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ATECC608B-TNGTLSU-B

Microchip Technology

ATECC608B-TNGTLSU-B by Microchip Technology

ATECC608B-TNGTLSU-B by Microchip Technology is a cryptographic authenticator IC with a max supply voltage of 5.5V and operating temperature range of -40 to 85°C. It features a small outline package style, surface mount capability, and terminal finish in Ni/Pd/Au for secure applications requiring high reliability.

Median Price

$1.290

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip Technology

USA . 1,453 parts In-Stock

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$1.290

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Distributors (In-Stock)

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Nova Conductors

Japan . 500 parts In-Stock

1+ parts

$1.290

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500

$1.290

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Vyrian

USA . 53,717 parts In-Stock

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53,717

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VNN

France . 2,577 parts In-Stock

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Sensible Micro Corp

USA . 278 parts In-Stock

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278

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Distributors (Availability)

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Ampacity Inc.

Singapore . 37,024 parts In-Stock

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$1.100

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$1.100

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Argo Parts USA

USA . 2,235 parts In-Stock

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$1.290

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Continental Prestige Electronics

USA . 1,902 parts In-Stock

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$1.290

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$1.264

1,902

$1.290

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$1.264

Netroflash

USA . 500 parts In-Stock

1+ parts

$1.290

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$1.225

10k+ parts

$1.200

500

$1.290

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$1.225

$1.200

AZTECH Wire

Italy . 379 parts In-Stock

1+ parts

$9.490

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379

$9.490

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Aztec Data Supply Inc.

USA . 94 parts In-Stock

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$41.650

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94

$41.650

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Corohmni

South Africa . 4,926 parts In-Stock

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$45.321

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$45.321

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Marpe Global Electronics

Taiwan . 6,776 parts In-Stock

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XL Components Corporation

Australia . 6,374 parts In-Stock

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QualityLine Systems

Poland . 5,209 parts In-Stock

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Microchip USA

USA . 1,941 parts In-Stock

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Vigor

Singapore . 1,267 parts In-Stock

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Authorized Procurement Solutions

USA . 1,000 parts In-Stock

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1,000

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Overview

Enhance the security of your devices with the ATECC608B-TNGTLSU-B by Microchip Technology. With its advanced cryptographic authentication capabilities and industrial-grade technology, this peripheral IC is a game-changer in securing sensitive data. From protecting IoT devices to safeguarding financial transactions, this small outline, heat sink profile IC offers unmatched reliability and peace of mind. Trust Microchip's reputation for quality and innovation, and elevate the security of your products with the ATECC608B-TNGTLSU-B.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the components inside the package.

Surface Mount: YES

Allows for easy and secure mounting on PCBs, saving space and simplifying assembly.

Maximum Supply Voltage: 5.5 V

Can handle higher voltage inputs, providing flexibility in power supply options.

Package Shape: RECTANGULAR

Compact design for efficient use of space on PCBs.

Minimum Supply Voltage: 2 V

Can operate at low voltages, suitable for battery-powered applications.

Maximum Operating Temperature: 85 °C

Suitable for industrial environments with higher temperature requirements.

Minimum Operating Temperature: -40 °C

Can operate in extremely cold conditions, increasing its versatility.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

Provides corrosion resistance and ensures reliable connections over time.

Width: 2 mm

Compact size for space-constrained applications.

Maximum Clock Frequency: 1 MHz

Supports faster data processing and communication speeds.

Technology: CMOS

Low power consumption and high noise immunity for efficient operation.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs ATECC608B-TNGTLSU-B attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Microchip Technology

Specs

Maximum Clock Frequency:

1 MHz

External Data Bus Width:

0

JESD-30 Code:

R-PDSO-N8

JESD-609 Code:

e4

Length:

3 mm

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOLCC8,.12,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Maximum Seated Height:

.6 mm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Width:

2 mm

Peripheral IC Type:

Trade Compliance

ATECC608B-TNGTLSU-B Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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