Loading...

MT9M032C12STMU-DR

Onsemi

MT9M032C12STMU-DR by Onsemi

The Onsemi MT9M032C12STMU-DR image sensor features 2.20x2.20 um pixel size, 49.5 MHz master clock, and 70.1 dB dynamic range. Ideal for applications requiring a high-resolution CMOS sensor with a digital voltage output interface in a compact square package.

Median Price

$22.220

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 520 parts In-Stock

1+ parts

$22.220

100+ parts

$21.780

1k+ parts

$21.330

10k+ parts

-

520

$22.220

$21.780

$21.330

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,071 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,071

-

-

-

-

Digiode

USA . 561 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

561

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 409 parts In-Stock

1+ parts

$8.730

100+ parts

-

1k+ parts

-

10k+ parts

-

409

$8.730

-

-

-

Kulean Microsystems

USA . 4,957 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,957

-

-

-

-

TANS Electronics

Latvia . 3,249 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,249

-

-

-

-

Problanco Electronics

Mexico . 2,651 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,651

-

-

-

-

Perfect Parts

USA . 1,361 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,361

-

-

-

-

SupplyDigital Components

Austria . 1,190 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,190

-

-

-

-

UHIMA Technologies

Türkiye . 819 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

819

-

-

-

-

Corphita

USA . 505 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

505

-

-

-

-

Corohmni

South Africa . 390 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

390

-

-

-

-

Overview

Capture every moment with the MT9M032C12STMU-DR Image Sensor by Onsemi. This cutting-edge technology offers unparalleled quality and reliability, making it perfect for a wide range of applications. Whether you're in the automotive industry, security sector, or consumer electronics market, this sensor delivers exceptional performance and precise imaging capabilities. Trust Onsemi's expertise in image sensors to provide you with the value, benefits, and advantages you need to stay ahead of the competition. Elevate your products with the MT9M032C12STMU-DR and unleash the power of innovative imaging solutions.

Feature Benefit Bullets

Pixel Size (um): 2.20X2.20

This small pixel size allows for detailed and high-resolution images to be captured.

Maximum Supply Voltage: 1.9 V

The low maximum supply voltage ensures efficient power consumption and prolongs the lifespan of the sensor.

Master Clock: 49.5 MHz

The high master clock frequency enables fast data processing and image capture.

Body Width: 11.43 inch

The compact body width makes the sensor suitable for applications with limited space.

Sensors or Transducers Type: IMAGE SENSOR,CMOS

CMOS image sensors are known for their low power consumption and high integration capabilities, making this sensor a reliable choice.

Body Height: 2.3 mm

The slim body height allows for easy integration into different devices or systems.

Package Shape or Style: SQUARE

The square package shape provides a stable and secure mounting option for the sensor.

Minimum Supply Voltage: 1.7 V

The low minimum supply voltage ensures continued operation even under minimal power conditions.

Maximum Operating Temperature: 70 °C

The wide operating temperature range allows for the sensor to be used in various environmental conditions.

Horizontal Pixel: 1472

The high horizontal pixel count enables detailed and wide-angle image capture.

Output Range: 0.20-3.05V

The wide output range provides flexibility in signal processing and compatibility with different systems.

Output Type: DIGITAL VOLTAGE

Digital voltage output simplifies signal processing and integration into digital systems.

Minimum Operating Temperature: -30 °C

The low minimum operating temperature allows for the sensor to be used in cold environments without compromising performance.

Maximum Operating Current: 30 mA

The low operating current ensures minimal power consumption during operation.

Housing: CERAMIC

Ceramic housing provides durability and protection for the sensor against external factors.

Dynamic Range: 70.1 dB

The high dynamic range allows for the sensor to capture a wide range of light intensities accurately.

Vertical Pixel: 1096

The high vertical pixel count enables detailed and high-resolution image capture.

Body Length/Diameter: 11.43 mm

The compact body length or diameter makes the sensor easy to mount and integrate into different systems.

Optical Format (inch): 1/4.5

The optical format is suitable for capturing images with specific aspect ratios and resolutions.

Termination Type: SOLDER

Solder termination provides a reliable and secure connection for the sensor.

Output Interface Type: 2-WIRE INTERFACE

The 2-wire interface simplifies communication with external devices and systems.

Frame Rate: 60 fps

The high frame rate allows for smooth and real-time image capture and processing.

Array Type: FRAME

The frame array type enables simultaneous capture of multiple image frames for enhanced image quality and processing.

Mounting Feature: SURFACE MOUNT

Surface mounting feature allows for easy and secure installation of the sensor onto circuit boards or other surfaces.

Technical Specifications

Image Sensors MT9M032C12STMU-DR attributes and parameters. Explore more Image Sensors devices from Onsemi

Specs

Additional Features:

ELECTRONIC ROLLING SHUTTER, IT ALSO OPERATES AT ANALOG SUPPLY VOLTAGE 2.60-3.10 V

Array Type:

FRAME

Body Width:

11.43 inch

Body Height:

2.3 mm

Body Length/Diameter:

11.43 mm

Dynamic Range:

70.1 dB

Frame Rate:

60 fps

Horizontal Pixel:

1472

Housing:

CERAMIC

Master Clock:

49.5 MHz

Mounting Feature:

Maximum Operating Current:

30 mA

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-30 Cel

Optical Format (inch):

1/4.5

Output Interface Type:

2-WIRE INTERFACE

Output Range:

Output Type:

Package Shape or Style:

Pixel Size (um):

2.20X2.20

Sensors or Transducers Type:

Maximum Supply Voltage:

1.9 V

Minimum Supply Voltage:

1.7 V

Termination Type:

SOLDER

Vertical Pixel:

1096

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 20