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ATECC608B-TNGTLSS-G

Microchip Technology

ATECC608B-TNGTLSS-G by Microchip Technology

ATECC608B-TNGTLSS-G by Microchip: 5.5V max supply, 1MHz clock freq, cryptographic authenticator for industrial use. Small outline package with 8 terminals, operates from -40 to 85°C. Ideal for secure applications needing high-level authentication and encryption.

Median Price

$0.830

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip Technology

USA . 33,626 parts In-Stock

1+ parts

$0.830

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33,626

$0.830

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Distributors (In-Stock)

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Nova Conductors

Japan . 70 parts In-Stock

1+ parts

$0.830

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70

$0.830

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Vyrian

USA . 113,940 parts In-Stock

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113,940

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VNN

France . 450 parts In-Stock

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450

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 113,694 parts In-Stock

1+ parts

$0.710

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113,694

$0.710

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Continental Prestige Electronics

USA . 3,919 parts In-Stock

1+ parts

$0.830

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$0.813

3,919

$0.830

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$0.813

Argo Parts USA

USA . 2,263 parts In-Stock

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$0.830

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2,263

$0.830

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AZTECH Wire

Italy . 726 parts In-Stock

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$13.560

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726

$13.560

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Semicontronic

India . 1,495 parts In-Stock

1+ parts

$33.000

100+ parts

$32.175

1k+ parts

$32.010

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1,495

$33.000

$32.175

$32.010

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Corohmni

South Africa . 5,234 parts In-Stock

1+ parts

$37.872

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5,234

$37.872

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Vigor

Singapore . 5,500 parts In-Stock

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5,500

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RGB Technical Solutions

Ukraine . 2,935 parts In-Stock

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2,935

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Futuretech Components

Singapore . 1,980 parts In-Stock

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1,980

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Microchip USA

USA . 1,834 parts In-Stock

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1,834

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Authorized Procurement Solutions

USA . 1,000 parts In-Stock

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1,000

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Overview

Unlock a world of secure possibilities with the ATECC608B-TNGTLSS-G by Microchip Technology. As a leading manufacturer in the industry, Microchip Technology delivers unparalleled quality and reliability in their products. The ATECC608B-TNGTLSS-G falls into the category of Other Function uPs,uCs & Peripheral ICs, offering advanced cryptographic authentication technology for a wide range of applications. With a small outline package style and dual terminal position, this product provides a compact and efficient solution for ensuring data security. Trust Microchip Technology to deliver cutting-edge technology that guarantees the protection and integrity of your valuable information.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and resistance to environmental factors, making the product suitable for various applications.

Surface Mount: YES

Surface mount packaging allows for easy and efficient integration onto printed circuit boards, saving space and simplifying assembly processes.

Maximum Supply Voltage: 5.5 V

The high maximum supply voltage capability provides flexibility and compatibility with a wide range of power sources.

Package Shape: RECTANGULAR

The rectangular package shape facilitates easy handling and placement on PCBs, ensuring a compact and organized layout.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space on the board, making it ideal for compact designs and applications with size constraints.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature tolerance ensures reliability and performance in harsh industrial environments.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

The use of nickel/palladium/gold terminal finish provides excellent conductivity, corrosion resistance, and longevity for reliable connections.

Maximum Clock Frequency: 1 MHz

The high maximum clock frequency allows for fast and efficient processing in real-time applications, enhancing overall system performance.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs ATECC608B-TNGTLSS-G attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Microchip Technology

Specs

Maximum Clock Frequency:

1 MHz

External Data Bus Width:

0

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

4.9 mm

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.23

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Maximum Seated Height:

1.75 mm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

3.9 mm

Peripheral IC Type:

Trade Compliance

ATECC608B-TNGTLSS-G Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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