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Texas Instruments Other Function uPs,uCs & Peripheral ICs 611

Other Function uPs,uCs & Peripheral ICs
Part# Info Specs
Part RoHS Manufacturer Description ADC Channels Maximum Access Time Additional Features Address Bus Width Bit Size Boundary Scan Bus Compatibility CPU Family Maximum Clock Frequency DAC Channels DMA Channels External Data Bus Width Format Integrated Cache JESD-30 Code JESD-609 Code Length Low Power Mode Moisture Sensitivity Level (MSL) No. of Bits No. of DMA Channels No. of External Interrupts No. of I/O Lines No. of Ports No. of Serial I/Os No. of Terminals No. of Timers On Chip Data RAM Width On Chip Program ROM Width Maximum Operating Temperature Minimum Operating Temperature PWM Channels Package Body Material Package Code Package Equivalence Code Package Shape Package Style (Meter) Peak Reflow Temperature (C) Power Supplies (V) Qualification RAM Bytes RAM Words ROM Words ROM Programmability ROM Bits Size Screening Level Maximum Seated Height Speed Maximum Standby Current Sub-Category Maximum Supply Current Maximum Supply Voltage Minimum Supply Voltage Nominal Supply Voltage Surface Mount Technology Temperature Grade Terminal Finish Terminal Form Terminal Pitch Terminal Position Maximum Time At Peak Reflow Temperature (s) Ultraviolet Erasable Width Peripheral IC Type Data EEPROM Size Connectivity Peripherals Analog To Digital Convertors
DM355SDZCE216 by Texas Instruments

DM355SDZCE216

Texas Instruments

MICROPROCESSOR CIRCUIT; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 337; Package Code: LFBGA; Package Shape: SQUARE;

IT ALSO OPERATES AT 1.8V AND 3.3V SUPPLY FOR I/O

32

FIXED POINT

S-PBGA-B337

e1

13 mm

3

337

85 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

BGA337,19X19,25

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.3,1.8,3.3

Not Qualified

8192

1.3 mm

Digital Signal Processors

1.365 V

1.235 V

1.3 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

.65 mm

BOTTOM

30

13 mm

MICROPROCESSOR CIRCUIT

DM355SDZCE270 by Texas Instruments

DM355SDZCE270

Texas Instruments

The Texas Instruments DM355SDZCE270 is a 32-bit microprocessor with 8192 RAM words. It operates at temperatures from 0 to 85°C and has a max supply voltage of 1.365V. This MICROPROCESSOR CIRCUIT is ideal for applications requiring low profile, fine pitch package styles in surface mount configurations.

IT ALSO OPERATES AT 1.8V AND 3.3V SUPPLY FOR I/O

32

FIXED POINT

S-PBGA-B337

e1

13 mm

3

337

85 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

BGA337,19X19,25

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.3,1.8,3.3

Not Qualified

8192

1.3 mm

Digital Signal Processors

1.365 V

1.235 V

1.3 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

.65 mm

BOTTOM

30

13 mm

MICROPROCESSOR CIRCUIT

DM355SDZCEA216 by Texas Instruments

DM355SDZCEA216

Texas Instruments

DM355SDZCEA216 by Texas Instruments is a 32-bit microprocessor circuit with a max supply voltage of 1.365V. It is used in industrial applications and supports I2C, SPI, UART, and USB bus compatibility.

IT ALSO OPERATES AT 1.8V AND 3.3V SUPPLY FOR I/O

32

I2C; SPI; UART; USB

32

FIXED POINT

S-PBGA-B337

e1

13 mm

3

337

100 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA337,19X19,25

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.3,1.8,3.3

Not Qualified

8192

1.3 mm

Digital Signal Processors

1.365 V

1.235 V

1.3 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.65 mm

BOTTOM

30

13 mm

MICROPROCESSOR CIRCUIT

TMS320DM355CZCE216 by Texas Instruments

TMS320DM355CZCE216

Texas Instruments

MICROPROCESSOR CIRCUIT; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 337; Package Code: LFBGA; Package Shape: SQUARE;

IT ALSO OPERATES AT 1.8V AND 3.3V SUPPLY FOR I/O

32

I2C; SPI; UART; USB

32

FIXED POINT

S-PBGA-B337

e1

13 mm

3

337

85 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

BGA337,19X19,25

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.3,1.8,3.3

Not Qualified

8192

1.3 mm

Digital Signal Processors

1.365 V

1.235 V

1.3 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

.65 mm

BOTTOM

30

13 mm

MICROPROCESSOR CIRCUIT

TMS320DM355CZCEA21 by Texas Instruments

TMS320DM355CZCEA21

Texas Instruments

TMS320DM355CZCEA21 by Texas Instruments is a 32-bit microprocessor with 337 terminals, operating at -40 to 100 °C. It features a 1.3 V nominal voltage, I2C, SPI, UART, USB compatibility and is ideal for industrial applications requiring a MICROPROCESSOR CIRCUIT in a SQUARE package with PLASTIC/EPOXY body material.

IT ALSO OPERATES AT 1.8V AND 3.3V SUPPLY FOR I/O

32

I2C; SPI; UART; USB

32

FIXED POINT

S-PBGA-B337

e1

13 mm

3

337

100 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA337,19X19,25

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.3,1.8,3.3

Not Qualified

8192

1.3 mm

Digital Signal Processors

1.365 V

1.235 V

1.3 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.65 mm

BOTTOM

30

13 mm

MICROPROCESSOR CIRCUIT

TMS320DM355DZCE216 by Texas Instruments

TMS320DM355DZCE216

Texas Instruments

TMS320DM355DZCE216 by Texas Instruments is a 32-bit microprocessor with 8192 RAM words. It operates at 1.3V nominal voltage and supports I2C, SPI, UART, and USB buses. Ideal for applications requiring low profile, fine pitch package style in the temperature range of 0-85°C.

IT ALSO OPERATES AT 1.8V AND 3.3V SUPPLY FOR I/O

32

I2C; SPI; UART; USB

32

FIXED POINT

S-PBGA-B337

e1

13 mm

3

337

85 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

BGA337,19X19,25

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.3,1.8,3.3

Not Qualified

8192

1.3 mm

Digital Signal Processors

1.365 V

1.235 V

1.3 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

.65 mm

BOTTOM

30

13 mm

MICROPROCESSOR CIRCUIT

TMS320DM355DZCE270 by Texas Instruments

TMS320DM355DZCE270

Texas Instruments

TMS320DM355DZCE270 by Texas Instruments is a 32-bit microprocessor with 8192 RAM words. It operates at temperatures from 0 to 85 °C and supports I2C, SPI, UART, and USB buses. This MICROPROCESSOR CIRCUIT has a package style of GRID ARRAY and is suitable for various applications requiring low profile and fine pitch components.

IT ALSO OPERATES AT 1.8V AND 3.3V SUPPLY FOR I/O

32

I2C; SPI; UART; USB

32

FIXED POINT

S-PBGA-B337

e1

13 mm

3

337

85 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

BGA337,19X19,25

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.3,1.8,3.3

Not Qualified

8192

1.3 mm

Digital Signal Processors

1.365 V

1.235 V

1.3 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

.65 mm

BOTTOM

30

13 mm

MICROPROCESSOR CIRCUIT

TMS320DM355DZCEA21 by Texas Instruments

TMS320DM355DZCEA21

Texas Instruments

TMS320DM355DZCEA21 by Texas Instruments is a 32-bit microprocessor with 8192 RAM words. It operates at temperatures from -40 to 100°C and supports I2C, SPI, UART, and USB buses. This industrial-grade IC has a package style of grid array with low profile and fine pitch for various applications.

IT ALSO OPERATES AT 1.8V AND 3.3V SUPPLY FOR I/O

32

I2C; SPI; UART; USB

32

FIXED POINT

S-PBGA-B337

e1

13 mm

3

337

100 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA337,19X19,25

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.3,1.8,3.3

Not Qualified

8192

1.3 mm

Digital Signal Processors

1.365 V

1.235 V

1.3 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.65 mm

BOTTOM

30

13 mm

MICROPROCESSOR CIRCUIT

TMX320DM355ZCE216 by Texas Instruments

TMX320DM355ZCE216

Texas Instruments

MICROPROCESSOR CIRCUIT; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 337; Package Code: LFBGA; Package Shape: SQUARE;

32

FIXED POINT

S-PBGA-B337

13 mm

337

85 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

BGA337,19X19,25

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

NOT SPECIFIED

1.3,1.8,3.3

Not Qualified

32768

1.3 mm

Digital Signal Processors

1.365 V

1.235 V

1.3 V

YES

CMOS

OTHER

BALL

.65 mm

BOTTOM

NOT SPECIFIED

13 mm

MICROPROCESSOR CIRCUIT

TMX320DM355ZCE270 by Texas Instruments

TMX320DM355ZCE270

Texas Instruments

Texas Instruments TMX320DM355ZCE270 is a 32-bit microprocessor with 337 terminals, operating at temperatures from 0 to 85°C. It features a max supply voltage of 1.365V and RAM words of 32768, suitable for MICROPROCESSOR CIRCUIT applications in various industries.

32

FIXED POINT

S-PBGA-B337

13 mm

337

85 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

BGA337,19X19,25

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

NOT SPECIFIED

1.3,1.8,3.3

Not Qualified

32768

1.3 mm

Digital Signal Processors

1.365 V

1.235 V

1.3 V

YES

CMOS

OTHER

BALL

.65 mm

BOTTOM

NOT SPECIFIED

13 mm

MICROPROCESSOR CIRCUIT

SM32DM355GCEM216EP by Texas Instruments

SM32DM355GCEM216EP

Texas Instruments

Texas Instruments SM32DM355GCEM216EP is a 32-bit microprocessor with 8192 RAM words. It operates b/w -55 to 125 °C and supports I2C, SPI, UART, USB buses. Ideal for military-grade applications due to its CMOS technology and low profile grid array package style.

32

I2C; SPI; UART; USB

32

FIXED POINT

S-PBGA-B337

e0

13 mm

3

337

125 Cel

-55 Cel

PLASTIC/EPOXY

LFBGA

BGA337,19X19,25

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.3,1.8,3.3

8192

1.3 mm

Digital Signal Processors

1.365 V

1.235 V

1.3 V

YES

CMOS

MILITARY

TIN LEAD

BALL

.65 mm

BOTTOM

13 mm

MICROPROCESSOR CIRCUIT

TMS320DM6441AZWT by Texas Instruments

TMS320DM6441AZWT

Texas Instruments

TMS320DM6441AZWT by Texas Instruments is a 32-bit microprocessor with 16384 RAM words, operating at temperatures from 0 to 85°C. It features a package style of grid array, low profile, fine pitch and supports bus compatibility with Ethernet, I2C, SPI, UART, and USB. Ideal for applications requiring high-performance processing in compact spaces.

DSP, C64X-594 MHZ, 32-BIT, 4752 MIPS; ARM926EJ-S, 297 MHZ ,32-BIT; ALSO REQUIRES 3.3V I/O SUPPLY

32

ETHERNET; I2C; SPI; UART; USB

48

FIXED POINT

S-PBGA-B361

e1

16 mm

3

361

85 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

BGA361,19X19,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.2,1.8,3.3

Not Qualified

16384

1.4 mm

Digital Signal Processors

1.1 V

1 V

1.05 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

16 mm

MICROPROCESSOR CIRCUIT

TMS320DM6446BZWTA by Texas Instruments

TMS320DM6446BZWTA

Texas Instruments

TMS320DM6446BZWTA by Texas Instruments is a 32-bit microprocessor with 1.2-3.3V power supplies, 16mm width, and 48-bit external data bus width. Ideal for industrial applications, it features a max operating temperature of 105°C and supports I2C, SPI, UART, and USB bus compatibility.

32

I2C; SPI; UART; USB

48

FIXED POINT

S-PBGA-B361

e1

16 mm

3

361

105 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA361,19X19,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.2,1.8,3.3

Not Qualified

16384

1.4 mm

Digital Signal Processors

1.26 V

1.14 V

1.2 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

16 mm

MICROPROCESSOR CIRCUIT

TCI6630K2LCMSA2 by Texas Instruments

TCI6630K2LCMSA2

Texas Instruments

TCI6630K2LCMSA2 by Texas Instruments is a CMOS microprocessor circuit with 900 terminals in a grid array package. It operates b/w 0.902V to 0.997V and can withstand peak reflow temperature of 245°C for up to 30s. Ideal for high-performance computing applications requiring advanced processing capabilities.

S-PBGA-B900

e1

4

900

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

245

.997 V

.902 V

.95 V

YES

CMOS

TIN SILVER COPPER

BALL

BOTTOM

30

MICROPROCESSOR CIRCUIT

TCI6630K2LCMS by Texas Instruments

TCI6630K2LCMS

Texas Instruments

TCI6630K2LCMS by Texas Instruments is a MICROPROCESSOR CIRCUIT with 900 terminals in a GRID ARRAY package. It operates at a supply voltage range of 0.902V to 0.997V and can withstand peak reflow temperatures up to 245°C. Ideal for high-performance computing applications requiring advanced processing capabilities.

S-PBGA-B900

e1

4

900

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

245

.997 V

.902 V

.95 V

YES

CMOS

TIN SILVER COPPER

BALL

BOTTOM

30

MICROPROCESSOR CIRCUIT

TCI6630K2LDCMSA2 by Texas Instruments

TCI6630K2LDCMSA2

Texas Instruments

TCI6630K2LDCMSA2 by Texas Instruments is a MICROPROCESSOR CIRCUIT with 900 terminals in a GRID ARRAY package. It operates at supply voltages ranging from 0.902V to 0.997V and can withstand peak reflow temperatures up to 245°C. This IC is suitable for applications requiring high-performance processing capabilities in electronic systems.

S-PBGA-B900

e1

4

900

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

245

.997 V

.902 V

.95 V

YES

CMOS

TIN SILVER COPPER

BALL

BOTTOM

30

MICROPROCESSOR CIRCUIT

TCI6630K2LDCMSA by Texas Instruments

TCI6630K2LDCMSA

Texas Instruments

Texas Instruments TCI6630K2LDCMSA is a CMOS MICROPROCESSOR CIRCUIT with 900 BALL terminals in a GRID ARRAY package. It operates b/w 0.902V to 0.997V, with a peak reflow temperature of 245°C. Ideal for applications requiring high-performance processing capabilities in compact electronic devices.

S-PBGA-B900

e1

4

900

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

245

.997 V

.902 V

.95 V

YES

CMOS

TIN SILVER COPPER

BALL

BOTTOM

30

MICROPROCESSOR CIRCUIT

TCI6630K2LSCMSA2 by Texas Instruments

TCI6630K2LSCMSA2

Texas Instruments

TCI6630K2LSCMSA2 by Texas Instruments is a MICROPROCESSOR CIRCUIT with CMOS technology. It features 900 terminals in a GRID ARRAY package style, suitable for surface mount applications. Operating b/w 0.902V to 0.997V, it offers high performance in various electronic systems.

S-PBGA-B900

e1

4

900

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

245

.997 V

.902 V

.95 V

YES

CMOS

TIN SILVER COPPER

BALL

BOTTOM

30

MICROPROCESSOR CIRCUIT

TCI6630K2LSCMSA by Texas Instruments

TCI6630K2LSCMSA

Texas Instruments

TCI6630K2LSCMSA by Texas Instruments is a MICROPROCESSOR CIRCUIT with 900 terminals in a GRID ARRAY package. It operates at supply voltages ranging from 0.902V to 0.997V and can withstand peak reflow temperatures up to 245°C. This IC is suitable for applications requiring high-performance processing capabilities in compact electronic devices.

S-PBGA-B900

e1

4

900

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

245

.997 V

.902 V

.95 V

YES

CMOS

TIN SILVER COPPER

BALL

BOTTOM

30

MICROPROCESSOR CIRCUIT

TCI6630K2LXCMS2 by Texas Instruments

TCI6630K2LXCMS2

Texas Instruments

TCI6630K2LXCMS2 by Texas Instruments is a MICROPROCESSOR CIRCUIT with 900 terminals in a GRID ARRAY package. It operates on a supply voltage range of 0.902V to 0.997V, making it suitable for high-performance computing applications requiring advanced CMOS technology and surface mount compatibility. With a peak reflow temperature of 245°C, this device offers reliable performance in demanding environments.

S-PBGA-B900

e1

4

900

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

245

.997 V

.902 V

.95 V

YES

CMOS

TIN SILVER COPPER

BALL

BOTTOM

30

MICROPROCESSOR CIRCUIT

TCI6630K2LXCMSA2 by Texas Instruments

TCI6630K2LXCMSA2

Texas Instruments

Texas Instruments TCI6630K2LXCMSA2 is a MICROPROCESSOR CIRCUIT with 900 terminals in a GRID ARRAY package. It operates at supply voltages b/w 0.902V to 0.997V, utilizing CMOS technology. Ideal for applications requiring high-performance computing in compact form factors.

S-PBGA-B900

e1

4

900

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

245

.997 V

.902 V

.95 V

YES

CMOS

TIN SILVER COPPER

BALL

BOTTOM

30

MICROPROCESSOR CIRCUIT

TCI6630K2LXCMSA by Texas Instruments

TCI6630K2LXCMSA

Texas Instruments

TCI6630K2LXCMSA by Texas Instruments is a microprocessor circuit with a max supply voltage of 0.997V and a min supply voltage of 0.902V. It is used in applications requiring high-performance processing capabilities.

S-PBGA-B900

e1

4

900

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

245

.997 V

.902 V

.95 V

YES

CMOS

TIN SILVER COPPER

BALL

BOTTOM

30

MICROPROCESSOR CIRCUIT

TCI6630K2LXCMS by Texas Instruments

TCI6630K2LXCMS

Texas Instruments

TCI6630K2LXCMS by Texas Instruments is a MICROPROCESSOR CIRCUIT with 900 terminals in a GRID ARRAY package. It operates at supply voltages ranging from 0.902V to 0.997V and can withstand peak reflow temperatures up to 245°C. Ideal for applications requiring high-performance processing capabilities in compact electronic devices.

S-PBGA-B900

e1

4

900

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

245

.997 V

.902 V

.95 V

YES

CMOS

TIN SILVER COPPER

BALL

BOTTOM

30

MICROPROCESSOR CIRCUIT

MSP430F67491IPEUR by Texas Instruments

MSP430F67491IPEUR

Texas Instruments

MSP430F67491IPEUR by Texas Instruments is a CMOS microprocessor circuit with 128 terminals. It operates b/w -40 to 85 °C and has a supply voltage range of 2.4V to 3.6V, making it ideal for industrial applications requiring low power consumption and high performance in a compact package.

IT ALSO OPERATES IN 1.8V MINIMUM SUPPLY

R-PQFP-G128

e4

20 mm

3

128

85 Cel

-40 Cel

PLASTIC/EPOXY

LFQFP

RECTANGULAR

FLATPACK, LOW PROFILE, FINE PITCH

260

1.6 mm

3.6 V

2.4 V

3.3 V

YES

CMOS

INDUSTRIAL

NICKEL PALLADIUM GOLD

GULL WING

.5 mm

QUAD

30

14 mm

MICROPROCESSOR CIRCUIT

MSP430F67491IPEU by Texas Instruments

MSP430F67491IPEU

Texas Instruments

MICROPROCESSOR CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 128; Package Code: LFQFP; Package Shape: RECTANGULAR;

YES

IT ALSO OPERATES IN 1.8V MINIMUM SUPPLY

I2C; SPI; UART

MSP430

0

R-PQFP-G128

e4

20 mm

3

128

85 Cel

-40 Cel

PLASTIC/EPOXY

LFQFP

RECTANGULAR

FLATPACK, LOW PROFILE, FINE PITCH

260

32768

32

1.6 mm

3.6 V

2.4 V

3.3 V

YES

CMOS

INDUSTRIAL

NICKEL PALLADIUM GOLD

GULL WING

.5 mm

QUAD

30

14 mm

MICROPROCESSOR CIRCUIT

MSP430F67491IPZR by Texas Instruments

MSP430F67491IPZR

Texas Instruments

MSP430F67491IPZR by Texas Instruments is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w -40 to 85 °C, with supply voltage range of 2.4-3.6 V. Ideal for industrial applications due to its low profile and fine pitch package style.

IT ALSO OPERATES IN 1.8V MINIMUM SUPPLY

S-PQFP-G100

e4

14 mm

3

100

85 Cel

-40 Cel

PLASTIC/EPOXY

LFQFP

SQUARE

FLATPACK, LOW PROFILE, FINE PITCH

260

1.6 mm

3.6 V

2.4 V

3.3 V

YES

CMOS

INDUSTRIAL

NICKEL PALLADIUM GOLD

GULL WING

.5 mm

QUAD

30

14 mm

MICROPROCESSOR CIRCUIT

NN325TRHARQ1 by Texas Instruments

NN325TRHARQ1

Texas Instruments

NN325TRHARQ1 by Texas Instruments is a 40-terminal microprocessor circuit with CMOS technology. It operates b/w -40 to 105 °C, supporting ADC channels and a clock frequency of up to 16 MHz. Ideal for industrial applications requiring I2C, SPI, or UART bus compatibility in a compact chip carrier package.

YES

I2C; SPI; UART

16 MHz

0

S-PQCC-N40

e4

6 mm

3

40

105 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

1024

AEC-Q100

1 mm

3.6 V

1.8 V

2.7 V

YES

CMOS

INDUSTRIAL

NICKEL PALLADIUM GOLD

NO LEAD

.5 mm

QUAD

30

6 mm

MICROPROCESSOR CIRCUIT

TMS320DM6446AZWTA by Texas Instruments

TMS320DM6446AZWTA

Texas Instruments

TMS320DM6446AZWTA by Texas Instruments is a 32-bit microprocessor with 1.2-3.3V power supplies, 16mm width, and 48-bit external data bus width. Ideal for industrial applications, it features I2C, SPI, UART, USB compatibility and operates in temperatures ranging from -40 to 105°C.

DSP, C64X-594 MHZ, 32-BIT, 4752 MIPS; ARM926EJ-S, 297 MHZ ,32-BIT; ALSO REQUIRES 3.3V I/O SUPPLY

32

I2C; SPI; UART; USB

48

FIXED POINT

S-PBGA-B361

e1

16 mm

3

361

105 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA361,19X19,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.2,1.8,3.3

Not Qualified

16384

1.4 mm

Digital Signal Processors

1.26 V

1.14 V

1.2 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

16 mm

MICROPROCESSOR CIRCUIT

TMS320DM6446AZWT by Texas Instruments

TMS320DM6446AZWT

Texas Instruments

TMS320DM6446AZWT by Texas Instruments is a 32-bit microprocessor with 1.2-3.3V power supplies, 16384 RAM words, and 48-bit external data bus width. Ideal for applications requiring MICROPROCESSOR CIRCUIT technology, such as I2C, SPI, UART, and USB bus compatibility in a compact GRID ARRAY package style.

DSP, C64X-594 MHZ, 32-BIT, 4752 MIPS; ARM926EJ-S, 297 MHZ ,32-BIT; ALSO REQUIRES 3.3V I/O SUPPLY

32

I2C; SPI; UART; USB

48

FIXED POINT

S-PBGA-B361

e1

16 mm

3

361

85 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

BGA361,19X19,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.2,1.8,3.3

Not Qualified

16384

1.4 mm

Digital Signal Processors

1.26 V

1.14 V

1.2 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

16 mm

MICROPROCESSOR CIRCUIT

P82B715DG4 by Texas Instruments

P82B715DG4

Texas Instruments

P82B715DG4 by Texas Instruments is an 8-terminal IC with a supply voltage range of 4.5V to 12V, operating b/w -40°C to 85°C. It features I2C bus compatibility, clock frequency up to 0.4MHz, and is ideal for industrial applications requiring microprocessor circuits in a small outline package.

VCCB(Min)(V) is 3, VCCB(Max)(V) is 12

I2C

.4 MHz

0

R-PDSO-G8

e4

4.9 mm

1

8

85 Cel

-40 Cel

PLASTIC/EPOXY

SOP

RECTANGULAR

SMALL OUTLINE

260

Not Qualified

1.75 mm

12 V

4.5 V

5 V

YES

BIPOLAR

INDUSTRIAL

Nickel/Palladium/Gold (Ni/Pd/Au)

GULL WING

1.27 mm

DUAL

NOT SPECIFIED

3.9 mm

MICROPROCESSOR CIRCUIT

P82B715PE4 by Texas Instruments

P82B715PE4

Texas Instruments

The Texas Instruments P82B715PE4 is an 8-terminal MICROPROCESSOR CIRCUIT with I2C bus compatibility. It operates b/w -40 to 85 °C, supporting a clock frequency of up to 0.4 MHz. Ideal for industrial applications requiring a supply voltage range of 4.5-12 V in a compact rectangular package style.

VCCB(Min)(V) is 3, VCCB(Max)(V) is 12

I2C

.4 MHz

0

R-PDIP-T8

e4

9.81 mm

1

8

85 Cel

-40 Cel

PLASTIC/EPOXY

DIP

RECTANGULAR

IN-LINE

260

Not Qualified

5.08 mm

12 V

4.5 V

5 V

NO

BIPOLAR

INDUSTRIAL

Nickel/Palladium/Gold (Ni/Pd/Au)

THROUGH-HOLE

2.54 mm

DUAL

NOT SPECIFIED

7.62 mm

MICROPROCESSOR CIRCUIT

TMS320DM6443AZWT by Texas Instruments

TMS320DM6443AZWT

Texas Instruments

TMS320DM6443AZWT by Texas Instruments is a 32-bit microprocessor with 1.2-3.3V power supplies, 16mm width, and 48-bit external data bus width. Ideal for applications requiring MICROPROCESSOR CIRCUIT technology, such as Ethernet, I2C, SPI, UART, and USB interfaces in a compact GRID ARRAY package style.

DSP, C64X-594 MHZ, 32-BIT, 4752 MIPS; ARM926EJ-S, 297 MHZ , 32-BIT; ALSO REQUIRES 3.3V I/O SUPPLY

32

ETHERNET; I2C; SPI; UART; USB

48

FIXED POINT

S-PBGA-B361

e1

16 mm

3

361

85 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

BGA361,19X19,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.2,1.8,3.3

Not Qualified

16384

1.4 mm

Digital Signal Processors

1.26 V

1.14 V

1.2 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

16 mm

MICROPROCESSOR CIRCUIT

TIR1000PWRG4 by Texas Instruments

TIR1000PWRG4

Texas Instruments

TIR1000PWRG4 by Texas Instruments is a MICROPROCESSOR CIRCUIT with 3/5V power supplies, suitable for UART bus compatibility. It operates b/w 0-70°C, has a small outline package style, and features dual terminal position. Ideal for applications requiring low power consumption and compact design.

CAN ALSO OPERATE AT 5V SUPPLY

UART

R-PDSO-G8

e4

4.4 mm

1

8

70 Cel

0 Cel

PLASTIC/EPOXY

TSSOP

TSSOP8,.25

RECTANGULAR

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

260

3/5

Not Qualified

1.2 mm

Serial IO/Communication Controllers

3.3 V

2.7 V

3 V

YES

CMOS

COMMERCIAL

NICKEL PALLADIUM GOLD

GULL WING

.65 mm

DUAL

30

3 mm

MICROPROCESSOR CIRCUIT

TMS320DM335ZCE135 by Texas Instruments

TMS320DM335ZCE135

Texas Instruments

MICROPROCESSOR CIRCUIT; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 337; Package Code: LFBGA; Package Shape: SQUARE;

32

FIXED POINT

S-PBGA-B337

e1

13 mm

3

337

85 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

BGA337,19X19,25

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.3,1.8,3.3

Not Qualified

32768

1.3 mm

Digital Signal Processors

1.365 V

1.235 V

1.3 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

.65 mm

BOTTOM

30

13 mm

MICROPROCESSOR CIRCUIT

TMS320DM335ZCE270 by Texas Instruments

TMS320DM335ZCE270

Texas Instruments

TMS320DM335ZCE270 by Texas Instruments is a 32-bit microprocessor with 337 terminals, operating at temperatures from 0 to 85°C. It supports I2C, SPI, UART, and USB buses and has a supply voltage range of 1.235V to 1.365V. Ideal for applications requiring high-performance computing in compact spaces.

I2C; SPI; UART; USB

32

S-PBGA-B337

e1

13 mm

3

337

85 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

Not Qualified

1.3 mm

1.365 V

1.235 V

1.3 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

.65 mm

BOTTOM

30

13 mm

MICROPROCESSOR CIRCUIT

DM368ZCEDZ by Texas Instruments

DM368ZCEDZ

Texas Instruments

The Texas Instruments DM368ZCEDZ is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w -40 to 85 °C and has a supply voltage range of 1.28V to 1.42V. This IC is ideal for industrial applications requiring a low profile, fine pitch GRID ARRAY package style.

S-PBGA-B338

e1

13 mm

3

338

85 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.3 mm

1.42 V

1.28 V

1.35 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.65 mm

BOTTOM

30

13 mm

MICROPROCESSOR CIRCUIT

DM368ZCEZ by Texas Instruments

DM368ZCEZ

Texas Instruments

The Texas Instruments DM368ZCEZ is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w 0-85 °C and has a supply voltage range of 1.28-1.42 V, making it suitable for various applications requiring low profile, fine pitch GRID ARRAY packages.

S-PBGA-B338

e1

13 mm

3

338

85 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.3 mm

1.42 V

1.28 V

1.35 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

.65 mm

BOTTOM

30

13 mm

MICROPROCESSOR CIRCUIT

DM6446ANB6C2127VC by Texas Instruments

DM6446ANB6C2127VC

Texas Instruments

DM6446ANB6C2127VC by Texas Instruments is a microprocessor circuit with a package style of grid array, low profile, fine pitch. It operates at a max supply voltage of 1.26V and has a min operating temperature of 0°C. This IC is commonly used in various applications requiring high-performance processing capabilities.

S-PBGA-B361

e1

16 mm

3

361

85 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.4 mm

1.26 V

1.14 V

1.2 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

16 mm

MICROPROCESSOR CIRCUIT

DM6446AZWTKEDACOM by Texas Instruments

DM6446AZWTKEDACOM

Texas Instruments

MICROPROCESSOR CIRCUIT; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 361; Package Code: LFBGA; Package Shape: SQUARE;

S-PBGA-B361

e1

16 mm

3

361

85 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.4 mm

1.26 V

1.14 V

1.2 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

16 mm

MICROPROCESSOR CIRCUIT

DM6446GB6C0121MV by Texas Instruments

DM6446GB6C0121MV

Texas Instruments

DM6446GB6C0121MV by Texas Instruments is a MICROPROCESSOR CIRCUIT with 361 terminals in a GRID ARRAY package. It operates b/w 0-85 °C, with supply voltage range of 1.14-1.26 V. Ideal for applications requiring low profile and fine pitch technology.

S-PBGA-B361

e1

16 mm

3

361

85 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.4 mm

1.26 V

1.14 V

1.2 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

16 mm

MICROPROCESSOR CIRCUIT

DM8147SCIS0 by Texas Instruments

DM8147SCIS0

Texas Instruments

The Texas Instruments DM8147SCIS0 is a MICROPROCESSOR CIRCUIT with 684 terminals in a GRID ARRAY package. It operates b/w 0-90 °C, with a supply voltage range of 3.14-3.47 V. Suitable for applications requiring ETHERNET, I2C, SPI, UART, USB compatibility at speeds up to 1000 rpm.

IT ALSO OPERATES IN 1.71V MINIMUM SUPPLY

ETHERNET; I2C; SPI; UART; USB

48

S-PBGA-B684

e1

23 mm

4

684

90 Cel

0 Cel

PLASTIC/EPOXY

HBGA

SQUARE

GRID ARRAY, HEAT SINK/SLUG

250

3.06 mm

1000 rpm

3.47 V

3.14 V

3.3 V

YES

CMOS

OTHER

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

.8 mm

BOTTOM

NOT SPECIFIED

23 mm

MICROPROCESSOR CIRCUIT

OMAPL132EZWT2 by Texas Instruments

OMAPL132EZWT2

Texas Instruments

MICROPROCESSOR CIRCUIT; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 361; Package Code: LFBGA; Package Shape: SQUARE;

IT ALSO OPERATES IN 0.95V MINIMUM SUPPLY

S-PBGA-B361

e1

16 mm

3

361

90 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.4 mm

200 rpm

1.32 V

1.14 V

1.2 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

16 mm

MICROPROCESSOR CIRCUIT

OMAPL132EZWTA2E by Texas Instruments

OMAPL132EZWTA2E

Texas Instruments

OMAPL132EZWTA2E by Texas Instruments is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates at speeds up to 200 rpm and has a low profile GRID ARRAY package style. Ideal for industrial applications requiring a supply voltage range of 1.14V to 1.32V and operating temperatures from -40°C to 105°C.

IT ALSO OPERATES IN 0.95V MINIMUM SUPPLY

S-PBGA-B361

e1

16 mm

3

361

105 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.4 mm

200 rpm

1.32 V

1.14 V

1.2 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

16 mm

MICROPROCESSOR CIRCUIT

OMAPL132EZWTA2R by Texas Instruments

OMAPL132EZWTA2R

Texas Instruments

OMAPL132EZWTA2R by Texas Instruments is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates at 200 rpm speed and has a max supply voltage of 1.32 V. This low-profile, fine-pitch GRID ARRAY package is ideal for industrial applications requiring high performance in a compact form factor.

IT ALSO OPERATES IN 0.95V MINIMUM SUPPLY

S-PBGA-B361

e1

16 mm

3

361

105 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.4 mm

200 rpm

1.32 V

1.14 V

1.2 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

16 mm

MICROPROCESSOR CIRCUIT

OMAPL132EZWTA2 by Texas Instruments

OMAPL132EZWTA2

Texas Instruments

OMAPL132EZWTA2 by Texas Instruments is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates at speeds up to 200 rpm and has a low profile GRID ARRAY package style. Ideal for industrial applications, it has a wide temperature range from -40 to 105 °C.

IT ALSO OPERATES IN 0.95V MINIMUM SUPPLY

S-PBGA-B361

e1

16 mm

3

361

105 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.4 mm

200 rpm

1.32 V

1.14 V

1.2 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

16 mm

MICROPROCESSOR CIRCUIT

OMAPL138BZWTRB by Texas Instruments

OMAPL138BZWTRB

Texas Instruments

OMAPL138BZWTRB by Texas Instruments is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w 0-90°C, with supply voltage range of 1.25-1.35V. This SQUARE package has 361 terminals and is ideal for applications requiring low profile, fine pitch ICs in surface mount configurations.

IT ASLO OPERATES IN 0.95V MINIMUM SUPPLY

S-PBGA-B361

e1

16 mm

3

361

90 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.4 mm

1.35 V

1.25 V

1.3 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

16 mm

MICROPROCESSOR CIRCUIT

OMAPL138CZWTA3RW by Texas Instruments

OMAPL138CZWTA3RW

Texas Instruments

OMAPL138CZWTA3RW by Texas Instruments is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates in an INDUSTRIAL temperature grade range from -40 to 105 °C and has a low profile GRID ARRAY package style. With 361 terminals, it features a supply voltage range of 1.14V to 1.32V, making it ideal for various embedded applications requiring high performance and reliability.

S-PBGA-B361

e1

16 mm

3

361

105 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.4 mm

1.32 V

1.14 V

1.2 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

16 mm

MICROPROCESSOR CIRCUIT

OMAPL138EZCE3 by Texas Instruments

OMAPL138EZCE3

Texas Instruments

OMAPL138EZCE3 by Texas Instruments is a MICROPROCESSOR CIRCUIT with 32-bit External Data Bus Width and 50 MHz Max Clock Frequency. It operates b/w 0-90 °C, suitable for applications requiring low power consumption and high processing speed like IoT devices and embedded systems.

IT ALSO OPERATES IN 0.95V MINIMUM SUPPLY

I2C; SPI; UART; USB

50 MHz

32

S-PBGA-B361

e1

13 mm

3

361

90 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.3 mm

456 rpm

1.35 V

1.25 V

1.3 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

.65 mm

BOTTOM

30

13 mm

MICROPROCESSOR CIRCUIT