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INDUSTRIAL Other Function uPs,uCs & Peripheral ICs 792

Other Function uPs,uCs & Peripheral ICs
Part# Info Specs
Part RoHS Manufacturer Description ADC Channels Maximum Access Time Additional Features Address Bus Width Bit Size Boundary Scan Bus Compatibility CPU Family Maximum Clock Frequency DAC Channels DMA Channels External Data Bus Width Format Information Access Method Integrated Cache Interrupt Capability JESD-30 Code JESD-609 Code Length Low Power Mode Moisture Sensitivity Level (MSL) No. of Bits No. of DMA Channels No. of External Interrupts No. of I/O Lines No. of Ports No. of Serial I/Os No. of Terminals No. of Timers On Chip Data RAM Width On Chip Program ROM Width Maximum Operating Temperature Minimum Operating Temperature PWM Channels Package Body Material Package Code Package Equivalence Code Package Shape Package Style (Meter) Peak Reflow Temperature (C) Power Supplies (V) Qualification RAM Bytes RAM Words ROM Words ROM Programmability ROM Bits Size Screening Level Maximum Seated Height Speed Maximum Standby Current Sub-Category Maximum Supply Current Maximum Supply Voltage Minimum Supply Voltage Nominal Supply Voltage Surface Mount Technology Temperature Grade Terminal Finish Terminal Form Terminal Pitch Terminal Position Minimum Time Maximum Time At Peak Reflow Temperature (s) Total Dose (V) Ultraviolet Erasable Volatile Width Peripheral IC Type Data EEPROM Size Connectivity Peripherals Analog To Digital Convertors
LS1023AXE7PQB by NXP Semiconductors

LS1023AXE7PQB

NXP Semiconductors

SYSTEM ON CHIP; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 621; Package Code: FBGA; Package Shape: SQUARE;

ALSO OPERATES AT 1V SUPPLY NOM

S-PBGA-B621

e1

21 mm

3

621

105 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

250

2.07 mm

1.03 V

.97 V

1 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

21 mm

SYSTEM ON CHIP

LS1043AXN8PQB by NXP Semiconductors

LS1043AXN8PQB

NXP Semiconductors

SYSTEM ON CHIP; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 780; Package Code: FBGA; Package Shape: SQUARE;

ALSO OPERATES AT 1V SUPPLY NOM

S-PBGA-B780

e1

23 mm

3

780

105 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

250

2.07 mm

.93 V

.87 V

.9 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

SYSTEM ON CHIP

LS1023AXN8PQB by NXP Semiconductors

LS1023AXN8PQB

NXP Semiconductors

SYSTEM ON CHIP; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 780; Package Code: FBGA; Package Shape: SQUARE;

ALSO OPERATES AT 1V SUPPLY NOM

S-PBGA-B780

e1

23 mm

3

780

105 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

250

2.07 mm

1.03 V

.97 V

1 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

SYSTEM ON CHIP

LS1023AXN7PQB by NXP Semiconductors

LS1023AXN7PQB

NXP Semiconductors

SYSTEM ON CHIP; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 621; Package Code: FBGA; Package Shape: SQUARE;

ALSO OPERATES AT 1V SUPPLY NOM

S-PBGA-B621

e1

21 mm

3

621

105 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

250

2.07 mm

1.03 V

.97 V

1 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

21 mm

SYSTEM ON CHIP

LS1043AXE7PQB by NXP Semiconductors

LS1043AXE7PQB

NXP Semiconductors

SYSTEM ON CHIP; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 621; Package Code: FBGA; Package Shape: SQUARE;

ALSO OPERATES AT 1V SUPPLY NOM

S-PBGA-B621

e1

21 mm

3

621

105 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

250

2.07 mm

.93 V

.87 V

.9 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

21 mm

SYSTEM ON CHIP

LS1043AXE8QQB by NXP Semiconductors

LS1043AXE8QQB

NXP Semiconductors

LS1043AXE8QQB by NXP Semiconductors is a SYSTEM ON CHIP with CMOS technology. It operates b/w -40 to 105 °C, with supply voltage range of 0.87V to 0.93V. This IC has 780 terminals in a GRID ARRAY package style and is suitable for industrial applications.

ALSO OPERATES AT 1V SUPPLY NOM

S-PBGA-B780

e1

23 mm

3

780

105 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

250

2.07 mm

.93 V

.87 V

.9 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

SYSTEM ON CHIP

ATWINC1500-MR210PB1952 by Microchip Technology

ATWINC1500-MR210PB1952

Microchip Technology

Microchip Technology's ATWINC1500-MR210PB1952 is a CMOS microprocessor circuit with 28 terminals, operating at up to 48 MHz. It has a supply voltage range of 2.7V to 3.6V and can withstand temperatures from -40°C to 80°C. Ideal for industrial applications requiring high clock frequencies in compact designs.

48 MHz

R-XXMA-N28

21.72 mm

28

80 Cel

-40 Cel

UNSPECIFIED

MODULE28(UNSPEC)

RECTANGULAR

MICROELECTRONIC ASSEMBLY

NOT SPECIFIED

TS 16949

2.11 mm

3.6 V

2.7 V

3.3 V

YES

CMOS

INDUSTRIAL

NO LEAD

UNSPECIFIED

NOT SPECIFIED

14.73 mm

MICROPROCESSOR CIRCUIT

ATWINC1510-MR210PB1952 by Microchip Technology

ATWINC1510-MR210PB1952

Microchip Technology

ATWINC1510-MR210PB1952 by Microchip operates at 48 MHz clock frequency, with a supply voltage range of 2.7V to 3.6V. It is an industrial-grade microprocessor circuit suitable for applications requiring high-speed processing in a compact rectangular package style. With TS 16949 screening level, it offers reliable performance in harsh environments with temperatures ranging from -40°C to 80°C.

48 MHz

R-XXMA-N28

21.72 mm

28

80 Cel

-40 Cel

UNSPECIFIED

MODULE28(UNSPEC)

RECTANGULAR

MICROELECTRONIC ASSEMBLY

TS 16949

2.11 mm

3.6 V

2.7 V

3.3 V

YES

CMOS

INDUSTRIAL

NO LEAD

UNSPECIFIED

14.73 mm

MICROPROCESSOR CIRCUIT

AX8052F143-2-TB05 by Onsemi

AX8052F143-2-TB05

Onsemi

AX8052F143-2-TB05 by Onsemi is a CMOS System on Chip with 40 terminals, operating b/w -40 to 85 °C. It has a supply voltage range of 2.2V to 3.6V and is suitable for industrial applications requiring a very thin profile, heat sink package style. This chip carrier supports surface mount technology and features nickel/palladium/gold terminal finish.

R-PQCC-N40

e4

7 mm

1

40

85 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

LCC28,.35X.55

RECTANGULAR

CHIP CARRIER, VERY THIN PROFILE, HEAT SINK/SLUG

260

1 mm

3.6 V

2.2 V

3 V

YES

CMOS

INDUSTRIAL

Nickel/Palladium/Gold (Ni/Pd/Au)

NO LEAD

.5 mm

QUAD

5 mm

SYSTEM ON CHIP

AX8052F143-2-TX30 by Onsemi

AX8052F143-2-TX30

Onsemi

SYSTEM ON CHIP; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 40; Package Code: HVQCCN; Package Shape: SQUARE;

R-PQCC-N40

7 mm

1

40

85 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

LCC40,.2X.28,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

1 mm

3.6 V

1.8 V

3 V

YES

CMOS

INDUSTRIAL

NICKEL GOLD PALLADIUM

NO LEAD

.5 mm

QUAD

30

5 mm

SYSTEM ON CHIP

AX8052F143-3-TB05 by Onsemi

AX8052F143-3-TB05

Onsemi

AX8052F143-3-TB05 by Onsemi is a 40-terminal IC with max supply voltage of 3.6V and min of 2.2V, operating b/w -40 to 85 °C. It's a CMOS System on Chip suitable for industrial applications requiring very thin profile and quad terminal position.

R-PQCC-N40

e4

7 mm

1

40

85 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

LCC28,.35X.55

RECTANGULAR

CHIP CARRIER, VERY THIN PROFILE, HEAT SINK/SLUG

260

1 mm

3.6 V

2.2 V

3 V

YES

CMOS

INDUSTRIAL

Nickel/Palladium/Gold (Ni/Pd/Au)

NO LEAD

.5 mm

QUAD

5 mm

SYSTEM ON CHIP

AX8052F131-2-TB05 by Onsemi

AX8052F131-2-TB05

Onsemi

AX8052F131-2-TB05 by Onsemi is a System on Chip (SoC) with a max supply voltage of 3.6V and a min supply voltage of 2.2V. It is used in industrial applications and has a package style of CHIP CARRIER, VERY THIN PROFILE, HEAT SINK/SLUG.

S-PQCC-N28

e4

7 mm

1

28

85 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

LCC28,.35X.55

SQUARE

CHIP CARRIER, VERY THIN PROFILE, HEAT SINK/SLUG

260

1 mm

3.6 V

2.2 V

3 V

YES

CMOS

INDUSTRIAL

Nickel/Palladium/Gold (Ni/Pd/Au)

NO LEAD

.5 mm

QUAD

5 mm

SYSTEM ON CHIP

AX8052F131-2-TX30 by Onsemi

AX8052F131-2-TX30

Onsemi

AX8052F131-2-TX30 by Onsemi is a System on Chip with 40 terminals, operating at -40 to 85 °C. It features a supply voltage range of 2.2V to 3.6V and uses CMOS technology. Ideal for industrial applications requiring a compact chip carrier package with very thin profile and heat sink/slug design.

R-PQCC-N40

e4

7 mm

1

40

85 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

LCC40,.2X.28,20

RECTANGULAR

CHIP CARRIER, VERY THIN PROFILE, HEAT SINK/SLUG

260

1 mm

3.6 V

2.2 V

3 V

YES

CMOS

INDUSTRIAL

Nickel/Palladium/Gold (Ni/Pd/Au)

NO LEAD

.5 mm

QUAD

5 mm

SYSTEM ON CHIP

AX8052F131-3-TB05 by Onsemi

AX8052F131-3-TB05

Onsemi

AX8052F131-3-TB05 by Onsemi is a 28-terminal IC with max supply voltage of 3.6V and min of 2.2V, operating b/w -40 to 85 °C. It's a CMOS System on Chip suitable for industrial applications due to its compact size (7x5mm) and no-lead terminal form.

S-PQCC-N28

e4

7 mm

1

28

85 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

LCC28,.35X.55

SQUARE

CHIP CARRIER, VERY THIN PROFILE, HEAT SINK/SLUG

260

1 mm

3.6 V

2.2 V

3 V

YES

CMOS

INDUSTRIAL

Nickel/Palladium/Gold (Ni/Pd/Au)

NO LEAD

.5 mm

QUAD

5 mm

SYSTEM ON CHIP

AX8052F131-3-TX30 by Onsemi

AX8052F131-3-TX30

Onsemi

The Onsemi AX8052F131-3-TX30 is a CMOS System on Chip with 40 terminals, operating b/w -40 to 85 °C. It has a supply voltage range of 1.8V to 3.6V and is ideal for industrial applications requiring very thin profile ICs in a square package style.

R-PQCC-N40

7 mm

1

40

85 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

LCC40,.2X.28,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

1 mm

3.6 V

1.8 V

3 V

YES

CMOS

INDUSTRIAL

NICKEL GOLD PALLADIUM

NO LEAD

.5 mm

QUAD

30

5 mm

SYSTEM ON CHIP

RN2903A-I/RM098 by Microchip Technology

RN2903A-I/RM098

Microchip Technology

Microchip RN2903A-I/RM098 is a CMOS microprocessor IC with 47 terminals. It operates b/w -40 to 85°C, with supply voltage range of 2.1-3.6V. Ideal for industrial applications requiring TS16949 screening and surface mount compatibility.

R-XXMA-N47

e4

26.67 mm

47

85 Cel

-40 Cel

UNSPECIFIED

RECTANGULAR

MICROELECTRONIC ASSEMBLY

250

TS 16949

3.34 mm

3.6 V

2.1 V

3.3 V

YES

CMOS

INDUSTRIAL

NICKEL GOLD

NO LEAD

1.27 mm

UNSPECIFIED

17.78 mm

MICROPROCESSOR CIRCUIT

MCIMX6Y2CVM05AAR by NXP Semiconductors

MCIMX6Y2CVM05AAR

NXP Semiconductors

SoC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 289; Package Code: LFBGA; Package Shape: SQUARE;

S-PBGA-B289

e1

14 mm

3

289

105 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA289,17X17,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.32 mm

1.5 V

1.275 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

40

14 mm

SoC

DLPC230TZDQQ1 by Texas Instruments

DLPC230TZDQQ1

Texas Instruments

DLPC230TZDQQ1 by Texas Instruments is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates in an industrial temperature range of -40 to 105°C, with a supply voltage ranging from 1.045V to 1.155V. This device comes in a square GRID ARRAY package and is suitable for various applications requiring high-performance microprocessor circuits.

S-PBGA-B324

23 mm

324

105 Cel

-40 Cel

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

AEC-Q100

2.352 mm

1.155 V

1.045 V

1.1 V

YES

CMOS

INDUSTRIAL

BALL

1 mm

BOTTOM

23 mm

MICROPROCESSOR CIRCUIT

MIMXRT1051CVL5A by NXP Semiconductors

MIMXRT1051CVL5A

NXP Semiconductors

The NXP Semiconductors MIMXRT1051CVL5A is a System on Chip with CMOS technology. It operates b/w -40 to 105°C, with supply voltage ranging from 1.15V to 1.26V. With a grid array package style and 196 terminals, it's ideal for industrial applications requiring low profile and fine pitch components.

S-PBGA-B196

10 mm

196

105 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA196,14X14,25

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

1.43 mm

1.26 V

1.15 V

YES

CMOS

INDUSTRIAL

BALL

.65 mm

BOTTOM

10 mm

SYSTEM ON CHIP

AX8052F151-2-TB05 by Onsemi

AX8052F151-2-TB05

Onsemi

AX8052F151-2-TB05 by Onsemi is a 40-terminal IC with max supply voltage of 3.6V and min of 2.2V. Ideal for industrial applications, it operates b/w -40 to 85°C, featuring CMOS technology and system-on-chip design for compact solutions in various electronic systems.

R-PQCC-N40

e4

7 mm

1

40

85 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

LCC28,.35X.55

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

1 mm

3.6 V

2.2 V

3 V

YES

CMOS

INDUSTRIAL

Nickel/Palladium/Gold (Ni/Pd/Au)

NO LEAD

.5 mm

QUAD

5 mm

SYSTEM ON CHIP

MIMXRT1061CVL5A by NXP Semiconductors

MIMXRT1061CVL5A

NXP Semiconductors

The NXP Semiconductors MIMXRT1061CVL5A is a SoC with CMOS technology, featuring 196 terminals in a low profile grid array package. It operates b/w -40 to 105°C, with a supply voltage range of 1.15V to 1.26V. Ideal for industrial applications requiring high performance and compact design.

S-PBGA-B196

e1

10 mm

3

196

105 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA196,14X14,25

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.43 mm

1.26 V

1.15 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.65 mm

BOTTOM

40

10 mm

SoC

LS1043ASE7KNLB by NXP Semiconductors

LS1043ASE7KNLB

NXP Semiconductors

SYSTEM ON CHIP; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 621; Package Code: HFBGA; Package Shape: SQUARE;

S-PBGA-B621

e1

21 mm

3

621

105 Cel

0 Cel

PLASTIC/EPOXY

HFBGA

BGA621,25X25,32

SQUARE

GRID ARRAY, HEAT SINK/SLUG, FINE PITCH

250

2.07 mm

.93 V

.87 V

.9 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

21 mm

SYSTEM ON CHIP

ADUCM331WFSBCPZ-RL by Analog Devices

ADUCM331WFSBCPZ-RL

Analog Devices

ADUCM331WFSBCPZ-RL by Analog Devices is a CMOS microprocessor circuit with SPI bus compatibility. It operates b/w -40 to 115 °C and has a supply voltage range of 3.6V to 18V, making it suitable for industrial applications requiring high performance in a compact package. With AEC-Q100 screening level, this chip carrier is ideal for automotive electronics where reliability and durability are crucial.

SPI

S-XQCC-N32

6 mm

32

115 Cel

-40 Cel

UNSPECIFIED

HVQCCN

LCC32,.24SQ,20

RECTANGULAR

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

NOT SPECIFIED

AEC-Q100

1 mm

18 V

3.6 V

YES

CMOS

INDUSTRIAL

NO LEAD

.5 mm

QUAD

NOT SPECIFIED

6 mm

MICROPROCESSOR CIRCUIT

XCZU46DR-1FFVH1760I by Xilinx

XCZU46DR-1FFVH1760I

Xilinx

PROGRAMMABLE SoC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 1760; Package Code: BGA; Package Shape: RECTANGULAR;

R-PBGA-B1760

e1

4

1760

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

245

.876 V

.825 V

.85 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

BOTTOM

30

PROGRAMMABLE SoC

XCZU46DR-1FSVH1760I by Xilinx

XCZU46DR-1FSVH1760I

Xilinx

PROGRAMMABLE SoC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 1760; Package Code: BGA; Package Shape: RECTANGULAR;

R-PBGA-B1760

e1

4

1760

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

240

.876 V

.825 V

.85 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

BOTTOM

30

PROGRAMMABLE SoC

XCZU46DR-2FFVH1760I by Xilinx

XCZU46DR-2FFVH1760I

Xilinx

PROGRAMMABLE SoC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 1760; Package Code: BGA; Package Shape: RECTANGULAR;

R-PBGA-B1760

e1

4

1760

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

245

.876 V

.825 V

.85 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

BOTTOM

30

PROGRAMMABLE SoC

XCZU46DR-2FSVH1760I by Xilinx

XCZU46DR-2FSVH1760I

Xilinx

PROGRAMMABLE SoC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 1760; Package Code: BGA; Package Shape: RECTANGULAR;

R-PBGA-B1760

e1

4

1760

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

240

.876 V

.825 V

.85 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

BOTTOM

30

PROGRAMMABLE SoC

XCZU46DR-L1FFVH1760I by Xilinx

XCZU46DR-L1FFVH1760I

Xilinx

PROGRAMMABLE SoC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 1760; Package Code: BGA; Package Shape: RECTANGULAR;

R-PBGA-B1760

e1

4

1760

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

245

.742 V

.698 V

.72 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

BOTTOM

30

PROGRAMMABLE SoC

XCZU46DR-L1FSVH1760I by Xilinx

XCZU46DR-L1FSVH1760I

Xilinx

PROGRAMMABLE SoC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 1760; Package Code: BGA; Package Shape: RECTANGULAR;

R-PBGA-B1760

e1

4

1760

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

240

.742 V

.698 V

.72 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

BOTTOM

30

PROGRAMMABLE SoC

XCZU46DR-L2FFVH1760I by Xilinx

XCZU46DR-L2FFVH1760I

Xilinx

PROGRAMMABLE SoC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 1760; Package Code: BGA; Package Shape: RECTANGULAR;

R-PBGA-B1760

e1

4

1760

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

245

.742 V

.698 V

.72 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

BOTTOM

30

PROGRAMMABLE SoC

XCZU46DR-L2FSVH1760I by Xilinx

XCZU46DR-L2FSVH1760I

Xilinx

PROGRAMMABLE SoC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 1760; Package Code: BGA; Package Shape: RECTANGULAR;

R-PBGA-B1760

e1

4

1760

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

240

.742 V

.698 V

.72 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

BOTTOM

30

PROGRAMMABLE SoC

XCZU47DR-1FFVE1156I by Xilinx

XCZU47DR-1FFVE1156I

Xilinx

PROGRAMMABLE SoC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 1156; Package Code: BGA; Package Shape: RECTANGULAR;

R-PBGA-B1156

e1

4

1156

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

245

.876 V

.825 V

.85 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

BOTTOM

30

PROGRAMMABLE SoC

XCZU47DR-1FFVG1517I by Xilinx

XCZU47DR-1FFVG1517I

Xilinx

XCZU47DR-1FFVG1517I by Xilinx is a PROGRAMMABLE SoC with CMOS technology. It operates b/w -40 to 100 °C, with supply voltage range of 0.825V to 0.876V. Ideal for industrial applications requiring high performance and reliability in a compact GRID ARRAY package.

R-PBGA-B1517

e1

4

1517

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

245

.876 V

.825 V

.85 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

BOTTOM

30

PROGRAMMABLE SoC

XCZU47DR-1FSVE1156I by Xilinx

XCZU47DR-1FSVE1156I

Xilinx

PROGRAMMABLE SoC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 1156; Package Code: BGA; Package Shape: RECTANGULAR;

R-PBGA-B1156

e1

4

1156

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

240

.876 V

.825 V

.85 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

BOTTOM

30

PROGRAMMABLE SoC

XCZU47DR-1FSVG1517I by Xilinx

XCZU47DR-1FSVG1517I

Xilinx

PROGRAMMABLE SoC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 1517; Package Code: BGA; Package Shape: RECTANGULAR;

R-PBGA-B1517

e1

4

1517

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

240

.876 V

.825 V

.85 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

BOTTOM

30

PROGRAMMABLE SoC

XCZU47DR-2FFVE1156I by Xilinx

XCZU47DR-2FFVE1156I

Xilinx

The Xilinx XCZU47DR-2FFVE1156I is a programmable SoC with CMOS technology. It operates b/w -40 to 100 °C and has a supply voltage range of 0.825V to 0.876V. With 1156 terminals in a grid array package, it's ideal for industrial applications requiring high-performance computing capabilities.

R-PBGA-B1156

e1

4

1156

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

245

.876 V

.825 V

.85 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

BOTTOM

30

PROGRAMMABLE SoC

XCZU47DR-2FFVG1517I by Xilinx

XCZU47DR-2FFVG1517I

Xilinx

PROGRAMMABLE SoC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 1517; Package Code: BGA; Package Shape: RECTANGULAR;

R-PBGA-B1517

e1

4

1517

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

245

.876 V

.825 V

.85 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

BOTTOM

30

PROGRAMMABLE SoC

XCZU47DR-2FSVE1156I by Xilinx

XCZU47DR-2FSVE1156I

Xilinx

PROGRAMMABLE SoC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 1156; Package Code: BGA; Package Shape: RECTANGULAR;

R-PBGA-B1156

e1

4

1156

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

240

.876 V

.825 V

.85 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

BOTTOM

30

PROGRAMMABLE SoC

XCZU47DR-2FSVG1517I by Xilinx

XCZU47DR-2FSVG1517I

Xilinx

PROGRAMMABLE SoC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 1517; Package Code: BGA; Package Shape: RECTANGULAR;

R-PBGA-B1517

e1

4

1517

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

240

.876 V

.825 V

.85 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

BOTTOM

30

PROGRAMMABLE SoC

XCZU47DR-L1FFVE1156I by Xilinx

XCZU47DR-L1FFVE1156I

Xilinx

PROGRAMMABLE SoC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 1156; Package Code: BGA; Package Shape: RECTANGULAR;

R-PBGA-B1156

e1

4

1156

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

245

.742 V

.698 V

.72 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

BOTTOM

30

PROGRAMMABLE SoC

XCZU47DR-L1FFVG1517I by Xilinx

XCZU47DR-L1FFVG1517I

Xilinx

PROGRAMMABLE SoC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 1517; Package Code: BGA; Package Shape: RECTANGULAR;

R-PBGA-B1517

e1

4

1517

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

245

.742 V

.698 V

.72 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

BOTTOM

30

PROGRAMMABLE SoC

XCZU47DR-L1FSVE1156I by Xilinx

XCZU47DR-L1FSVE1156I

Xilinx

PROGRAMMABLE SoC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 1156; Package Code: BGA; Package Shape: RECTANGULAR;

R-PBGA-B1156

e1

4

1156

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

240

.742 V

.698 V

.72 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

BOTTOM

30

PROGRAMMABLE SoC

XCZU47DR-L1FSVG1517I by Xilinx

XCZU47DR-L1FSVG1517I

Xilinx

PROGRAMMABLE SoC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 1517; Package Code: BGA; Package Shape: RECTANGULAR;

R-PBGA-B1517

e1

4

1517

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

240

.742 V

.698 V

.72 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

BOTTOM

30

PROGRAMMABLE SoC

XCZU47DR-L2FFVE1156I by Xilinx

XCZU47DR-L2FFVE1156I

Xilinx

PROGRAMMABLE SoC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 1156; Package Code: BGA; Package Shape: RECTANGULAR;

R-PBGA-B1156

e1

4

1156

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

245

.742 V

.698 V

.72 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

BOTTOM

30

PROGRAMMABLE SoC

XCZU47DR-L2FFVG1517I by Xilinx

XCZU47DR-L2FFVG1517I

Xilinx

PROGRAMMABLE SoC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 1517; Package Code: BGA; Package Shape: RECTANGULAR;

R-PBGA-B1517

e1

4

1517

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

245

.742 V

.698 V

.72 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

BOTTOM

30

PROGRAMMABLE SoC

XCZU47DR-L2FSVE1156I by Xilinx

XCZU47DR-L2FSVE1156I

Xilinx

PROGRAMMABLE SoC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 1156; Package Code: BGA; Package Shape: RECTANGULAR;

R-PBGA-B1156

e1

4

1156

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

240

.742 V

.698 V

.72 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

BOTTOM

30

PROGRAMMABLE SoC

XCZU47DR-L2FSVG1517I by Xilinx

XCZU47DR-L2FSVG1517I

Xilinx

PROGRAMMABLE SoC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 1517; Package Code: BGA; Package Shape: RECTANGULAR;

R-PBGA-B1517

e1

4

1517

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

240

.742 V

.698 V

.72 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

BOTTOM

30

PROGRAMMABLE SoC

XCZU48DR-1FFVE1156I by Xilinx

XCZU48DR-1FFVE1156I

Xilinx

PROGRAMMABLE SoC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 1156; Package Code: BGA; Package Shape: RECTANGULAR;

R-PBGA-B1156

e1

4

1156

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

245

.876 V

.825 V

.85 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

BOTTOM

30

PROGRAMMABLE SoC