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INDUSTRIAL Other Function uPs,uCs & Peripheral ICs 792

Other Function uPs,uCs & Peripheral ICs
Part# Info Specs
Part RoHS Manufacturer Description ADC Channels Maximum Access Time Additional Features Address Bus Width Bit Size Boundary Scan Bus Compatibility CPU Family Maximum Clock Frequency DAC Channels DMA Channels External Data Bus Width Format Information Access Method Integrated Cache Interrupt Capability JESD-30 Code JESD-609 Code Length Low Power Mode Moisture Sensitivity Level (MSL) No. of Bits No. of DMA Channels No. of External Interrupts No. of I/O Lines No. of Ports No. of Serial I/Os No. of Terminals No. of Timers On Chip Data RAM Width On Chip Program ROM Width Maximum Operating Temperature Minimum Operating Temperature PWM Channels Package Body Material Package Code Package Equivalence Code Package Shape Package Style (Meter) Peak Reflow Temperature (C) Power Supplies (V) Qualification RAM Bytes RAM Words ROM Words ROM Programmability ROM Bits Size Screening Level Maximum Seated Height Speed Maximum Standby Current Sub-Category Maximum Supply Current Maximum Supply Voltage Minimum Supply Voltage Nominal Supply Voltage Surface Mount Technology Temperature Grade Terminal Finish Terminal Form Terminal Pitch Terminal Position Minimum Time Maximum Time At Peak Reflow Temperature (s) Total Dose (V) Ultraviolet Erasable Volatile Width Peripheral IC Type Data EEPROM Size Connectivity Peripherals Analog To Digital Convertors
STWBC by STMicroelectronics

STWBC

STMicroelectronics

MICROPROCESSOR CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 32; Package Code: HVQCCN; Package Shape: SQUARE;

S-XQCC-N32

5 mm

32

105 Cel

-40 Cel

UNSPECIFIED

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

1 mm

5 V

YES

CMOS

INDUSTRIAL

NO LEAD

.5 mm

QUAD

5 mm

MICROPROCESSOR CIRCUIT

CC1310F32RHBR by Texas Instruments

CC1310F32RHBR

Texas Instruments

MICROPROCESSOR CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 32; Package Code: HVQCCN; Package Shape: SQUARE;

CORTEX-M3

S-PQCC-N32

e4

5 mm

3

32

85 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

28672

1 mm

3.8 V

1.8 V

3.3 V

YES

CMOS

INDUSTRIAL

Nickel/Palladium/Gold (Ni/Pd/Au)

NO LEAD

.5 mm

QUAD

30

5 mm

MICROPROCESSOR CIRCUIT

CC1310F64RGZR by Texas Instruments

CC1310F64RGZR

Texas Instruments

CC1310F64RGZR by Texas Instruments is a Cortex-M3 CPU with 28672 RAM bytes. It operates b/w -40 to 85 °C and has a supply voltage range of 1.8V to 3.8V, making it ideal for industrial applications requiring a MICROPROCESSOR CIRCUIT in a compact, surface-mountable package.

CORTEX-M3

S-PQCC-N48

e4

7 mm

3

48

85 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

28672

1 mm

3.8 V

1.8 V

3.3 V

YES

CMOS

INDUSTRIAL

Nickel/Palladium/Gold (Ni/Pd/Au)

NO LEAD

.5 mm

QUAD

30

7 mm

MICROPROCESSOR CIRCUIT

ADUCM330WDCPZ-RL by Analog Devices

ADUCM330WDCPZ-RL

Analog Devices

ADUCM330WDCPZ-RL by Analog Devices is a CMOS microprocessor circuit with 32 terminals, operating from -40 to 115 °C. It has a supply voltage range of 3.6V to 18V and is suitable for industrial applications requiring a compact square chip carrier package style.

S-XQCC-N32

6 mm

32

115 Cel

-40 Cel

UNSPECIFIED

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

1 mm

18 V

3.6 V

YES

CMOS

INDUSTRIAL

NO LEAD

.5 mm

QUAD

6 mm

MICROPROCESSOR CIRCUIT

ADUCM331WDCPZ-RL by Analog Devices

ADUCM331WDCPZ-RL

Analog Devices

ADUCM331WDCPZ-RL by Analog Devices is a CMOS microprocessor circuit with 32 terminals in a square chip carrier package. It operates b/w -40 to 115 °C, with supply voltage range of 3.6V to 18V. Ideal for industrial applications requiring high performance and compact design.

S-XQCC-N32

6 mm

32

115 Cel

-40 Cel

UNSPECIFIED

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

1 mm

18 V

3.6 V

YES

CMOS

INDUSTRIAL

NO LEAD

.5 mm

QUAD

6 mm

MICROPROCESSOR CIRCUIT

CMX7341Q3 by Cml Microcircuits

CMX7341Q3

Cml Microcircuits

CMX7341Q3 by Cml Microcircuits is a 48-terminal MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w -40 to 85 °C, with supply voltage range of 3-3.6 V. Ideal for industrial applications, it comes in a square chip carrier package style suitable for surface mount assembly.

S-XQCC-N48

6 mm

48

85 Cel

-40 Cel

UNSPECIFIED

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

1 mm

3.6 V

3 V

3.3 V

YES

CMOS

INDUSTRIAL

NO LEAD

.5 mm

QUAD

6 mm

MICROPROCESSOR CIRCUIT

MSP430F67621AIPNR by Texas Instruments

MSP430F67621AIPNR

Texas Instruments

MICROPROCESSOR CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 80; Package Code: LFQFP; Package Shape: SQUARE;

YES

I2C; SPI; UART

MSP430

0

S-PQFP-G80

e4

12 mm

3

80

85 Cel

-40 Cel

PLASTIC/EPOXY

LFQFP

SQUARE

FLATPACK, LOW PROFILE, FINE PITCH

260

4096

4

1.6 mm

3.6 V

1.8 V

3.3 V

YES

CMOS

INDUSTRIAL

NICKEL PALLADIUM GOLD

GULL WING

.5 mm

QUAD

30

12 mm

MICROPROCESSOR CIRCUIT

MSP430F67621AIPN by Texas Instruments

MSP430F67621AIPN

Texas Instruments

MSP430F67621AIPN by Texas Instruments is an 80-terminal microprocessor circuit with 4096 bytes of RAM. Operating at -40 to 85°C, it supports I2C, SPI, and UART bus compatibility for industrial applications. With a supply voltage range of 1.8-3.6V, this CMOS technology-based IC is suitable for low-profile designs requiring ADC channels and a compact form factor.

YES

I2C; SPI; UART

MSP430

0

S-PQFP-G80

e4

12 mm

3

80

85 Cel

-40 Cel

PLASTIC/EPOXY

LFQFP

SQUARE

FLATPACK, LOW PROFILE, FINE PITCH

260

4096

4

1.6 mm

3.6 V

1.8 V

3.3 V

YES

CMOS

INDUSTRIAL

NICKEL PALLADIUM GOLD

GULL WING

.5 mm

QUAD

30

12 mm

MICROPROCESSOR CIRCUIT

MSP430F67621AIPZR by Texas Instruments

MSP430F67621AIPZR

Texas Instruments

MSP430F67621AIPZR by Texas Instruments is a 100-terminal microprocessor circuit with 4096 bytes of RAM. It operates b/w -40 to 85°C, compatible with I2C, SPI, and UART buses. This CMOS technology chip has a low profile package style suitable for industrial applications.

YES

I2C; SPI; UART

MSP430

0

S-PQFP-G100

e4

14 mm

3

100

85 Cel

-40 Cel

PLASTIC/EPOXY

LFQFP

SQUARE

FLATPACK, LOW PROFILE, FINE PITCH

260

4096

4

1.6 mm

3.6 V

1.8 V

3.3 V

YES

CMOS

INDUSTRIAL

NICKEL PALLADIUM GOLD

GULL WING

.5 mm

QUAD

30

14 mm

MICROPROCESSOR CIRCUIT

MSP430F67621AIPZ by Texas Instruments

MSP430F67621AIPZ

Texas Instruments

MSP430F67621AIPZ by Texas Instruments is a 100-terminal microprocessor circuit with CMOS technology. It operates b/w -40 to 85 °C, supporting I2C, SPI, and UART bus compatibility. Ideal for industrial applications requiring low profile design and 3.3V nominal voltage.

YES

I2C; SPI; UART

MSP430

0

S-PQFP-G100

e4

14 mm

3

100

85 Cel

-40 Cel

PLASTIC/EPOXY

LFQFP

SQUARE

FLATPACK, LOW PROFILE, FINE PITCH

260

4096

4

1.6 mm

3.6 V

1.8 V

3.3 V

YES

CMOS

INDUSTRIAL

NICKEL PALLADIUM GOLD

GULL WING

.5 mm

QUAD

30

14 mm

MICROPROCESSOR CIRCUIT

MSP430F67641AIPNR by Texas Instruments

MSP430F67641AIPNR

Texas Instruments

MSP430F67641AIPNR by Texas Instruments is a 80-terminal microprocessor circuit with 8192 bytes of RAM. Operating at temperatures from -40 to 85°C, it supports I2C, SPI, and UART bus compatibility. This CMOS technology device has a low profile package style suitable for industrial applications.

YES

I2C; SPI; UART

MSP430

0

S-PQFP-G80

e4

12 mm

3

80

85 Cel

-40 Cel

PLASTIC/EPOXY

LFQFP

SQUARE

FLATPACK, LOW PROFILE, FINE PITCH

260

8192

8

1.6 mm

3.6 V

1.8 V

3.3 V

YES

CMOS

INDUSTRIAL

NICKEL PALLADIUM GOLD

GULL WING

.5 mm

QUAD

30

12 mm

MICROPROCESSOR CIRCUIT

MSP430F67641AIPN by Texas Instruments

MSP430F67641AIPN

Texas Instruments

MSP430F67641AIPN by Texas Instruments is an 80-terminal microprocessor circuit with 8192 bytes of RAM. It operates b/w -40 to 85°C, supporting I2C, SPI, and UART bus compatibility. Ideal for industrial applications requiring a low-profile package style with a max supply voltage of 3.6V.

YES

I2C; SPI; UART

MSP430

0

S-PQFP-G80

e4

12 mm

3

80

85 Cel

-40 Cel

PLASTIC/EPOXY

LFQFP

SQUARE

FLATPACK, LOW PROFILE, FINE PITCH

260

8192

8

1.6 mm

3.6 V

1.8 V

3.3 V

YES

CMOS

INDUSTRIAL

NICKEL PALLADIUM GOLD

GULL WING

.5 mm

QUAD

30

12 mm

MICROPROCESSOR CIRCUIT

MSP430F67641AIPZR by Texas Instruments

MSP430F67641AIPZR

Texas Instruments

MSP430F67641AIPZR by Texas Instruments is a 100-terminal microprocessor circuit with 8-word RAM and 8192-byte RAM. It operates b/w -40 to 85 °C, compatible with I2C, SPI, UART buses for industrial applications requiring low profile design in a square package.

YES

I2C; SPI; UART

MSP430

0

S-PQFP-G100

e4

14 mm

3

100

85 Cel

-40 Cel

PLASTIC/EPOXY

LFQFP

SQUARE

FLATPACK, LOW PROFILE, FINE PITCH

260

8192

8

1.6 mm

3.6 V

1.8 V

3.3 V

YES

CMOS

INDUSTRIAL

NICKEL PALLADIUM GOLD

GULL WING

.5 mm

QUAD

30

14 mm

MICROPROCESSOR CIRCUIT

MSP430F67641AIPZ by Texas Instruments

MSP430F67641AIPZ

Texas Instruments

MSP430F67641AIPZ by Texas Instruments is a 100-terminal microprocessor circuit with 8192 bytes of RAM. Operating at -40 to 85°C, it supports I2C, SPI, and UART bus compatibility for industrial applications requiring a low-profile package style with a max seated height of 1.6mm.

YES

I2C; SPI; UART

MSP430

0

S-PQFP-G100

e4

14 mm

3

100

85 Cel

-40 Cel

PLASTIC/EPOXY

LFQFP

SQUARE

FLATPACK, LOW PROFILE, FINE PITCH

260

8192

8

1.6 mm

3.6 V

1.8 V

3.3 V

YES

CMOS

INDUSTRIAL

NICKEL PALLADIUM GOLD

GULL WING

.5 mm

QUAD

30

14 mm

MICROPROCESSOR CIRCUIT

66AK2L06XCMSA2 by Texas Instruments

66AK2L06XCMSA2

Texas Instruments

The Texas Instruments 66AK2L06XCMSA2 is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w -40 to 100 °C, with supply voltage range of 0.95V to 1.1V. Ideal for industrial applications requiring high performance and reliability in a compact GRID ARRAY package.

S-PBGA-B900

e1

25 mm

4

900

100 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

245

3.55 mm

1.1 V

.95 V

1.05 V

YES

CMOS

INDUSTRIAL

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

.8 mm

BOTTOM

30

25 mm

MICROPROCESSOR CIRCUIT

66AK2L06XCMSA by Texas Instruments

66AK2L06XCMSA

Texas Instruments

The Texas Instruments 66AK2L06XCMSA is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w -40 to 100 °C and has a supply voltage range of 0.95V to 1.1V. This IC, in GRID ARRAY package style, is ideal for industrial applications requiring high performance and reliability.

S-PBGA-B900

e1

25 mm

4

900

100 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

245

3.55 mm

1.1 V

.95 V

1.05 V

YES

CMOS

INDUSTRIAL

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

.8 mm

BOTTOM

30

25 mm

MICROPROCESSOR CIRCUIT

SP1ML-915 by STMicroelectronics

SP1ML-915

STMicroelectronics

SP1ML-915 by STMicroelectronics is a CMOS microprocessor circuit with a supply voltage range of 1.8V to 3.6V and operates in extreme temperatures from -40 °C to 85 °C. It features a compact 16-terminal, no-lead design for industrial applications. Ideal for space-constrained environments, it measures just 13.4mm x 14mm with a max height of 2.5mm.

R-XDMA-N16

14 mm

16

85 Cel

-40 Cel

UNSPECIFIED

RECTANGULAR

MICROELECTRONIC ASSEMBLY

NOT SPECIFIED

2.5 mm

3.6 V

1.8 V

3 V

NO

CMOS

INDUSTRIAL

NO LEAD

1.5 mm

DUAL

NOT SPECIFIED

13.4 mm

MICROPROCESSOR CIRCUIT

CC1310F32RGZT by Texas Instruments

CC1310F32RGZT

Texas Instruments

CC1310F32RGZT by Texas Instruments is a Cortex-M3 CPU with 28672 RAM bytes. It operates at -40 to 85 °C, with a supply voltage range of 1.8V to 3.8V. Ideal for industrial applications requiring a MICROPROCESSOR CIRCUIT in a compact, surface-mountable package style.

CORTEX-M3

S-PQCC-N48

e4

7 mm

3

48

85 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

28672

1 mm

3.8 V

1.8 V

3.3 V

YES

CMOS

INDUSTRIAL

Nickel/Palladium/Gold (Ni/Pd/Au)

NO LEAD

.5 mm

QUAD

NOT SPECIFIED

7 mm

MICROPROCESSOR CIRCUIT

CC1310F32RHBT by Texas Instruments

CC1310F32RHBT

Texas Instruments

CC1310F32RHBT by Texas Instruments is a MICROPROCESSOR CIRCUIT with 28672 RAM Bytes. It operates b/w -40 to 85 °C, with supply voltage range of 1.8-3.8 V. Ideal for industrial applications requiring low power consumption and high performance in a compact form factor.

CORTEX-M3

S-PQCC-N32

e4

5 mm

3

32

85 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

28672

1 mm

3.8 V

1.8 V

3.3 V

YES

CMOS

INDUSTRIAL

Nickel/Palladium/Gold (Ni/Pd/Au)

NO LEAD

.5 mm

QUAD

NOT SPECIFIED

5 mm

MICROPROCESSOR CIRCUIT

CC1310F32RSMT by Texas Instruments

CC1310F32RSMT

Texas Instruments

CC1310F32RSMT by Texas Instruments is a Cortex-M3 CPU with 28672 RAM bytes. It operates b/w -40 to 85 °C, with a supply voltage range of 1.8-3.8 V. This MICROPROCESSOR CIRCUIT is ideal for industrial applications requiring low power consumption and compact design.

CORTEX-M3

S-PQCC-N32

e4

4 mm

3

32

85 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

28672

1 mm

3.8 V

1.8 V

3.3 V

YES

CMOS

INDUSTRIAL

Nickel/Palladium/Gold (Ni/Pd/Au)

NO LEAD

.4 mm

QUAD

NOT SPECIFIED

4 mm

MICROPROCESSOR CIRCUIT

CC1310F64RGZT by Texas Instruments

CC1310F64RGZT

Texas Instruments

CC1310F64RGZT by Texas Instruments is a 48-terminal microprocessor circuit with a Cortex-M3 CPU, operating at -40 to 85°C. It features 28,672 RAM bytes and a CMOS technology with a supply voltage range of 1.8V to 3.8V. Ideal for industrial applications requiring low power consumption and high performance in compact designs.

CORTEX-M3

S-PQCC-N48

e4

7 mm

3

48

85 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

28672

1 mm

3.8 V

1.8 V

3.3 V

YES

CMOS

INDUSTRIAL

Nickel/Palladium/Gold (Ni/Pd/Au)

NO LEAD

.5 mm

QUAD

NOT SPECIFIED

7 mm

MICROPROCESSOR CIRCUIT

CC1310F64RHBT by Texas Instruments

CC1310F64RHBT

Texas Instruments

CC1310F64RHBT by Texas Instruments is a MICROPROCESSOR CIRCUIT with 28672 RAM Bytes, operating at -40 to 85 °C. It features a CORTEX-M3 CPU Family, 32 terminals in a SQUARE package style, and supports supply voltages from 1.8V to 3.8V. Ideal for industrial applications requiring low power consumption and high performance in compact designs.

CORTEX-M3

S-PQCC-N32

e4

5 mm

3

32

85 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

28672

1 mm

3.8 V

1.8 V

3.3 V

YES

CMOS

INDUSTRIAL

Nickel/Palladium/Gold (Ni/Pd/Au)

NO LEAD

.5 mm

QUAD

NOT SPECIFIED

5 mm

MICROPROCESSOR CIRCUIT

CC1310F64RSMT by Texas Instruments

CC1310F64RSMT

Texas Instruments

CC1310F64RSMT by Texas Instruments is a microprocessor circuit with a Cortex-M3 CPU family. It has 32 terminals and operates at temperatures ranging from -40 to 85°C. With a max supply voltage of 3.8V, it is suitable for industrial applications requiring a very thin profile.

CORTEX-M3

S-PQCC-N32

e4

4 mm

3

32

85 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

28672

1 mm

3.8 V

1.8 V

3.3 V

YES

CMOS

INDUSTRIAL

Nickel/Palladium/Gold (Ni/Pd/Au)

NO LEAD

.4 mm

QUAD

NOT SPECIFIED

4 mm

MICROPROCESSOR CIRCUIT

MSP430F6749IPZR by Texas Instruments

MSP430F6749IPZR

Texas Instruments

MSP430F6749IPZR by Texas Instruments is a MICROPROCESSOR CIRCUIT with 100 terminals, operating at up to 25 MHz. It has a supply voltage range of 1.8V to 3.6V and is ideal for industrial applications requiring I2C, SPI, and UART bus compatibility. The package style is FLATPACK with low profile and fine pitch design, suitable for compact electronic devices.

I2C; SPI; UART

25 MHz

0

S-PQFP-G100

e4

14 mm

3

100

85 Cel

-40 Cel

PLASTIC/EPOXY

LFQFP

QFP100,.63SQ,20

SQUARE

FLATPACK, LOW PROFILE, FINE PITCH

260

1.6 mm

3.6 V

1.8 V

3.3 V

YES

CMOS

INDUSTRIAL

NICKEL PALLADIUM GOLD

GULL WING

.5 mm

QUAD

30

14 mm

MICROPROCESSOR CIRCUIT

MCIMX6DP7CVT8AA by NXP Semiconductors

MCIMX6DP7CVT8AA

NXP Semiconductors

SoC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 624; Package Code: FBGA; Package Shape: SQUARE;

S-PBGA-B624

e1

21 mm

3

624

105 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA624,25X25,32

SQUARE

GRID ARRAY, HEAT SINK/SLUG

260

2.16 mm

1.5 V

1.275 V

1.4 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

40

21 mm

SoC

MCIMX6QP7CVT8AA by NXP Semiconductors

MCIMX6QP7CVT8AA

NXP Semiconductors

MCIMX6QP7CVT8AA by NXP Semiconductors is a SoC with CMOS technology, featuring 624 terminals in a grid array package. It operates b/w -40 to 105 °C and has a supply voltage range of 1.275V to 1.5V. Ideal for industrial applications requiring high performance and reliability.

S-PBGA-B624

e1

21 mm

3

624

105 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA624,25X25,32

SQUARE

GRID ARRAY, HEAT SINK/SLUG

260

2.16 mm

1.5 V

1.275 V

1.4 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

40

21 mm

SoC

EM341-RTR by Silicon Labs

EM341-RTR

Silicon Labs

MICROPROCESSOR CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 48; Package Code: HVQCCN; Package Shape: SQUARE;

S-PQCC-N48

e3

7 mm

2

48

85 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

.9 mm

1.9 V

1.18 V

1.25 V

YES

CMOS

INDUSTRIAL

MATTE TIN

NO LEAD

.5 mm

QUAD

40

7 mm

MICROPROCESSOR CIRCUIT

MCIMX6G1CVM05AA by NXP Semiconductors

MCIMX6G1CVM05AA

NXP Semiconductors

SYSTEM ON CHIP; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 289; Package Code: LFBGA; Package Shape: SQUARE;

S-PBGA-B289

e2

14 mm

3

289

105 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.32 mm

1.3 V

1.15 V

YES

CMOS

INDUSTRIAL

Tin/Silver (Sn/Ag)

BALL

.8 mm

BOTTOM

40

14 mm

SYSTEM ON CHIP

MCIMX6G2CVK05AA by NXP Semiconductors

MCIMX6G2CVK05AA

NXP Semiconductors

SYSTEM ON CHIP; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 272; Package Code: LFBGA; Package Shape: SQUARE;

S-PBGA-B272

9 mm

3

272

105 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.23 mm

1.3 V

1.15 V

YES

CMOS

INDUSTRIAL

BALL

.5 mm

BOTTOM

40

9 mm

SYSTEM ON CHIP

MCIMX6G2CVM05AA by NXP Semiconductors

MCIMX6G2CVM05AA

NXP Semiconductors

MCIMX6G2CVM05AA by NXP Semiconductors is a SYSTEM ON CHIP with CMOS technology. It operates b/w -40 to 105 °C, with supply voltage range of 1.15-1.3 V. Ideal for industrial applications requiring low profile and fine pitch GRID ARRAY package style.

S-PBGA-B289

14 mm

3

289

105 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.32 mm

1.3 V

1.15 V

YES

CMOS

INDUSTRIAL

BALL

.8 mm

BOTTOM

40

14 mm

SYSTEM ON CHIP

MCIMX6G3CVM05AA by NXP Semiconductors

MCIMX6G3CVM05AA

NXP Semiconductors

SYSTEM ON CHIP; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 289; Package Code: LFBGA; Package Shape: SQUARE;

S-PBGA-B289

14 mm

3

289

105 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA289,17X17,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.32 mm

1.3 V

1.15 V

YES

CMOS

INDUSTRIAL

BALL

.8 mm

BOTTOM

40

14 mm

SYSTEM ON CHIP

XCZU11EG-1FFVB1517I by Xilinx

XCZU11EG-1FFVB1517I

Xilinx

XCZU11EG-1FFVB1517I by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w -40 to 100 °C, with supply voltage range of 0.825V to 0.876V. This GRID ARRAY package is ideal for industrial applications requiring high performance and reliability.

R-PBGA-B1517

e1

4

1517

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

245

.876 V

.825 V

.85 V

YES

CMOS

INDUSTRIAL

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

BOTTOM

30

MICROPROCESSOR CIRCUIT

XCZU11EG-1FFVC1156I by Xilinx

XCZU11EG-1FFVC1156I

Xilinx

XCZU11EG-1FFVC1156I by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It features 1156 terminals in a GRID ARRAY package style, operating b/w -40 to 100 °C. Ideal for applications requiring high performance and reliability in industrial environments.

R-PBGA-B1156

e1

4

1156

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

245

.876 V

.825 V

.85 V

YES

CMOS

INDUSTRIAL

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

BOTTOM

30

MICROPROCESSOR CIRCUIT

XCZU11EG-1FFVC1760I by Xilinx

XCZU11EG-1FFVC1760I

Xilinx

XCZU11EG-1FFVC1760I by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w -40 to 100 °C and has a supply voltage range of 0.825V to 0.876V. This GRID ARRAY package is ideal for industrial applications requiring high performance uPs/uCs & Peripheral ICs.

R-PBGA-B1760

e1

4

1760

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

245

.876 V

.825 V

.85 V

YES

CMOS

INDUSTRIAL

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

BOTTOM

30

MICROPROCESSOR CIRCUIT

XCZU11EG-1FFVF1517I by Xilinx

XCZU11EG-1FFVF1517I

Xilinx

XCZU11EG-1FFVF1517I by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w -40 to 100 °C and has a supply voltage range of 0.825V to 0.876V. This GRID ARRAY package with 1517 terminals is ideal for industrial applications requiring high-performance processing capabilities.

R-PBGA-B1517

e1

4

1517

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

245

.876 V

.825 V

.85 V

YES

CMOS

INDUSTRIAL

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

BOTTOM

30

MICROPROCESSOR CIRCUIT

XCZU11EG-2FFVB1517I by Xilinx

XCZU11EG-2FFVB1517I

Xilinx

XCZU11EG-2FFVB1517I by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w -40 to 100 °C and has a supply voltage range of 0.825V to 0.876V. This GRID ARRAY package is ideal for industrial applications requiring high performance and reliability.

R-PBGA-B1517

e1

4

1517

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

245

.876 V

.825 V

.85 V

YES

CMOS

INDUSTRIAL

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

BOTTOM

30

MICROPROCESSOR CIRCUIT

XCZU11EG-2FFVC1156I by Xilinx

XCZU11EG-2FFVC1156I

Xilinx

MICROPROCESSOR CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 1156; Package Code: BGA; Package Shape: RECTANGULAR;

R-PBGA-B1156

e1

4

1156

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

245

.876 V

.825 V

.85 V

YES

CMOS

INDUSTRIAL

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

BOTTOM

30

MICROPROCESSOR CIRCUIT

XCZU11EG-2FFVC1760I by Xilinx

XCZU11EG-2FFVC1760I

Xilinx

XCZU11EG-2FFVC1760I by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w -40 to 100 °C, with supply voltage range of 0.825V to 0.876V. This GRID ARRAY package is ideal for industrial applications requiring high performance and reliability.

R-PBGA-B1760

e1

4

1760

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

245

.876 V

.825 V

.85 V

YES

CMOS

INDUSTRIAL

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

BOTTOM

30

MICROPROCESSOR CIRCUIT

XCZU11EG-2FFVF1517I by Xilinx

XCZU11EG-2FFVF1517I

Xilinx

MICROPROCESSOR CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 1517; Package Code: BGA; Package Shape: RECTANGULAR;

R-PBGA-B1517

e1

4

1517

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

245

.876 V

.825 V

.85 V

YES

CMOS

INDUSTRIAL

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

BALL

BOTTOM

30

MICROPROCESSOR CIRCUIT

XCZU11EG-L1FFVC1156I by Xilinx

XCZU11EG-L1FFVC1156I

Xilinx

MICROPROCESSOR CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 1156; Package Code: BGA; Package Shape: RECTANGULAR;

ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY

R-PBGA-B1156

e1

4

1156

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

245

.742 V

.698 V

.72 V

YES

CMOS

INDUSTRIAL

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

BALL

BOTTOM

30

MICROPROCESSOR CIRCUIT

XCZU11EG-L1FFVC1760I by Xilinx

XCZU11EG-L1FFVC1760I

Xilinx

XCZU11EG-L1FFVC1760I by Xilinx is a MICROPROCESSOR CIRCUIT with 1760 terminals in a GRID ARRAY package. It operates b/w -40 to 100 °C and has a supply voltage range of 0.698V to 0.742V. Ideal for industrial applications requiring high-performance CMOS technology.

ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY

R-PBGA-B1760

e1

4

1760

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

245

.742 V

.698 V

.72 V

YES

CMOS

INDUSTRIAL

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

BOTTOM

30

MICROPROCESSOR CIRCUIT

XCZU11EG-L1FFVF1517I by Xilinx

XCZU11EG-L1FFVF1517I

Xilinx

XCZU11EG-L1FFVF1517I by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w -40 to 100 °C and has 1517 terminals in a GRID ARRAY package style. Suitable for industrial applications, it features a supply voltage range of 0.698V to 0.742V.

ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY

R-PBGA-B1517

e1

4

1517

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

245

.742 V

.698 V

.72 V

YES

CMOS

INDUSTRIAL

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

BOTTOM

30

MICROPROCESSOR CIRCUIT

XCZU15EG-1FFVB1156I by Xilinx

XCZU15EG-1FFVB1156I

Xilinx

MICROPROCESSOR CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 1156; Package Code: BGA; Package Shape: RECTANGULAR;

R-PBGA-B1156

e1

4

1156

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

245

.876 V

.825 V

.85 V

YES

CMOS

INDUSTRIAL

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

BALL

BOTTOM

30

MICROPROCESSOR CIRCUIT

XCZU15EG-1FFVC900I by Xilinx

XCZU15EG-1FFVC900I

Xilinx

MICROPROCESSOR CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 900; Package Code: BGA; Package Shape: RECTANGULAR;

R-PBGA-B900

e1

4

900

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

245

.876 V

.825 V

.85 V

YES

CMOS

INDUSTRIAL

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

BOTTOM

30

MICROPROCESSOR CIRCUIT

XCZU15EG-2FFVB1156I by Xilinx

XCZU15EG-2FFVB1156I

Xilinx

XCZU15EG-2FFVB1156I by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w -40 to 100 °C, with supply voltage range of 0.825V to 0.876V. This GRID ARRAY package is ideal for industrial applications requiring high performance and reliability.

R-PBGA-B1156

e1

4

1156

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

245

.876 V

.825 V

.85 V

YES

CMOS

INDUSTRIAL

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

BALL

BOTTOM

30

MICROPROCESSOR CIRCUIT

XCZU15EG-2FFVC900I by Xilinx

XCZU15EG-2FFVC900I

Xilinx

XCZU15EG-2FFVC900I by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w -40 to 100 °C and has 900 terminals in a GRID ARRAY package style. Ideal for industrial applications requiring high performance and reliability.

R-PBGA-B900

e1

4

900

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

245

.876 V

.825 V

.85 V

YES

CMOS

INDUSTRIAL

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

BOTTOM

30

MICROPROCESSOR CIRCUIT

XCZU15EG-L1FFVB1156I by Xilinx

XCZU15EG-L1FFVB1156I

Xilinx

XCZU15EG-L1FFVB1156I by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w -40 to 100 °C, with supply voltage range of 0.698V to 0.742V. Ideal for industrial applications requiring high performance and reliability in a compact GRID ARRAY package.

ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY

R-PBGA-B1156

e1

4

1156

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

245

.742 V

.698 V

.72 V

YES

CMOS

INDUSTRIAL

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

BOTTOM

30

MICROPROCESSOR CIRCUIT

XCZU15EG-L1FFVC900I by Xilinx

XCZU15EG-L1FFVC900I

Xilinx

MICROPROCESSOR CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 900; Package Code: BGA; Package Shape: RECTANGULAR;

ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY

R-PBGA-B900

e1

4

900

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

245

.742 V

.698 V

.72 V

YES

CMOS

INDUSTRIAL

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

BOTTOM

30

MICROPROCESSOR CIRCUIT