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SE050D2HQ1/Z01PAZ

NXP Semiconductors

SE050D2HQ1/Z01PAZ by NXP Semiconductors

CRYPTOGRAPHIC AUTHENTICATOR; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 20; Package Code: HVQCCN; Package Shape: SQUARE;

Median Price

$1.920

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 3,000 parts In-Stock

1+ parts

$1.927

100+ parts

-

1k+ parts

-

10k+ parts

$1.295

3,000

$1.927

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-

$1.295

Verical

USA . 3,000 parts In-Stock

1+ parts

-

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$1.295

3,000

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-

$1.295

Chip1Stop

Japan . 3,000 parts In-Stock

1+ parts

-

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$1.920

3,000

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$1.920

Flip Electronics (Authorized)

USA . 3,000 parts In-Stock

1+ parts

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3,000

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,530 parts In-Stock

1+ parts

$1.831

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1,530

$1.831

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Vyrian

USA . 5,203 parts In-Stock

1+ parts

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5,203

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Flip Electronics

USA . 3,000 parts In-Stock

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Anansix

USA . 257 parts In-Stock

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257

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 4,236 parts In-Stock

1+ parts

$1.734

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4,236

$1.734

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AZTECH Wire

Italy . 1,181 parts In-Stock

1+ parts

$19.340

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$19.340

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Corohmni

South Africa . 2,221 parts In-Stock

1+ parts

$52.788

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$52.788

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QUARKTWIN TECHNOLOGY LTD

USA . 22,500 parts In-Stock

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22,500

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Authorized Procurement Solutions

USA . 10,000 parts In-Stock

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UNI Independent Distributors

Spain . 4,833 parts In-Stock

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4,833

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Microchip USA

USA . 4,041 parts In-Stock

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4,041

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Technical Specifications

Other Function uPs,uCs & Peripheral ICs SE050D2HQ1/Z01PAZ attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from NXP Semiconductors

Specs

JESD-30 Code:

S-PQCC-N20

JESD-609 Code:

e4

Length:

3 mm

Moisture Sensitivity Level (MSL):

1

No. of Terminals:

20

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC20,.12SQ,16

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.33 mm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.62 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD SILVER

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3 mm

Peripheral IC Type:

Trade Compliance

SE050D2HQ1/Z01PAZ Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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