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INDUSTRIAL Other Function uPs,uCs & Peripheral ICs 792

Other Function uPs,uCs & Peripheral ICs
Part# Info Specs
Part RoHS Manufacturer Description ADC Channels Maximum Access Time Additional Features Address Bus Width Bit Size Boundary Scan Bus Compatibility CPU Family Maximum Clock Frequency DAC Channels DMA Channels External Data Bus Width Format Information Access Method Integrated Cache Interrupt Capability JESD-30 Code JESD-609 Code Length Low Power Mode Moisture Sensitivity Level (MSL) No. of Bits No. of DMA Channels No. of External Interrupts No. of I/O Lines No. of Ports No. of Serial I/Os No. of Terminals No. of Timers On Chip Data RAM Width On Chip Program ROM Width Maximum Operating Temperature Minimum Operating Temperature PWM Channels Package Body Material Package Code Package Equivalence Code Package Shape Package Style (Meter) Peak Reflow Temperature (C) Power Supplies (V) Qualification RAM Bytes RAM Words ROM Words ROM Programmability ROM Bits Size Screening Level Maximum Seated Height Speed Maximum Standby Current Sub-Category Maximum Supply Current Maximum Supply Voltage Minimum Supply Voltage Nominal Supply Voltage Surface Mount Technology Temperature Grade Terminal Finish Terminal Form Terminal Pitch Terminal Position Minimum Time Maximum Time At Peak Reflow Temperature (s) Total Dose (V) Ultraviolet Erasable Volatile Width Peripheral IC Type Data EEPROM Size Connectivity Peripherals Analog To Digital Convertors
ADSP-SC584BBCZ-4A by Analog Devices

ADSP-SC584BBCZ-4A

Analog Devices

MICROPROCESSOR CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 349; Package Code: LFBGA; Package Shape: SQUARE;

SPI; UART

500 MHz

S-PBGA-B349

19 mm

3

349

85 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA529,23X23,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.5 mm

1.15 V

1.05 V

1.1 V

YES

CMOS

INDUSTRIAL

BALL

.8 mm

BOTTOM

30

19 mm

MICROPROCESSOR CIRCUIT

STWBC-WATR by STMicroelectronics

STWBC-WATR

STMicroelectronics

STWBC-WATR by STMicroelectronics is a compact microprocessor circuit designed for industrial applications, operating b/w -40 °C and 105 °C. It features a max supply voltage of 5.5V, 32 terminals in a very thin profile package. Ideal for space-constrained environments, it ensures reliable performance with low power consumption.

S-XQCC-N32

5 mm

32

105 Cel

-40 Cel

UNSPECIFIED

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

NOT SPECIFIED

1 mm

5.5 V

3 V

3.3 V

YES

CMOS

INDUSTRIAL

NO LEAD

.5 mm

QUAD

NOT SPECIFIED

5 mm

MICROPROCESSOR CIRCUIT

STWBC-WA by STMicroelectronics

STWBC-WA

STMicroelectronics

STWBC-WA by STMicroelectronics is a compact microprocessor circuit with a max supply voltage of 5.5V and operates in extreme temps from -40 °C to 105 °C. Its 32 terminals and very thin profile make it ideal for industrial applications. This CMOS device ensures efficient performance in space-constrained designs.

S-XQCC-N32

5 mm

32

105 Cel

-40 Cel

UNSPECIFIED

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

NOT SPECIFIED

1 mm

5.5 V

3 V

3.3 V

YES

CMOS

INDUSTRIAL

NO LEAD

.5 mm

QUAD

NOT SPECIFIED

5 mm

MICROPROCESSOR CIRCUIT

AM5716AABCDA by Texas Instruments

AM5716AABCDA

Texas Instruments

The Texas Instruments AM5716AABCDA is a SYSTEM ON CHIP with CMOS technology. It operates b/w -40 to 105 °C and has a supply voltage range of 1.11V to 1.2V. With 760 terminals in a GRID ARRAY package, it's ideal for industrial applications requiring high performance and reliability.

S-PBGA-B760

e1

23 mm

3

760

105 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA760,28X28,31

SQUARE

GRID ARRAY, FINE PITCH

250

2.96 mm

1.2 V

1.11 V

1.15 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

SYSTEM ON CHIP

AM5716AABCDEA by Texas Instruments

AM5716AABCDEA

Texas Instruments

AM5716AABCDEA by Texas Instruments is a 760-terminal System on Chip with CMOS technology. It operates b/w -40 to 105 °C and has a supply voltage range of 1.11V to 1.2V, making it ideal for industrial applications requiring high performance in compact spaces.

S-PBGA-B760

e1

23 mm

3

760

105 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA760,28X28,31

SQUARE

GRID ARRAY, FINE PITCH

250

2.96 mm

1.2 V

1.11 V

1.15 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

SYSTEM ON CHIP

AM5716AABCXA by Texas Instruments

AM5716AABCXA

Texas Instruments

AM5716AABCXA by Texas Instruments is a 760-terminal System on Chip with CMOS technology. It operates b/w -40 to 105 °C, with supply voltage range of 1.11V to 1.2V. Ideal for industrial applications requiring fine pitch grid array package style.

S-PBGA-B760

e1

23 mm

3

760

105 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA760,28X28,31

SQUARE

GRID ARRAY, FINE PITCH

250

2.96 mm

1.2 V

1.11 V

1.15 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

SYSTEM ON CHIP

AM5716AABCXEA by Texas Instruments

AM5716AABCXEA

Texas Instruments

AM5716AABCXEA by Texas Instruments is a 760-terminal System on Chip with CMOS technology. It operates b/w -40 to 105 °C and has a supply voltage range of 1.11V to 1.2V, making it ideal for industrial applications requiring high performance in compact spaces.

S-PBGA-B760

e1

23 mm

3

760

105 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA760,28X28,31

SQUARE

GRID ARRAY, FINE PITCH

250

2.96 mm

1.2 V

1.11 V

1.15 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

SYSTEM ON CHIP

AM5716AABCX by Texas Instruments

AM5716AABCX

Texas Instruments

AM5716AABCX by Texas Instruments is a 760-terminal System on Chip with CMOS technology. It operates b/w -40 to 90°C, with supply voltage ranging from 1.11V to 1.2V. Ideal for industrial applications requiring fine pitch grid array package style.

S-PBGA-B760

e1

23 mm

3

760

90 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA760,28X28,31

SQUARE

GRID ARRAY, FINE PITCH

250

2.96 mm

1.2 V

1.11 V

1.15 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

SYSTEM ON CHIP

AM5718AABCXA by Texas Instruments

AM5718AABCXA

Texas Instruments

AM5718AABCXA by Texas Instruments is a 760-terminal System on Chip with CMOS technology. It operates b/w -40 to 105 °C, with supply voltage range of 1.11V to 1.2V. Ideal for industrial applications requiring high-speed processing in compact form factor.

S-PBGA-B760

e1

23 mm

3

760

105 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA760,28X28,31

SQUARE

GRID ARRAY, FINE PITCH

250

2.96 mm

1500 rpm

1.2 V

1.11 V

1.15 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

SYSTEM ON CHIP

ADSP-21583BBCZ-4A by Analog Devices

ADSP-21583BBCZ-4A

Analog Devices

ADSP-21583BBCZ-4A by Analog Devices is a MICROPROCESSOR CIRCUIT with 500 MHz clock frequency, suitable for SPI and UART bus compatibility. It operates in industrial temperature range (-40 to 85 °C) with low profile GRID ARRAY package style. The IC has 349 terminals on a 19x19 mm square body, making it ideal for high-performance applications.

SPI; UART

500 MHz

S-PBGA-B349

e1

19 mm

3

349

85 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA529,23X23,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.5 mm

1.15 V

1.05 V

1.1 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

19 mm

MICROPROCESSOR CIRCUIT

ADSP-21583CBCZ-4A by Analog Devices

ADSP-21583CBCZ-4A

Analog Devices

ADSP-21583CBCZ-4A by Analog Devices is a MICROPROCESSOR CIRCUIT with 500 MHz clock frequency, suitable for SPI and UART bus compatibility. It operates in industrial temperature range (-40 to 95 °C) with low profile GRID ARRAY package style.

SPI; UART

500 MHz

S-PBGA-B349

e1

19 mm

3

349

95 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA529,23X23,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.5 mm

1.15 V

1.05 V

1.1 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

19 mm

MICROPROCESSOR CIRCUIT

ADSP-21584BBCZ-4A by Analog Devices

ADSP-21584BBCZ-4A

Analog Devices

ADSP-21584BBCZ-4A by Analog Devices is a MICROPROCESSOR CIRCUIT with 500 MHz clock frequency, suitable for SPI and UART bus compatibility. It operates in industrial temperature range (-40 to 85 °C) with low profile GRID ARRAY package style. The IC has 349 terminals, 0.8 mm pitch, and measures 19x19 mm for various applications.

SPI; UART

500 MHz

S-PBGA-B349

e1

19 mm

3

349

85 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA529,23X23,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.5 mm

1.15 V

1.05 V

1.1 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

19 mm

MICROPROCESSOR CIRCUIT

ADSP-21584CBCZ-4A by Analog Devices

ADSP-21584CBCZ-4A

Analog Devices

ADSP-21584CBCZ-4A by Analog Devices is a MICROPROCESSOR CIRCUIT with 500 MHz clock frequency, suitable for SPI and UART bus compatibility. It operates in industrial temperature range (-40 to 95 °C) with low profile grid array package style.

SPI; UART

500 MHz

S-PBGA-B349

e1

19 mm

3

349

95 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA529,23X23,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.5 mm

1.15 V

1.05 V

1.1 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

19 mm

MICROPROCESSOR CIRCUIT

ADSP-SC582BBCZ-4A by Analog Devices

ADSP-SC582BBCZ-4A

Analog Devices

ADSP-SC582BBCZ-4A by Analog Devices is a MICROPROCESSOR CIRCUIT with 500 MHz clock frequency, suitable for industrial applications. It operates b/w -40 to 85 °C and has SPI and UART bus compatibility. This CMOS technology device comes in a low profile GRID ARRAY package with 349 terminals on a 19mm square body.

SPI; UART

500 MHz

S-PBGA-B349

e1

19 mm

3

349

85 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA529,23X23,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.5 mm

1.15 V

1.05 V

1.1 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

19 mm

MICROPROCESSOR CIRCUIT

ADSP-SC582CBCZ-4A by Analog Devices

ADSP-SC582CBCZ-4A

Analog Devices

ADSP-SC582CBCZ-4A by Analog Devices is a MICROPROCESSOR CIRCUIT with 500 MHz clock frequency, suitable for SPI and UART bus compatibility. It operates in industrial temperature range (-40 to 95 °C) with low profile GRID ARRAY package style. Ideal for applications requiring high-speed processing and communication capabilities.

SPI; UART

500 MHz

S-PBGA-B349

e1

19 mm

3

349

95 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA529,23X23,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.5 mm

1.15 V

1.05 V

1.1 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

19 mm

MICROPROCESSOR CIRCUIT

ADSP-SC583BBCZ-3A by Analog Devices

ADSP-SC583BBCZ-3A

Analog Devices

ADSP-SC583BBCZ-3A by Analog Devices is a MICROPROCESSOR CIRCUIT with 500 MHz clock frequency, suitable for industrial applications. It operates b/w -40 to 85 °C and has a supply voltage range of 1.05V to 1.15V. This low profile, fine pitch IC features SPI and UART bus compatibility in a square package with 349 terminals.

SPI; UART

500 MHz

S-PBGA-B349

e1

19 mm

3

349

85 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA529,23X23,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.5 mm

1.15 V

1.05 V

1.1 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

19 mm

MICROPROCESSOR CIRCUIT

ADSP-SC583BBCZ-4A by Analog Devices

ADSP-SC583BBCZ-4A

Analog Devices

ADSP-SC583BBCZ-4A by Analog Devices is a MICROPROCESSOR CIRCUIT with 500 MHz clock frequency, SPI and UART bus compatibility. It operates in industrial temperature range (-40 to 85 °C) with low profile GRID ARRAY package style. Ideal for applications requiring high-speed processing and communication capabilities.

SPI; UART

500 MHz

S-PBGA-B349

e1

19 mm

3

349

85 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA529,23X23,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.5 mm

1.15 V

1.05 V

1.1 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

19 mm

MICROPROCESSOR CIRCUIT

ADSP-SC583CBCZ-3A by Analog Devices

ADSP-SC583CBCZ-3A

Analog Devices

ADSP-SC583CBCZ-3A by Analog Devices is a MICROPROCESSOR CIRCUIT with 500 MHz clock frequency. It operates in industrial temperature range (-40 to 95 °C) and supports SPI and UART bus compatibility. The package has 349 terminals in a GRID ARRAY style, making it suitable for various applications requiring high performance and low profile design.

SPI; UART

500 MHz

S-PBGA-B349

e1

19 mm

3

349

95 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA529,23X23,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.5 mm

1.15 V

1.05 V

1.1 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

19 mm

MICROPROCESSOR CIRCUIT

ADSP-SC583CBCZ-4A by Analog Devices

ADSP-SC583CBCZ-4A

Analog Devices

ADSP-SC583CBCZ-4A by Analog Devices is a MICROPROCESSOR CIRCUIT with 500 MHz clock frequency, suitable for industrial applications. It operates b/w -40 to 95 °C and has a supply voltage range of 1.05V to 1.15V. This SQUARE package IC features 349 terminals in a GRID ARRAY style, making it ideal for SPI and UART bus compatibility.

SPI; UART

500 MHz

S-PBGA-B349

e1

19 mm

3

349

95 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA529,23X23,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.5 mm

1.15 V

1.05 V

1.1 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

19 mm

MICROPROCESSOR CIRCUIT

ADSP-SC584BBCZ-3A by Analog Devices

ADSP-SC584BBCZ-3A

Analog Devices

ADSP-SC584BBCZ-3A by Analog Devices is a MICROPROCESSOR CIRCUIT with 500 MHz clock frequency, suitable for industrial applications. It operates b/w -40 to 85 °C and has SPI and UART bus compatibility. This CMOS technology device features a low profile grid array package with 349 terminals in a square shape.

SPI; UART

500 MHz

S-PBGA-B349

19 mm

3

349

85 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA529,23X23,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.5 mm

1.15 V

1.05 V

1.1 V

YES

CMOS

INDUSTRIAL

BALL

.8 mm

BOTTOM

30

19 mm

MICROPROCESSOR CIRCUIT

ADSP-SC584CBCZ-3A by Analog Devices

ADSP-SC584CBCZ-3A

Analog Devices

ADSP-SC584CBCZ-3A by Analog Devices is a MICROPROCESSOR CIRCUIT with 349 terminals, operating at up to 500 MHz clock frequency. It has a low profile GRID ARRAY package suitable for industrial applications like SPI and UART bus compatibility. With a temperature range of -40 to 95 °C, it offers high performance in various environments.

SPI; UART

500 MHz

S-PBGA-B349

19 mm

3

349

95 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA529,23X23,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.5 mm

1.15 V

1.05 V

1.1 V

YES

CMOS

INDUSTRIAL

BALL

.8 mm

BOTTOM

30

19 mm

MICROPROCESSOR CIRCUIT

ADSP-SC584CBCZ-4A by Analog Devices

ADSP-SC584CBCZ-4A

Analog Devices

MICROPROCESSOR CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 349; Package Code: LFBGA; Package Shape: SQUARE;

SPI; UART

500 MHz

S-PBGA-B349

19 mm

3

349

95 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA529,23X23,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.5 mm

1.15 V

1.05 V

1.1 V

YES

CMOS

INDUSTRIAL

BALL

.8 mm

BOTTOM

30

19 mm

MICROPROCESSOR CIRCUIT

ADSP-SC587BBCZ-4B by Analog Devices

ADSP-SC587BBCZ-4B

Analog Devices

ADSP-SC587BBCZ-4B by Analog Devices is a MICROPROCESSOR CIRCUIT with 349 terminals, operating at up to 500 MHz clock frequency. It has a low profile GRID ARRAY package suitable for industrial applications requiring SPI and UART bus compatibility.

SPI; UART

500 MHz

S-PBGA-B349

19 mm

3

349

85 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA529,23X23,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.5 mm

1.15 V

1.05 V

1.1 V

YES

CMOS

INDUSTRIAL

BALL

.8 mm

BOTTOM

30

19 mm

MICROPROCESSOR CIRCUIT

ADSP-SC589BBCZ-4B by Analog Devices

ADSP-SC589BBCZ-4B

Analog Devices

ADSP-SC589BBCZ-4B by Analog Devices is a MICROPROCESSOR CIRCUIT with 349 terminals, operating at up to 500 MHz clock frequency. It has a low profile GRID ARRAY package suitable for industrial applications requiring SPI and UART bus compatibility.

SPI; UART

500 MHz

S-PBGA-B349

19 mm

3

349

85 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA529,23X23,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.5 mm

1.15 V

1.05 V

1.1 V

YES

CMOS

INDUSTRIAL

BALL

.8 mm

BOTTOM

30

19 mm

MICROPROCESSOR CIRCUIT

JN5169-001-M03-2 by NXP Semiconductors

JN5169-001-M03-2

NXP Semiconductors

MICROPROCESSOR CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 27; Package Shape: RECTANGULAR; Minimum Operating Temperature: -40 Cel;

R-XXMA-N27

21 mm

27

85 Cel

-40 Cel

UNSPECIFIED

RECTANGULAR

MICROELECTRONIC ASSEMBLY

3.6 V

2 V

3.3 V

YES

CMOS

INDUSTRIAL

NO LEAD

1.27 mm

UNSPECIFIED

16 mm

MICROPROCESSOR CIRCUIT

CC3220MODSM2MOBR by Texas Instruments

CC3220MODSM2MOBR

Texas Instruments

The Texas Instruments CC3220MODSM2MOBR is a CORTEX-M4 microprocessor with 256 RAM words and 1024000 ROM words. It features 4 ADC channels, 4 timers, and connectivity options like I2C, I2S, SD, SPI, and UART. Ideal for industrial applications requiring low power consumption and high-speed processing capabilities.

YES

0

YES

CORTEX-M4

NO

NO

0

FIXED POINT

NO

R-XBCC-B63

e4

20.5 mm

YES

3

2

0

25

2

63

4

8

8

85 Cel

-40 Cel

NO

UNSPECIFIED

BCC

RECTANGULAR

CHIP CARRIER

260

262144

256

1024000

FLASH

2.45 mm

2400 rpm

3.6 V

2.3 V

3.3 V

YES

CMOS

INDUSTRIAL

NICKEL GOLD

BUTT

1.27 mm

BOTTOM

30

17.5 mm

MICROPROCESSOR CIRCUIT

0

I2C, I2S, SD, SPI, UART

TIMER(4), WDT

4-Ch 12-Bit

XAZU2EG-1SFVA625I by Xilinx

XAZU2EG-1SFVA625I

Xilinx

Xilinx XAZU2EG-1SFVA625I is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w -40 to 100 °C, with 0.85 V supply voltage. This IC has 625 terminals in a GRID ARRAY package style, suitable for industrial applications requiring fine pitch components.

S-PBGA-B625

e1

21 mm

3

625

100 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

250

3.43 mm

.85 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

21 mm

MICROPROCESSOR CIRCUIT

XAZU2EG-1SFVC784I by Xilinx

XAZU2EG-1SFVC784I

Xilinx

Xilinx XAZU2EG-1SFVC784I is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates in an INDUSTRIAL temperature range from -40 to 100 °C. The package style is GRID ARRAY, FINE PITCH, making it suitable for various applications requiring high performance and reliability.

S-PBGA-B784

e1

23 mm

4

784

100 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

250

3.32 mm

.85 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

MICROPROCESSOR CIRCUIT

XAZU2EG-L1SFVA625I by Xilinx

XAZU2EG-L1SFVA625I

Xilinx

Xilinx XAZU2EG-L1SFVA625I is a MICROPROCESSOR CIRCUIT with CMOS technology. It features 625 terminals in a GRID ARRAY, FINE PITCH package style. Operating from -40 to 100 °C, it's ideal for industrial applications requiring low power consumption at 0.72 V supply voltage.

S-PBGA-B625

e1

21 mm

3

625

100 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

250

3.43 mm

.72 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

21 mm

MICROPROCESSOR CIRCUIT

XAZU2EG-L1SFVC784I by Xilinx

XAZU2EG-L1SFVC784I

Xilinx

MICROPROCESSOR CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 784; Package Code: FBGA; Package Shape: SQUARE;

S-PBGA-B784

e1

23 mm

4

784

100 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

250

3.32 mm

.72 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

MICROPROCESSOR CIRCUIT

XAZU3EG-1SFVA625I by Xilinx

XAZU3EG-1SFVA625I

Xilinx

MICROPROCESSOR CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 625; Package Code: FBGA; Package Shape: SQUARE;

S-PBGA-B625

e1

21 mm

3

625

100 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

250

3.43 mm

.85 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

21 mm

MICROPROCESSOR CIRCUIT

XAZU3EG-1SFVC784I by Xilinx

XAZU3EG-1SFVC784I

Xilinx

MICROPROCESSOR CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 784; Package Code: FBGA; Package Shape: SQUARE;

S-PBGA-B784

e1

23 mm

4

784

100 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

250

3.32 mm

.85 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

MICROPROCESSOR CIRCUIT

XAZU3EG-L1SFVA625I by Xilinx

XAZU3EG-L1SFVA625I

Xilinx

MICROPROCESSOR CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 625; Package Code: FBGA; Package Shape: SQUARE;

S-PBGA-B625

e1

21 mm

3

625

100 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

250

3.43 mm

.72 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

21 mm

MICROPROCESSOR CIRCUIT

XAZU3EG-L1SFVC784I by Xilinx

XAZU3EG-L1SFVC784I

Xilinx

MICROPROCESSOR CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 784; Package Code: FBGA; Package Shape: SQUARE;

S-PBGA-B784

e1

23 mm

4

784

100 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

250

3.32 mm

.72 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

MICROPROCESSOR CIRCUIT

XAZU4EV-L1SFVC784I by Xilinx

XAZU4EV-L1SFVC784I

Xilinx

MICROPROCESSOR CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 784; Package Code: FBGA; Package Shape: SQUARE;

S-PBGA-B784

e1

23 mm

4

784

100 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

250

3.32 mm

.72 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

MICROPROCESSOR CIRCUIT

XAZU5EV-1SFVC784I by Xilinx

XAZU5EV-1SFVC784I

Xilinx

MICROPROCESSOR CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 784; Package Code: FBGA; Package Shape: SQUARE;

S-PBGA-B784

e1

23 mm

4

784

100 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

250

3.32 mm

.85 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

MICROPROCESSOR CIRCUIT

XAZU5EV-L1SFVC784I by Xilinx

XAZU5EV-L1SFVC784I

Xilinx

Xilinx XAZU5EV-L1SFVC784I is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates in an industrial temperature range from -40 to 100 °C and has a supply voltage of 0.72 V. This package features 784 terminals in a GRID ARRAY, FINE PITCH style, suitable for various uPs and uCs applications.

S-PBGA-B784

e1

23 mm

4

784

100 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

250

3.32 mm

.72 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

MICROPROCESSOR CIRCUIT

AX-SFUS-1-01-TB05 by Onsemi

AX-SFUS-1-01-TB05

Onsemi

AX-SFUS-1-01-TB05 by Onsemi is a CMOS MICROPROCESSOR CIRCUIT with 40 terminals in a RECTANGULAR CHIP CARRIER package. It operates b/w -40 to 85 °C, with supply voltage range of 1.8V to 3.6V, making it ideal for industrial applications requiring high performance and reliability.

R-XQCC-N40

7 mm

1

40

85 Cel

-40 Cel

UNSPECIFIED

HVQCCN

RECTANGULAR

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

1 mm

3.6 V

1.8 V

3 V

YES

CMOS

INDUSTRIAL

NICKEL GOLD PALLADIUM

NO LEAD

.5 mm

QUAD

30

5 mm

MICROPROCESSOR CIRCUIT

AX-SFUS-API-1-01-TB05 by Onsemi

AX-SFUS-API-1-01-TB05

Onsemi

AX-SFUS-API-1-01-TB05 by Onsemi is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w -40 to 85 °C and has a supply voltage range of 1.8V to 3.6V, making it ideal for INDUSTRIAL applications requiring high performance in compact spaces.

R-XQCC-N40

7 mm

1

40

85 Cel

-40 Cel

UNSPECIFIED

HVQCCN

RECTANGULAR

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

1 mm

3.6 V

1.8 V

3 V

YES

CMOS

INDUSTRIAL

NICKEL GOLD PALLADIUM

NO LEAD

.5 mm

QUAD

30

5 mm

MICROPROCESSOR CIRCUIT

MCIMX6Y2CVM05AA by NXP Semiconductors

MCIMX6Y2CVM05AA

NXP Semiconductors

MCIMX6Y2CVM05AA by NXP Semiconductors is a low-profile, fine-pitch grid array SoC with 289 terminals. It operates in industrial temperature range (-40 to 105°C) and supports CMOS technology. With a supply voltage range of 1.275V to 1.5V, it is suitable for various applications requiring high-performance microcontrollers.

S-PBGA-B289

14 mm

289

105 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA289,17X17,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.32 mm

1.5 V

1.275 V

YES

CMOS

INDUSTRIAL

BALL

.8 mm

BOTTOM

40

14 mm

SoC

MCIMX6Y2CVM08AA by NXP Semiconductors

MCIMX6Y2CVM08AA

NXP Semiconductors

MCIMX6Y2CVM08AA by NXP Semiconductors is an industrial-grade SoC with CMOS technology. It operates b/w -40 to 105 °C and has a max supply voltage of 1.5 V. With 289 terminals in a square package, it's ideal for applications requiring low-profile, fine-pitch grid arrays.

S-PBGA-B289

14 mm

289

105 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA289,17X17,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.32 mm

1.5 V

1.325 V

YES

CMOS

INDUSTRIAL

BALL

.8 mm

BOTTOM

40

14 mm

SoC

NRF52810-QFAA-T by Nordic Semiconductor Asa

NRF52810-QFAA-T

Nordic Semiconductor Asa

NRF52810-QFAA-T by Nordic Semiconductor Asa is a 48-terminal microprocessor circuit with CMOS technology. It operates b/w -40 to 85 °C, with supply voltage range of 1.7V to 3.6V. Ideal for industrial applications requiring low-profile, surface-mountable chips.

S-XQCC-N48

6 mm

48

85 Cel

-40 Cel

UNSPECIFIED

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

NOT SPECIFIED

.95 mm

3.6 V

1.7 V

3 V

YES

CMOS

INDUSTRIAL

NO LEAD

.4 mm

QUAD

NOT SPECIFIED

6 mm

MICROPROCESSOR CIRCUIT

MCIMX6S7CVM08AD by NXP Semiconductors

MCIMX6S7CVM08AD

NXP Semiconductors

MCIMX6S7CVM08AD by NXP Semiconductors is a SYSTEM ON CHIP with 624 terminals, operating temperature range of -40 to 105 °C. It is used in industrial applications and has a package style of GRID ARRAY, LOW PROFILE, FINE PITCH.

24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE

S-PBGA-B624

e1

21 mm

3

624

105 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.6 mm

1.5 V

1.275 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

40

21 mm

SYSTEM ON CHIP

MCIMX6U7CVM08AD by NXP Semiconductors

MCIMX6U7CVM08AD

NXP Semiconductors

MCIMX6U7CVM08AD by NXP Semiconductors is a System on Chip with 624 terminals, operating temperature range of -40 to 105°C. It features a low profile grid array package style and CMOS technology, suitable for industrial applications requiring high performance and reliability.

24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE

S-PBGA-B624

e1

21 mm

3

624

105 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.6 mm

1.5 V

1.275 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

40

21 mm

SYSTEM ON CHIP

CC1312R1F3RGZT by Texas Instruments

CC1312R1F3RGZT

Texas Instruments

The Texas Instruments CC1312R1F3RGZT is a MICROPROCESSOR CIRCUIT with 81920 RAM Bytes. It operates b/w -40 to 85 °C and has a supply voltage range of 1.8V to 3.8V, making it ideal for industrial applications requiring low power consumption and high processing capabilities. The package style is CHIP CARRIER with 48 terminals in a SQUARE shape, suitable for surface mount assembly in compact electronic devices.

DIMENSION CONSIDER BASED ON LINKHTTP://WWW.TI.COM/LIT/DS/SYMLINK/CC1312R.PDF

S-PQCC-N48

e4

7 mm

3

30

48

85 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

81920

1 mm

3.8 V

1.8 V

3 V

YES

CMOS

INDUSTRIAL

NICKEL PALLADIUM GOLD

NO LEAD

.5 mm

QUAD

30

7 mm

MICROPROCESSOR CIRCUIT

LS1043AXN7PQB by NXP Semiconductors

LS1043AXN7PQB

NXP Semiconductors

SYSTEM ON CHIP; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 621; Package Code: FBGA; Package Shape: SQUARE;

ALSO OPERATES AT 1V SUPPLY NOM

S-PBGA-B621

e1

21 mm

3

621

105 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

250

2.07 mm

.93 V

.87 V

.9 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

21 mm

SYSTEM ON CHIP

LS1023AXE8PQB by NXP Semiconductors

LS1023AXE8PQB

NXP Semiconductors

SYSTEM ON CHIP; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 780; Package Code: FBGA; Package Shape: SQUARE;

ALSO OPERATES AT 1V SUPPLY NOM

S-PBGA-B780

e1

23 mm

3

780

105 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

250

2.07 mm

1.03 V

.97 V

1 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

SYSTEM ON CHIP

LS1043AXE8PQB by NXP Semiconductors

LS1043AXE8PQB

NXP Semiconductors

SYSTEM ON CHIP; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 780; Package Code: FBGA; Package Shape: SQUARE;

ALSO OPERATES AT 1V SUPPLY NOM

S-PBGA-B780

e1

23 mm

3

780

105 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

250

2.07 mm

.93 V

.87 V

.9 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

SYSTEM ON CHIP