Loading...

INDUSTRIAL Other Function uPs,uCs & Peripheral ICs 792

Other Function uPs,uCs & Peripheral ICs
Part# Info Specs
Part RoHS Manufacturer Description ADC Channels Maximum Access Time Additional Features Address Bus Width Bit Size Boundary Scan Bus Compatibility CPU Family Maximum Clock Frequency DAC Channels DMA Channels External Data Bus Width Format Information Access Method Integrated Cache Interrupt Capability JESD-30 Code JESD-609 Code Length Low Power Mode Moisture Sensitivity Level (MSL) No. of Bits No. of DMA Channels No. of External Interrupts No. of I/O Lines No. of Ports No. of Serial I/Os No. of Terminals No. of Timers On Chip Data RAM Width On Chip Program ROM Width Maximum Operating Temperature Minimum Operating Temperature PWM Channels Package Body Material Package Code Package Equivalence Code Package Shape Package Style (Meter) Peak Reflow Temperature (C) Power Supplies (V) Qualification RAM Bytes RAM Words ROM Words ROM Programmability ROM Bits Size Screening Level Maximum Seated Height Speed Maximum Standby Current Sub-Category Maximum Supply Current Maximum Supply Voltage Minimum Supply Voltage Nominal Supply Voltage Surface Mount Technology Temperature Grade Terminal Finish Terminal Form Terminal Pitch Terminal Position Minimum Time Maximum Time At Peak Reflow Temperature (s) Total Dose (V) Ultraviolet Erasable Volatile Width Peripheral IC Type Data EEPROM Size Connectivity Peripherals Analog To Digital Convertors
XAZU7EV-1FBVB900I by Xilinx

XAZU7EV-1FBVB900I

Xilinx

MICROPROCESSOR CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 900; Package Code: BGA; Package Shape: SQUARE;

CAN, I2C, SPI, UART

0

S-PBGA-B900

e1

31 mm

4

900

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

BGA900,30X30,40

SQUARE

GRID ARRAY

245

2.97 mm

.85 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

1 mm

BOTTOM

30

31 mm

MICROPROCESSOR CIRCUIT

SE050D2HQ1/Z01PAZ by NXP Semiconductors

SE050D2HQ1/Z01PAZ

NXP Semiconductors

CRYPTOGRAPHIC AUTHENTICATOR; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 20; Package Code: HVQCCN; Package Shape: SQUARE;

S-PQCC-N20

e4

3 mm

1

20

105 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

LCC20,.12SQ,16

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

.33 mm

3.6 V

1.62 V

1.8 V

YES

CMOS

INDUSTRIAL

NICKEL PALLADIUM GOLD SILVER

NO LEAD

.4 mm

QUAD

30

3 mm

CRYPTOGRAPHIC AUTHENTICATOR

ATECC608B-TNGTLSS-G by Microchip Technology

ATECC608B-TNGTLSS-G

Microchip Technology

ATECC608B-TNGTLSS-G by Microchip: 5.5V max supply, 1MHz clock freq, cryptographic authenticator for industrial use. Small outline package with 8 terminals, operates from -40 to 85°C. Ideal for secure applications needing high-level authentication and encryption.

1 MHz

0

R-PDSO-G8

e4

4.9 mm

8

85 Cel

-40 Cel

PLASTIC/EPOXY

SOP

SOP8,.23

RECTANGULAR

SMALL OUTLINE

1.75 mm

5.5 V

2 V

YES

CMOS

INDUSTRIAL

Nickel/Palladium/Gold (Ni/Pd/Au)

GULL WING

1.27 mm

DUAL

3.9 mm

CRYPTOGRAPHIC AUTHENTICATOR

ATECC608B-TFLXTLSS-PROTO by Microchip Technology

ATECC608B-TFLXTLSS-PROTO

Microchip Technology

ATECC608B-TFLXTLSS-PROTO by Microchip Tech is a cryptographic authenticator IC with 1MHz clock freq, 2-5.5V supply range, and -40 to 85°C temp range. Ideal for secure applications in industrial settings due to its compact size and dual-terminal design.

1 MHz

0

R-PDSO-G8

e4

4.9 mm

8

85 Cel

-40 Cel

PLASTIC/EPOXY

SOP

SOP8,.23

RECTANGULAR

SMALL OUTLINE

1.75 mm

5.5 V

2 V

YES

CMOS

INDUSTRIAL

Nickel/Palladium/Gold (Ni/Pd/Au)

GULL WING

1.27 mm

DUAL

3.9 mm

CRYPTOGRAPHIC AUTHENTICATOR

ATECC608B-TNGTLSU-B by Microchip Technology

ATECC608B-TNGTLSU-B

Microchip Technology

ATECC608B-TNGTLSU-B by Microchip Technology is a cryptographic authenticator IC with a max supply voltage of 5.5V and operating temperature range of -40 to 85°C. It features a small outline package style, surface mount capability, and terminal finish in Ni/Pd/Au for secure applications requiring high reliability.

1 MHz

0

R-PDSO-N8

e4

3 mm

8

85 Cel

-40 Cel

PLASTIC/EPOXY

HVSON

SOLCC8,.12,20

RECTANGULAR

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

.6 mm

5.5 V

2 V

YES

CMOS

INDUSTRIAL

Nickel/Palladium/Gold (Ni/Pd/Au)

NO LEAD

.5 mm

DUAL

2 mm

CRYPTOGRAPHIC AUTHENTICATOR

ATECC608B-TFLXTLSU by Microchip Technology

ATECC608B-TFLXTLSU

Microchip Technology

Microchip ATECC608B-TFLXTLSU is a cryptographic authenticator IC with 8 terminals, operating from -40 to 85°C. It supports up to 1 MHz clock frequency and has a small outline package suitable for industrial applications. The IC features CMOS technology, dual terminal position, and nickel/palladium/gold finish.

1 MHz

0

R-PDSO-N8

e4

3 mm

8

85 Cel

-40 Cel

PLASTIC/EPOXY

HVSON

SOLCC8,.12,20

RECTANGULAR

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

.6 mm

5.5 V

2 V

YES

CMOS

INDUSTRIAL

Nickel/Palladium/Gold (Ni/Pd/Au)

NO LEAD

.5 mm

DUAL

2 mm

CRYPTOGRAPHIC AUTHENTICATOR

ATECC608B-TNGTLSU-C by Microchip Technology

ATECC608B-TNGTLSU-C

Microchip Technology

ATECC608B-TNGTLSU-C by Microchip operates at 2-5.5V, with a temp range of -40 to 85°C. It's a cryptographic authenticator IC in a small outline package suitable for industrial applications. Features include dual terminals, 1MHz clock frequency, and nickel/palladium/gold finish.

1 MHz

0

R-PDSO-N8

e4

3 mm

8

85 Cel

-40 Cel

PLASTIC/EPOXY

HVSON

SOLCC8,.12,20

RECTANGULAR

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

.6 mm

5.5 V

2 V

YES

CMOS

INDUSTRIAL

Nickel/Palladium/Gold (Ni/Pd/Au)

NO LEAD

.5 mm

DUAL

2 mm

CRYPTOGRAPHIC AUTHENTICATOR

ATECC608B-TNGTLSU-G by Microchip Technology

ATECC608B-TNGTLSU-G

Microchip Technology

Microchip ATECC608B-TNGTLSU-G is a cryptographic authenticator IC with 8 terminals, operating from -40 to 85°C. It supports up to 1 MHz clock frequency, ideal for secure applications in industrial settings due to its CMOS technology and Ni/Pd/Au terminal finish.

1 MHz

0

R-PDSO-N8

e4

3 mm

8

85 Cel

-40 Cel

PLASTIC/EPOXY

HVSON

SOLCC8,.12,20

RECTANGULAR

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

.6 mm

5.5 V

2 V

YES

CMOS

INDUSTRIAL

Nickel/Palladium/Gold (Ni/Pd/Au)

NO LEAD

.5 mm

DUAL

2 mm

CRYPTOGRAPHIC AUTHENTICATOR

LS1043ASE7MNLB by NXP Semiconductors

LS1043ASE7MNLB

NXP Semiconductors

SYSTEM ON CHIP; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 621; Package Code: HFBGA; Package Shape: SQUARE;

S-PBGA-B621

e1

21 mm

3

621

105 Cel

0 Cel

PLASTIC/EPOXY

HFBGA

BGA621,25X25,32

SQUARE

GRID ARRAY, HEAT SINK/SLUG, FINE PITCH

250

2.07 mm

.93 V

.87 V

.9 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

21 mm

SYSTEM ON CHIP

LS1043ASN7MNLB by NXP Semiconductors

LS1043ASN7MNLB

NXP Semiconductors

SYSTEM ON CHIP; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 621; Package Code: HFBGA; Package Shape: SQUARE;

S-PBGA-B621

e1

21 mm

3

621

105 Cel

0 Cel

PLASTIC/EPOXY

HFBGA

BGA621,25X25,32

SQUARE

GRID ARRAY, HEAT SINK/SLUG, FINE PITCH

250

2.07 mm

.93 V

.87 V

.9 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

21 mm

SYSTEM ON CHIP

LS1043ASN8KNLB by NXP Semiconductors

LS1043ASN8KNLB

NXP Semiconductors

SYSTEM ON CHIP; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 780; Package Code: HFBGA; Package Shape: SQUARE;

S-PBGA-B780

e1

23 mm

3

780

105 Cel

0 Cel

PLASTIC/EPOXY

HFBGA

BGA780,28X28,32

SQUARE

GRID ARRAY, HEAT SINK/SLUG, FINE PITCH

250

2.07 mm

.93 V

.87 V

.9 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

SYSTEM ON CHIP

LS1043ASE8KNLB by NXP Semiconductors

LS1043ASE8KNLB

NXP Semiconductors

SYSTEM ON CHIP; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 780; Package Code: HFBGA; Package Shape: SQUARE;

S-PBGA-B780

e1

23 mm

3

780

105 Cel

0 Cel

PLASTIC/EPOXY

HFBGA

BGA780,28X28,32

SQUARE

GRID ARRAY, HEAT SINK/SLUG, FINE PITCH

250

2.07 mm

.93 V

.87 V

.9 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

SYSTEM ON CHIP

LS1043ASE8MNLB by NXP Semiconductors

LS1043ASE8MNLB

NXP Semiconductors

SYSTEM ON CHIP; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 780; Package Code: HFBGA; Package Shape: SQUARE;

S-PBGA-B780

e1

23 mm

3

780

105 Cel

0 Cel

PLASTIC/EPOXY

HFBGA

BGA780,28X28,32

SQUARE

GRID ARRAY, HEAT SINK/SLUG, FINE PITCH

250

2.07 mm

.93 V

.87 V

.9 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

SYSTEM ON CHIP

LS1043ASN7KNLB by NXP Semiconductors

LS1043ASN7KNLB

NXP Semiconductors

SYSTEM ON CHIP; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 621; Package Code: HFBGA; Package Shape: SQUARE;

S-PBGA-B621

e1

21 mm

3

621

105 Cel

0 Cel

PLASTIC/EPOXY

HFBGA

BGA621,25X25,32

SQUARE

GRID ARRAY, HEAT SINK/SLUG, FINE PITCH

250

2.07 mm

.93 V

.87 V

.9 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

21 mm

SYSTEM ON CHIP

LS1043ASN8MNLB by NXP Semiconductors

LS1043ASN8MNLB

NXP Semiconductors

SYSTEM ON CHIP; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 780; Package Code: HFBGA; Package Shape: SQUARE;

S-PBGA-B780

e1

23 mm

3

780

105 Cel

0 Cel

PLASTIC/EPOXY

HFBGA

BGA780,28X28,32

SQUARE

GRID ARRAY, HEAT SINK/SLUG, FINE PITCH

250

2.07 mm

.93 V

.87 V

.9 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

SYSTEM ON CHIP

MIMXRT1064CVL5B by NXP Semiconductors

MIMXRT1064CVL5B

NXP Semiconductors

NXP Semiconductors' MIMXRT1064CVL5B is a SoC with CMOS technology, featuring 196 terminals in a low-profile grid array package. Operating from -40 to 105 °C, it supports a supply voltage range of 1.15-1.26 V for industrial applications requiring high performance and reliability.

S-PBGA-B196

10 mm

3

196

105 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA196,14X14,25

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.43 mm

1.26 V

1.15 V

YES

CMOS

INDUSTRIAL

BALL

.65 mm

BOTTOM

40

10 mm

SoC

NRF9160-SIBA-R7 by Nordic Semiconductor Asa

NRF9160-SIBA-R7

Nordic Semiconductor Asa

Nordic Semiconductor's NRF9160-SIBA-R7 is a CMOS MICROCONTROLLER with 127 terminals, operating b/w -40 to 85 °C. It has a supply voltage range of 3-5.5 V and is ideal for industrial applications requiring low power consumption and compact design.

R-XBGA-N127

16 mm

127

85 Cel

-40 Cel

UNSPECIFIED

LGA

LGA127,21X30,20

RECTANGULAR

GRID ARRAY

1.1 mm

5.5 V

3 V

3.8 V

YES

CMOS

INDUSTRIAL

NO LEAD

.5 mm

BOTTOM

10.5 mm

MICROCONTROLLER, CISC

NRF9160-SICA-R7 by Nordic Semiconductor Asa

NRF9160-SICA-R7

Nordic Semiconductor Asa

NRF9160-SICA-R7 by Nordic Semiconductor Asa is a CMOS MICROCONTROLLER with 127 terminals, operating b/w -40 to 85 °C. It has a supply voltage range of 3-5.5 V and is ideal for industrial applications requiring low power consumption and compact design.

R-XBGA-N127

16 mm

127

85 Cel

-40 Cel

UNSPECIFIED

LGA

LGA127,21X30,20

RECTANGULAR

GRID ARRAY

1.1 mm

5.5 V

3 V

3.8 V

YES

CMOS

INDUSTRIAL

NO LEAD

.5 mm

BOTTOM

10.5 mm

MICROCONTROLLER, CISC

NRF9160-SIBA-R by Nordic Semiconductor Asa

NRF9160-SIBA-R

Nordic Semiconductor Asa

Nordic Semiconductor's NRF9160-SIBA-R is a CMOS microcontroller with 127 terminals in a grid array package. It operates b/w -40 to 85°C, suitable for industrial applications. With a supply voltage range of 3-5.5V, it is ideal for IoT devices requiring low power consumption and compact design.

R-XBGA-N127

16 mm

127

85 Cel

-40 Cel

UNSPECIFIED

LGA

LGA127,21X30,20

RECTANGULAR

GRID ARRAY

1.1 mm

5.5 V

3 V

3.8 V

YES

CMOS

INDUSTRIAL

NO LEAD

.5 mm

BOTTOM

10.5 mm

MICROCONTROLLER, CISC

NRF9160-SICA-R by Nordic Semiconductor Asa

NRF9160-SICA-R

Nordic Semiconductor Asa

Nordic Semiconductor's NRF9160-SICA-R is a CMOS microcontroller with 127 terminals in a grid array package. It operates b/w -40 to 85 °C, with supply voltage range of 3-5.5 V. Ideal for industrial applications requiring low power consumption and compact design.

R-XBGA-N127

16 mm

127

85 Cel

-40 Cel

UNSPECIFIED

LGA

LGA127,21X30,20

RECTANGULAR

GRID ARRAY

1.1 mm

5.5 V

3 V

3.8 V

YES

CMOS

INDUSTRIAL

NO LEAD

.5 mm

BOTTOM

10.5 mm

MICROCONTROLLER, CISC

MCIMX6Y2CVM05ABR by NXP Semiconductors

MCIMX6Y2CVM05ABR

NXP Semiconductors

MCIMX6Y2CVM05ABR by NXP Semiconductors is a low-profile, fine-pitch grid array SoC with 289 terminals. Operating at -40 to 105°C, it supports a voltage range of 1.275-1.5V and features tin silver copper terminal finish. Ideal for industrial applications requiring high-performance computing in compact spaces.

S-PBGA-B289

e1

14 mm

3

289

105 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA289,17X17,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.32 mm

1.5 V

1.275 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

40

14 mm

SoC

ESP32-WROOM-32E(M113EH3200PH3Q0) by Espressif Systems (Shanghai)

ESP32-WROOM-32E(M113EH3200PH3Q0)

Espressif Systems (Shanghai)

ESP32-WROOM-32E(M113EH3200PH3Q0) by Espressif Systems is a MICROPROCESSOR CIRCUIT with 38 terminals, operating at 3-3.6V. It has an industrial temperature grade of -40 to 85°C and is ideal for IoT applications requiring low power consumption and wireless connectivity.

R-XXMA-N38

25.5 mm

38

85 Cel

-40 Cel

UNSPECIFIED

XMA

RECTANGULAR

MICROELECTRONIC ASSEMBLY

3.25 mm

3.6 V

3 V

3.3 V

YES

CMOS

INDUSTRIAL

NO LEAD

1.27 mm

UNSPECIFIED

18 mm

MICROPROCESSOR CIRCUIT

SLS32AIA010MLUSON10XTMA2 by Infineon Technologies

SLS32AIA010MLUSON10XTMA2

Infineon Technologies

SLS32AIA010MLUSON10XTMA2 by Infineon Technologies is a cryptographic authenticator IC with 10 terminals, CMOS technology, and 3.3V nominal voltage. It operates in industrial temperature range (-40 to 105 °C) and has a small outline package style suitable for surface mount applications.

S-PDSO-N10

3 mm

10

105 Cel

-40 Cel

PLASTIC/EPOXY

HVSON

SOLCC10,.12,20

SQUARE

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

.6 mm

5.5 V

1.62 V

3.3 V

YES

CMOS

INDUSTRIAL

NO LEAD

.5 mm

DUAL

3 mm

CRYPTOGRAPHIC AUTHENTICATOR

MIMXRT1051CVJ5BR by NXP Semiconductors

MIMXRT1051CVJ5BR

NXP Semiconductors

The NXP Semiconductors MIMXRT1051CVJ5BR is a System on Chip with CMOS technology. It operates b/w -40 to 105 °C, with supply voltage ranging from 1.15V to 1.26V. Ideal for industrial applications requiring a low profile, fine pitch package style and grid array configuration.

S-PBGA-B196

12 mm

196

105 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA196,14X14,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

1.52 mm

1.26 V

1.15 V

YES

CMOS

INDUSTRIAL

BALL

.8 mm

BOTTOM

12 mm

SYSTEM ON CHIP