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ATECC608B-TNGTLSU-C

Microchip Technology

ATECC608B-TNGTLSU-C by Microchip Technology

ATECC608B-TNGTLSU-C by Microchip operates at 2-5.5V, with a temp range of -40 to 85°C. It's a cryptographic authenticator IC in a small outline package suitable for industrial applications. Features include dual terminals, 1MHz clock frequency, and nickel/palladium/gold finish.

Median Price

$1.030

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip Technology

USA . 17,882 parts In-Stock

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$1.030

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17,882

$1.030

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Distributors (In-Stock)

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Nova Conductors

Japan . 100 parts In-Stock

1+ parts

$1.030

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100

$1.030

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Vyrian

USA . 61,627 parts In-Stock

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61,627

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VNN

France . 30 parts In-Stock

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30

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Distributors (Availability)

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Semicontronic

India . 61,325 parts In-Stock

1+ parts

$0.880

100+ parts

$0.858

1k+ parts

$0.854

10k+ parts

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61,325

$0.880

$0.858

$0.854

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Ampacity Inc.

Singapore . 61,286 parts In-Stock

1+ parts

$0.880

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61,286

$0.880

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Continental Prestige Electronics

USA . 2,720 parts In-Stock

1+ parts

$1.030

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$1.009

2,720

$1.030

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-

$1.009

Argo Parts USA

USA . 725 parts In-Stock

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$1.030

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725

$1.030

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AZTECH Wire

Italy . 118 parts In-Stock

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$8.930

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118

$8.930

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Corohmni

South Africa . 180 parts In-Stock

1+ parts

$17.626

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180

$17.626

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Aztec Data Supply Inc.

USA . 216 parts In-Stock

1+ parts

$65.640

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216

$65.640

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Microchip USA

USA . 2,085 parts In-Stock

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2,085

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Vigor

Singapore . 2,075 parts In-Stock

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2,075

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Marpe Global Electronics

Taiwan . 1,062 parts In-Stock

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QualityLine Systems

Poland . 1,062 parts In-Stock

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1,062

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XL Components Corporation

Australia . 1,062 parts In-Stock

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1,062

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Authorized Procurement Solutions

USA . 1,000 parts In-Stock

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1,000

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Overview

Unlock the power of security and authentication with the ATECC608B-TNGTLSU-C by Microchip Technology. This compact cryptographic authenticator offers unparalleled quality and reliability, backed by the trusted reputation of its manufacturer. Ideal for a wide range of applications in the realm of Other Function uPs,uCs & Peripheral ICs, this product provides customers with peace of mind and confidence in their data protection. Experience the value and benefits of enhanced security with the ATECC608B-TNGTLSU-C - a must-have for any industrial setting.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic or epoxy body material provides durability and protection for the internal components of the IC, ensuring reliable performance in various environments.

Surface Mount: YES

Surface mount technology allows for easy and efficient integration onto circuit boards, saving space and providing a clean and organized layout.

Maximum Supply Voltage: 5.5 V

With a high maximum supply voltage, this IC can handle a wide range of power inputs, making it versatile and suitable for different applications.

Package Shape: RECTANGULAR

The rectangular package shape is commonly used and easily stackable, allowing for efficient use of space on a circuit board.

No. of Terminals: 8

Having 8 terminals provides enough connectivity options for various inputs and outputs, enhancing the versatility and functionality of the IC.

Minimum Supply Voltage: 2 V

The low minimum supply voltage allows the IC to operate efficiently even with lower power inputs, making it energy-efficient and cost-effective.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this IC can withstand elevated temperatures without compromising performance, suitable for industrial applications.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature ensures the IC can function in cold environments, making it reliable and suitable for a wide range of applications.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

The use of nickel, palladium, and gold as terminal finish provides excellent conductivity and corrosion resistance, ensuring long-term reliability and performance.

Terminal Position: DUAL

Dual terminal positions offer flexibility in connectivity and installation options, enhancing the usability and compatibility of the IC.

Maximum Seated Height: 0.6 mm

With a low maximum seated height, this IC is compact and space-saving, making it ideal for applications where size constraints are a concern.

Width: 2 mm

The narrow width of the IC allows for efficient use of space on a circuit board, making it suitable for compact designs and layouts.

Maximum Clock Frequency: 1 MHz

The maximum clock frequency of 1 MHz enables fast processing and data transfer speeds, suitable for applications requiring quick and efficient operation.

Length: 3 mm

The small length of the IC contributes to its compact and space-saving design, making it suitable for applications with size constraints.

Temperature Grade: INDUSTRIAL

Designed for industrial applications, this IC can withstand harsh environmental conditions and operate reliably in demanding settings.

Peripheral IC Type: CRYPTOGRAPHIC AUTHENTICATOR

As a cryptographic authenticator, this IC provides secure authentication and encryption capabilities, making it suitable for applications requiring data security.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making this IC energy-efficient and reliable for various applications.

Terminal Form: NO LEAD

The no-lead terminal form simplifies installation and enhances reliability, providing a durable connection and reducing the risk of solder joint failures.

Terminal Pitch: 0.5 mm

With a small terminal pitch, this IC is suitable for high-density circuit board designs, allowing for efficient routing and space-saving layouts.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs ATECC608B-TNGTLSU-C attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Microchip Technology

Specs

Maximum Clock Frequency:

1 MHz

External Data Bus Width:

0

JESD-30 Code:

R-PDSO-N8

JESD-609 Code:

e4

Length:

3 mm

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOLCC8,.12,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Maximum Seated Height:

.6 mm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Width:

2 mm

Peripheral IC Type:

Trade Compliance

ATECC608B-TNGTLSU-C Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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