

Texas Instruments

AM4378BZDND100 by Texas Instruments is a System on Chip with 491 terminals, operating at -40 to 90°C. It features a low profile grid array package with 0.65mm terminal pitch. Ideal for industrial applications requiring CMOS technology and a supply voltage range of 1.272-1.378V.

S-PBGA-B491

e1

17 mm

3

491

90 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA491,25X25,25

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.3 mm

1.378 V

1.272 V

1.325 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.65 mm

BOTTOM

30

17 mm

SYSTEM ON CHIP

AM4378BZDND80 by Texas Instruments

AM4378BZDND80

Texas Instruments

AM4378BZDND80 by Texas Instruments is a SYSTEM ON CHIP with CMOS technology. It operates b/w -40 to 90 °C and has a supply voltage range of 1.21V to 1.326V. This IC, in GRID ARRAY package style, is ideal for industrial applications requiring low profile and fine pitch components.

S-PBGA-B491

e1

17 mm

3

491

90 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA491,25X25,25

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.3 mm

1.326 V

1.21 V

1.26 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.65 mm

BOTTOM

30

17 mm

SYSTEM ON CHIP

AM4379BZDNA100 by Texas Instruments

AM4379BZDNA100

Texas Instruments

AM4379BZDNA100 by Texas Instruments is a System on Chip with 491 terminals, operating at -40 to 105°C. It features a low profile grid array package, 0.65mm terminal pitch, and 1.272-1.378V supply voltage range. Ideal for industrial applications requiring high-performance uPs/uCs & peripheral ICs in compact form factors.

S-PBGA-B491

e1

17 mm

3

491

105 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA491,25X25,25

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.3 mm

1.378 V

1.272 V

1.325 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.65 mm

BOTTOM

30

17 mm

SYSTEM ON CHIP

AM4379BZDNA80 by Texas Instruments

AM4379BZDNA80

Texas Instruments

AM4379BZDNA80 by Texas Instruments is a SYSTEM ON CHIP with CMOS technology. It operates b/w -40 to 105 °C, with a supply voltage range of 1.21V to 1.326V. This low-profile, fine-pitch GRID ARRAY package is ideal for industrial applications requiring high performance in compact spaces.

S-PBGA-B491

e1

17 mm

3

491

105 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA491,25X25,25

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.3 mm

1.326 V

1.21 V

1.26 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.65 mm

BOTTOM

30

17 mm

SYSTEM ON CHIP

MCIMX6G0DVM05AA by NXP Semiconductors

MCIMX6G0DVM05AA

NXP Semiconductors

SYSTEM ON CHIP; Temperature Grade: COMMERCIAL; Terminal Form: BALL; No. of Terminals: 289; Package Code: LFBGA; Package Shape: SQUARE;

S-PBGA-B289

14 mm

3

289

95 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

BGA289,17X17,32

SQUARE

GRID ARRAY

260

1.32 mm

1.3 V

1.15 V

YES

CMOS

COMMERCIAL

BALL

.8 mm

BOTTOM

40

14 mm

SYSTEM ON CHIP

MCIMX6DP5EYM1AA by NXP Semiconductors

MCIMX6DP5EYM1AA

NXP Semiconductors

SoC; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 624; Package Code: LFBGA; Package Shape: SQUARE;

EACH GPIO MODULE SUPPORTS 32 BITS OF I/O.

S-PBGA-B624

e1

21 mm

3

624

105 Cel

-20 Cel

PLASTIC/EPOXY

LFBGA

BGA624,25X25,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.6 mm

1.5 V

1.35 V

1.4 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

40

21 mm

SoC

MCIMX6QP5EYM1AA by NXP Semiconductors

MCIMX6QP5EYM1AA

NXP Semiconductors

MCIMX6QP5EYM1AA by NXP Semiconductors is a low-profile, fine-pitch grid array SoC with 624 terminals. It operates b/w -20°C to 105°C, with supply voltage ranging from 1.35V to 1.5V. Ideal for applications requiring high-performance computing in compact spaces.

EACH GPIO MODULE SUPPORTS 32 BITS OF I/O.

S-PBGA-B624

e1

21 mm

3

624

105 Cel

-20 Cel

PLASTIC/EPOXY

LFBGA

BGA624,25X25,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.6 mm

1.5 V

1.35 V

1.4 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

40

21 mm

SoC

MCIMX6G1AVM05AA by NXP Semiconductors

MCIMX6G1AVM05AA

NXP Semiconductors

SYSTEM ON CHIP; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 289; Package Code: LFBGA; Package Shape: SQUARE;

S-PBGA-B289

14 mm

3

289

125 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA289,17X17,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.32 mm

1.3 V

1.15 V

YES

CMOS

AUTOMOTIVE

BALL

.8 mm

BOTTOM

40

14 mm

SYSTEM ON CHIP

MCIMX6G1AVM07AA by NXP Semiconductors

MCIMX6G1AVM07AA

NXP Semiconductors

SYSTEM ON CHIP; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 289; Package Code: LFBGA; Package Shape: SQUARE;

S-PBGA-B289

14 mm

3

289

125 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA289,17X17,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.32 mm

1.3 V

1.25 V

YES

CMOS

AUTOMOTIVE

BALL

.8 mm

BOTTOM

40

14 mm

SYSTEM ON CHIP

MCIMX6G2AVM05AA by NXP Semiconductors

MCIMX6G2AVM05AA

NXP Semiconductors

SYSTEM ON CHIP; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 289; Package Code: LFBGA; Package Shape: SQUARE;

S-PBGA-B289

14 mm

3

289

125 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA289,17X17,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.32 mm

1.3 V

1.15 V

YES

CMOS

AUTOMOTIVE

BALL

.8 mm

BOTTOM

40

14 mm

SYSTEM ON CHIP

MCIMX6G2AVM07AA by NXP Semiconductors

MCIMX6G2AVM07AA

NXP Semiconductors

SYSTEM ON CHIP; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 289; Package Code: LFBGA; Package Shape: SQUARE;

S-PBGA-B289

14 mm

3

289

125 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA289,17X17,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.32 mm

1.3 V

1.25 V

YES

CMOS

AUTOMOTIVE

BALL

.8 mm

BOTTOM

40

14 mm

SYSTEM ON CHIP

MCIMX6G1CVM05AA by NXP Semiconductors

MCIMX6G1CVM05AA

NXP Semiconductors

SYSTEM ON CHIP; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 289; Package Code: LFBGA; Package Shape: SQUARE;

S-PBGA-B289

e2

14 mm

3

289

105 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.32 mm

1.3 V

1.15 V

YES

CMOS

INDUSTRIAL

Tin/Silver (Sn/Ag)

BALL

.8 mm

BOTTOM

40

14 mm

SYSTEM ON CHIP

MCIMX6G2CVK05AA by NXP Semiconductors

MCIMX6G2CVK05AA

NXP Semiconductors

SYSTEM ON CHIP; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 272; Package Code: LFBGA; Package Shape: SQUARE;

S-PBGA-B272

9 mm

3

272

105 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.23 mm

1.3 V

1.15 V

YES

CMOS

INDUSTRIAL

BALL

.5 mm

BOTTOM

40

9 mm

SYSTEM ON CHIP

MCIMX6G2CVM05AA by NXP Semiconductors

MCIMX6G2CVM05AA

NXP Semiconductors

MCIMX6G2CVM05AA by NXP Semiconductors is a SYSTEM ON CHIP with CMOS technology. It operates b/w -40 to 105 °C, with supply voltage range of 1.15-1.3 V. Ideal for industrial applications requiring low profile and fine pitch GRID ARRAY package style.

S-PBGA-B289

14 mm

3

289

105 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.32 mm

1.3 V

1.15 V

YES

CMOS

INDUSTRIAL

BALL

.8 mm

BOTTOM

40

14 mm

SYSTEM ON CHIP

MCIMX6G3CVM05AA by NXP Semiconductors

MCIMX6G3CVM05AA

NXP Semiconductors

SYSTEM ON CHIP; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 289; Package Code: LFBGA; Package Shape: SQUARE;

S-PBGA-B289

14 mm

3

289

105 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA289,17X17,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.32 mm

1.3 V

1.15 V

YES

CMOS

INDUSTRIAL

BALL

.8 mm

BOTTOM

40

14 mm

SYSTEM ON CHIP

MCIMX7D7DVM10SC by NXP Semiconductors

MCIMX7D7DVM10SC

NXP Semiconductors

MCIMX7D7DVM10SC by NXP Semiconductors is a SYSTEM ON CHIP with 541 terminals, operating b/w 0-95°C. It has a supply voltage range of 1.045-1.25 V and uses BALL terminal form. Ideal for applications requiring low profile, fine pitch grid arrays in plastic/epoxy packages.

S-PBGA-B541

19 mm

3

541

95 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

BGA541,25X25,30

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.4 mm

1.25 V

1.045 V

1.1 V

YES

CMOS

OTHER

BALL

.75 mm

BOTTOM

40

19 mm

SYSTEM ON CHIP

AM4372BZDN60 by Texas Instruments

AM4372BZDN60

Texas Instruments

SYSTEM ON CHIP; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 491; Package Code: LFBGA; Package Shape: SQUARE;

S-PBGA-B491

e1

17 mm

3

491

90 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

BGA491,25X25,25

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.3 mm

1.144 V

1.056 V

1.1 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

.65 mm

BOTTOM

30

17 mm

SYSTEM ON CHIP

AM4372BZDN80 by Texas Instruments

AM4372BZDN80

Texas Instruments

AM4372BZDN80 by Texas Instruments is a SYSTEM ON CHIP with CMOS technology. It operates b/w 0-90°C, with supply voltage range of 1.21-1.326 V. Ideal for applications requiring low profile, fine pitch GRID ARRAY package style.

S-PBGA-B491

e1

17 mm

3

491

90 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

BGA491,25X25,25

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.3 mm

1.326 V

1.21 V

1.26 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

.65 mm

BOTTOM

30

17 mm

SYSTEM ON CHIP

AM4372BZDNA60 by Texas Instruments

AM4372BZDNA60

Texas Instruments

AM4372BZDNA60 by Texas Instruments is a System on Chip with 491 terminals in a low profile grid array package. It operates b/w -40 to 105°C, with supply voltage range of 1.056V to 1.144V. Ideal for industrial applications requiring high performance and reliability in compact designs.

S-PBGA-B491

e1

17 mm

3

491

105 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA491,25X25,25

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.3 mm

1.144 V

1.056 V

1.1 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.65 mm

BOTTOM

30

17 mm

SYSTEM ON CHIP

AM4372BZDNA80 by Texas Instruments

AM4372BZDNA80

Texas Instruments

AM4372BZDNA80 by Texas Instruments is a SYSTEM ON CHIP with CMOS technology. It operates b/w -40 to 105 °C and has a supply voltage range of 1.21V to 1.326V. This low profile, fine pitch GRID ARRAY package with 491 terminals is ideal for industrial applications requiring high performance and reliability.

S-PBGA-B491

e1

17 mm

3

491

105 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA491,25X25,25

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.3 mm

1.326 V

1.21 V

1.26 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.65 mm

BOTTOM

30

17 mm

SYSTEM ON CHIP

MCIMX6Y0CVM05AA by NXP Semiconductors

MCIMX6Y0CVM05AA

NXP Semiconductors

SYSTEM ON CHIP; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 289; Package Code: LFBGA; Package Shape: SQUARE;

24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE

S-PBGA-B289

14 mm

3

289

105 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA289,17X17,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.32 mm

1.5 V

1.275 V

YES

CMOS

INDUSTRIAL

BALL

.8 mm

BOTTOM

40

14 mm

SYSTEM ON CHIP

MCIMX6Y0DVM05AA by NXP Semiconductors

MCIMX6Y0DVM05AA

NXP Semiconductors

MCIMX6Y0DVM05AA by NXP Semiconductors is a SYSTEM ON CHIP with CMOS technology. It operates b/w 0-95 °C, with supply voltage range of 1.275-1.5 V. Ideal for applications requiring low profile, fine pitch GRID ARRAY package style.

S-PBGA-B289

14 mm

3

289

95 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

BGA289,17X17,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.32 mm

1.5 V

1.275 V

YES

CMOS

OTHER

BALL

.8 mm

BOTTOM

40

14 mm

SYSTEM ON CHIP

MCIMX6Y1CVK05AA by NXP Semiconductors

MCIMX6Y1CVK05AA

NXP Semiconductors

SoC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 272; Package Code: LFBGA; Package Shape: SQUARE;

S-PBGA-B272

9 mm

3

272

105 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA272,17X17,20

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.23 mm

1.5 V

1.275 V

YES

CMOS

INDUSTRIAL

BALL

.5 mm

BOTTOM

40

9 mm

SoC

MCIMX6Y1CVM05AA by NXP Semiconductors

MCIMX6Y1CVM05AA

NXP Semiconductors

SoC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 289; Package Code: LFBGA; Package Shape: SQUARE;

S-PBGA-B289

e1

14 mm

3

289

105 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA289,17X17,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.32 mm

1.5 V

1.275 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

40

14 mm

SoC

MCIMX6Y1DVK05AA by NXP Semiconductors

MCIMX6Y1DVK05AA

NXP Semiconductors

SoC; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 272; Package Code: LFBGA; Package Shape: SQUARE;

S-PBGA-B272

9 mm

3

272

95 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

BGA272,17X17,20

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.23 mm

1.5 V

1.275 V

YES

CMOS

OTHER

BALL

.5 mm

BOTTOM

40

9 mm

SoC

MCIMX6Y1DVM05AA by NXP Semiconductors

MCIMX6Y1DVM05AA

NXP Semiconductors

MCIMX6Y1DVM05AA by NXP Semiconductors is a low-profile, fine-pitch grid array SoC with 289 terminals. It operates b/w 0-95°C, with supply voltage ranging from 1.275-1.5V. Ideal for applications requiring high-performance computing in compact spaces.

S-PBGA-B289

14 mm

3

289

95 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

BGA289,17X17,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.32 mm

1.5 V

1.275 V

YES

CMOS

OTHER

BALL

.8 mm

BOTTOM

40

14 mm

SoC

MCIMX6Y2DVM05AA by NXP Semiconductors

MCIMX6Y2DVM05AA

NXP Semiconductors

MCIMX6Y2DVM05AA by NXP Semiconductors is a low-profile, fine-pitch grid array SoC with 289 terminals. Operating b/w 0-95°C, it supports a supply voltage range of 1.275-1.5V. Ideal for applications requiring high-performance computing in compact spaces.

S-PBGA-B289

14 mm

3

289

95 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

BGA289,17X17,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.32 mm

1.5 V

1.275 V

YES

CMOS

OTHER

BALL

.8 mm

BOTTOM

40

14 mm

SoC

MCIMX6Y7DVK05AA by NXP Semiconductors

MCIMX6Y7DVK05AA

NXP Semiconductors

MCIMX6Y7DVK05AA by NXP Semiconductors is a SYSTEM ON CHIP with CMOS technology. It operates b/w 0-95 °C, with supply voltage range of 1.275-1.5 V. Ideal for applications requiring low profile and fine pitch package style in a grid array format.

S-PBGA-B272

9 mm

3

272

95 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

BGA272,17X17,20

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.23 mm

1.5 V

1.275 V

YES

CMOS

OTHER

BALL

.5 mm

BOTTOM

40

9 mm

SYSTEM ON CHIP

ADSP-SC584BBCZ-4A by Analog Devices

ADSP-SC584BBCZ-4A

Analog Devices

MICROPROCESSOR CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 349; Package Code: LFBGA; Package Shape: SQUARE;

SPI; UART

500 MHz

S-PBGA-B349

19 mm

3

349

85 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA529,23X23,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.5 mm

1.15 V

1.05 V

1.1 V

YES

CMOS

INDUSTRIAL

BALL

.8 mm

BOTTOM

30

19 mm

MICROPROCESSOR CIRCUIT

ADSP-21583BBCZ-4A by Analog Devices

ADSP-21583BBCZ-4A

Analog Devices

ADSP-21583BBCZ-4A by Analog Devices is a MICROPROCESSOR CIRCUIT with 500 MHz clock frequency, suitable for SPI and UART bus compatibility. It operates in industrial temperature range (-40 to 85 °C) with low profile GRID ARRAY package style. The IC has 349 terminals on a 19x19 mm square body, making it ideal for high-performance applications.

SPI; UART

500 MHz

S-PBGA-B349

e1

19 mm

3

349

85 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA529,23X23,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.5 mm

1.15 V

1.05 V

1.1 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

19 mm

MICROPROCESSOR CIRCUIT

ADSP-21583CBCZ-4A by Analog Devices

ADSP-21583CBCZ-4A

Analog Devices

ADSP-21583CBCZ-4A by Analog Devices is a MICROPROCESSOR CIRCUIT with 500 MHz clock frequency, suitable for SPI and UART bus compatibility. It operates in industrial temperature range (-40 to 95 °C) with low profile GRID ARRAY package style.

SPI; UART

500 MHz

S-PBGA-B349

e1

19 mm

3

349

95 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA529,23X23,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.5 mm

1.15 V

1.05 V

1.1 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

19 mm

MICROPROCESSOR CIRCUIT

ADSP-21583KBCZ-4A by Analog Devices

ADSP-21583KBCZ-4A

Analog Devices

ADSP-21583KBCZ-4A by Analog Devices is a MICROPROCESSOR CIRCUIT with 349 terminals in a GRID ARRAY package. It operates at up to 500 MHz, with supply voltage range of 1.05V to 1.15V. Ideal for SPI and UART bus applications in commercial-grade environments.

SPI; UART

500 MHz

S-PBGA-B349

e1

19 mm

3

349

70 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

BGA529,23X23,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.5 mm

1.15 V

1.05 V

1.1 V

YES

CMOS

COMMERCIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

19 mm

MICROPROCESSOR CIRCUIT

ADSP-21584BBCZ-4A by Analog Devices

ADSP-21584BBCZ-4A

Analog Devices

ADSP-21584BBCZ-4A by Analog Devices is a MICROPROCESSOR CIRCUIT with 500 MHz clock frequency, suitable for SPI and UART bus compatibility. It operates in industrial temperature range (-40 to 85 °C) with low profile GRID ARRAY package style. The IC has 349 terminals, 0.8 mm pitch, and measures 19x19 mm for various applications.

SPI; UART

500 MHz

S-PBGA-B349

e1

19 mm

3

349

85 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA529,23X23,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.5 mm

1.15 V

1.05 V

1.1 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

19 mm

MICROPROCESSOR CIRCUIT

ADSP-21584CBCZ-4A by Analog Devices

ADSP-21584CBCZ-4A

Analog Devices

ADSP-21584CBCZ-4A by Analog Devices is a MICROPROCESSOR CIRCUIT with 500 MHz clock frequency, suitable for SPI and UART bus compatibility. It operates in industrial temperature range (-40 to 95 °C) with low profile grid array package style.

SPI; UART

500 MHz

S-PBGA-B349

e1

19 mm

3

349

95 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA529,23X23,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.5 mm

1.15 V

1.05 V

1.1 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

19 mm

MICROPROCESSOR CIRCUIT

ADSP-21584KBCZ-4A by Analog Devices

ADSP-21584KBCZ-4A

Analog Devices

ADSP-21584KBCZ-4A by Analog Devices is a MICROPROCESSOR CIRCUIT with 349 terminals, operating at up to 500 MHz clock frequency. It has a low profile GRID ARRAY package suitable for SPI and UART bus compatibility applications in commercial-grade environments.

SPI; UART

500 MHz

S-PBGA-B349

e1

19 mm

3

349

70 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

BGA529,23X23,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.5 mm

1.15 V

1.05 V

1.1 V

YES

CMOS

COMMERCIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

19 mm

MICROPROCESSOR CIRCUIT

ADSP-SC582BBCZ-4A by Analog Devices

ADSP-SC582BBCZ-4A

Analog Devices

ADSP-SC582BBCZ-4A by Analog Devices is a MICROPROCESSOR CIRCUIT with 500 MHz clock frequency, suitable for industrial applications. It operates b/w -40 to 85 °C and has SPI and UART bus compatibility. This CMOS technology device comes in a low profile GRID ARRAY package with 349 terminals on a 19mm square body.

SPI; UART

500 MHz

S-PBGA-B349

e1

19 mm

3

349

85 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA529,23X23,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.5 mm

1.15 V

1.05 V

1.1 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

19 mm

MICROPROCESSOR CIRCUIT

ADSP-SC582CBCZ-4A by Analog Devices

ADSP-SC582CBCZ-4A

Analog Devices

ADSP-SC582CBCZ-4A by Analog Devices is a MICROPROCESSOR CIRCUIT with 500 MHz clock frequency, suitable for SPI and UART bus compatibility. It operates in industrial temperature range (-40 to 95 °C) with low profile GRID ARRAY package style. Ideal for applications requiring high-speed processing and communication capabilities.

SPI; UART

500 MHz

S-PBGA-B349

e1

19 mm

3

349

95 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA529,23X23,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.5 mm

1.15 V

1.05 V

1.1 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

19 mm

MICROPROCESSOR CIRCUIT

ADSP-SC582KBCZ-4A by Analog Devices

ADSP-SC582KBCZ-4A

Analog Devices

ADSP-SC582KBCZ-4A by Analog Devices is a MICROPROCESSOR CIRCUIT with 500 MHz clock frequency, suitable for SPI and UART bus compatibility. It operates b/w 0 to 70 °C with a supply voltage range of 1.05V to 1.15V, making it ideal for commercial applications requiring high-speed processing in a compact GRID ARRAY package.

SPI; UART

500 MHz

S-PBGA-B349

e1

19 mm

3

349

70 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

BGA529,23X23,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.5 mm

1.15 V

1.05 V

1.1 V

YES

CMOS

COMMERCIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

19 mm

MICROPROCESSOR CIRCUIT

ADSP-SC583BBCZ-3A by Analog Devices

ADSP-SC583BBCZ-3A

Analog Devices

ADSP-SC583BBCZ-3A by Analog Devices is a MICROPROCESSOR CIRCUIT with 500 MHz clock frequency, suitable for industrial applications. It operates b/w -40 to 85 °C and has a supply voltage range of 1.05V to 1.15V. This low profile, fine pitch IC features SPI and UART bus compatibility in a square package with 349 terminals.

SPI; UART

500 MHz

S-PBGA-B349

e1

19 mm

3

349

85 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA529,23X23,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.5 mm

1.15 V

1.05 V

1.1 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

19 mm

MICROPROCESSOR CIRCUIT

ADSP-SC583BBCZ-4A by Analog Devices

ADSP-SC583BBCZ-4A

Analog Devices

ADSP-SC583BBCZ-4A by Analog Devices is a MICROPROCESSOR CIRCUIT with 500 MHz clock frequency, SPI and UART bus compatibility. It operates in industrial temperature range (-40 to 85 °C) with low profile GRID ARRAY package style. Ideal for applications requiring high-speed processing and communication capabilities.

SPI; UART

500 MHz

S-PBGA-B349

e1

19 mm

3

349

85 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA529,23X23,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.5 mm

1.15 V

1.05 V

1.1 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

19 mm

MICROPROCESSOR CIRCUIT

ADSP-SC583CBCZ-3A by Analog Devices

ADSP-SC583CBCZ-3A

Analog Devices

ADSP-SC583CBCZ-3A by Analog Devices is a MICROPROCESSOR CIRCUIT with 500 MHz clock frequency. It operates in industrial temperature range (-40 to 95 °C) and supports SPI and UART bus compatibility. The package has 349 terminals in a GRID ARRAY style, making it suitable for various applications requiring high performance and low profile design.

SPI; UART

500 MHz

S-PBGA-B349

e1

19 mm

3

349

95 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA529,23X23,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.5 mm

1.15 V

1.05 V

1.1 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

19 mm

MICROPROCESSOR CIRCUIT

ADSP-SC583CBCZ-4A by Analog Devices

ADSP-SC583CBCZ-4A

Analog Devices

ADSP-SC583CBCZ-4A by Analog Devices is a MICROPROCESSOR CIRCUIT with 500 MHz clock frequency, suitable for industrial applications. It operates b/w -40 to 95 °C and has a supply voltage range of 1.05V to 1.15V. This SQUARE package IC features 349 terminals in a GRID ARRAY style, making it ideal for SPI and UART bus compatibility.

SPI; UART

500 MHz

S-PBGA-B349

e1

19 mm

3

349

95 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA529,23X23,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.5 mm

1.15 V

1.05 V

1.1 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

19 mm

MICROPROCESSOR CIRCUIT

ADSP-SC583KBCZ-3A by Analog Devices

ADSP-SC583KBCZ-3A

Analog Devices

ADSP-SC583KBCZ-3A by Analog Devices is a MICROPROCESSOR CIRCUIT with 500 MHz clock frequency, suitable for SPI and UART bus compatibility. It operates b/w 0 to 70 °C, with a supply voltage range of 1.05V to 1.15V. The package style is GRID ARRAY, LOW PROFILE, FINE PITCH, making it ideal for compact electronic applications.

SPI; UART

500 MHz

S-PBGA-B349

e1

19 mm

3

349

70 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

BGA529,23X23,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.5 mm

1.15 V

1.05 V

1.1 V

YES

CMOS

COMMERCIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

19 mm

MICROPROCESSOR CIRCUIT

ADSP-SC583KBCZ-4A by Analog Devices

ADSP-SC583KBCZ-4A

Analog Devices

ADSP-SC583KBCZ-4A by Analog Devices is a 500 MHz microprocessor circuit with SPI and UART bus compatibility. It operates b/w 0 to 70 °C, with a supply voltage range of 1.05V to 1.15V. Ideal for applications requiring low profile, fine pitch grid array packages in commercial-grade environments.

SPI; UART

500 MHz

S-PBGA-B349

e1

19 mm

3

349

70 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

BGA529,23X23,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.5 mm

1.15 V

1.05 V

1.1 V

YES

CMOS

COMMERCIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

19 mm

MICROPROCESSOR CIRCUIT

ADSP-SC584BBCZ-3A by Analog Devices

ADSP-SC584BBCZ-3A

Analog Devices

ADSP-SC584BBCZ-3A by Analog Devices is a MICROPROCESSOR CIRCUIT with 500 MHz clock frequency, suitable for industrial applications. It operates b/w -40 to 85 °C and has SPI and UART bus compatibility. This CMOS technology device features a low profile grid array package with 349 terminals in a square shape.

SPI; UART

500 MHz

S-PBGA-B349

19 mm

3

349

85 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA529,23X23,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.5 mm

1.15 V

1.05 V

1.1 V

YES

CMOS

INDUSTRIAL

BALL

.8 mm

BOTTOM

30

19 mm

MICROPROCESSOR CIRCUIT

ADSP-SC584CBCZ-3A by Analog Devices

ADSP-SC584CBCZ-3A

Analog Devices

ADSP-SC584CBCZ-3A by Analog Devices is a MICROPROCESSOR CIRCUIT with 349 terminals, operating at up to 500 MHz clock frequency. It has a low profile GRID ARRAY package suitable for industrial applications like SPI and UART bus compatibility. With a temperature range of -40 to 95 °C, it offers high performance in various environments.

SPI; UART

500 MHz

S-PBGA-B349

19 mm

3

349

95 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA529,23X23,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.5 mm

1.15 V

1.05 V

1.1 V

YES

CMOS

INDUSTRIAL

BALL

.8 mm

BOTTOM

30

19 mm

MICROPROCESSOR CIRCUIT

ADSP-SC584CBCZ-4A by Analog Devices

ADSP-SC584CBCZ-4A

Analog Devices

MICROPROCESSOR CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 349; Package Code: LFBGA; Package Shape: SQUARE;

SPI; UART

500 MHz

S-PBGA-B349

19 mm

3

349

95 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA529,23X23,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.5 mm

1.15 V

1.05 V

1.1 V

YES

CMOS

INDUSTRIAL

BALL

.8 mm

BOTTOM

30

19 mm

MICROPROCESSOR CIRCUIT