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MSP430F67491IPZR

Texas Instruments

MSP430F67491IPZR by Texas Instruments

MSP430F67491IPZR by Texas Instruments is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w -40 to 85 °C, with supply voltage range of 2.4-3.6 V. Ideal for industrial applications due to its low profile and fine pitch package style.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 8,911 parts In-Stock

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Digiode

USA . 3,783 parts In-Stock

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One Stop Electronics

USA . 708 parts In-Stock

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$1.000

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AZTECH Wire

Italy . 654 parts In-Stock

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Corohmni

South Africa . 940 parts In-Stock

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$17.213

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Parana Technologies

USA . 1,662 parts In-Stock

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$65.375

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ChromeModa Solutions

Germany . 3,645 parts In-Stock

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$73.455

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$60.233

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IDEA Electronic Components Group

UK . 446 parts In-Stock

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$73.455

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$69.782

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$66.110

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Corphita

USA . 2,049 parts In-Stock

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Microchip USA

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DigiPath Technology Company

USA . 488 parts In-Stock

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$66.227

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Overview

Unlock the power of innovation with the MSP430F67491IPZR by Texas Instruments. Known for their superior quality and reliable performance, Texas Instruments sets the standard in the industry. This versatile microprocessor circuit offers endless possibilities in various applications, from industrial automation to consumer electronics. With a wide supply voltage range, high temperature tolerance, and advanced technology, this product provides exceptional value and benefits to customers looking for top-notch performance and efficiency. Experience the difference with Texas Instruments MSP430F67491IPZR.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides good thermal conductivity and mechanical strength, making the product durable and reliable.

Surface Mount: YES

Surface mount technology simplifies the assembly process and allows for higher packing density on PCBs, improving overall efficiency.

Maximum Supply Voltage: 3.6 V

Supporting a maximum supply voltage of 3.6 V allows for versatile compatibility with various power sources and applications.

Minimum Supply Voltage: 2.4 V

Having a low minimum supply voltage of 2.4 V enables the product to operate efficiently even in low power scenarios.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85°C, the product can withstand harsh environmental conditions and ensure stable performance.

Minimum Operating Temperature: -40 °C

The product functions reliably in extreme cold conditions down to -40°C, making it suitable for a wide range of environments.

Terminal Finish: NICKEL PALLADIUM GOLD

Nickel palladium gold finish provides excellent corrosion resistance and solderability, enhancing the product's longevity and reliability.

Width: 14 mm

Having a compact width of 14 mm allows for efficient space utilization on PCBs and facilitates integration into compact electronic devices.

Peak Reflow Temperature: 260 C

With a peak reflow temperature of 260°C, the product can withstand the high temperatures of the reflow soldering process without damage.

Temperature Grade: INDUSTRIAL

Being rated for industrial temperature ranges ensures the product can perform reliably in demanding industrial applications without overheating or malfunctioning.

Technology: CMOS

Complementary Metal-Oxide-Semiconductor (CMOS) technology provides low power consumption and high noise immunity, making the product energy-efficient and reliable.

Nominal Supply Voltage: 3.3 V

The nominal supply voltage of 3.3 V is a common standard in many electronic systems, allowing for seamless integration and compatibility with existing setups.

Moisture Sensitivity Level (MSL): 3

Having a moisture sensitivity level of 3 indicates the product can withstand exposure to moderate levels of moisture during storage and assembly processes.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs MSP430F67491IPZR attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

Additional Features:

IT ALSO OPERATES IN 1.8V MINIMUM SUPPLY

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e4

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

100

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.6 mm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.4 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Trade Compliance

MSP430F67491IPZR Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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