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STWBC-WATR

STMicroelectronics

STWBC-WATR by STMicroelectronics

STWBC-WATR by STMicroelectronics is a compact microprocessor circuit designed for industrial applications, operating b/w -40 °C and 105 °C. It features a max supply voltage of 5.5V, 32 terminals in a very thin profile package. Ideal for space-constrained environments, it ensures reliable performance with low power consumption.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip Stock

USA . 7,080 parts In-Stock

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7,080

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Digiode

USA . 3,723 parts In-Stock

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3,723

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Vyrian

USA . 2,395 parts In-Stock

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2,395

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Anansix

USA . 606 parts In-Stock

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606

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Distributors (Availability)

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AZTECH Wire

Italy . 1,075 parts In-Stock

1+ parts

$14.160

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-

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1,075

$14.160

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Microchip USA

USA . 327 parts In-Stock

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$24.374

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327

$24.374

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IDEA Electronic Components Group

UK . 969 parts In-Stock

1+ parts

$29.751

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$26.776

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969

$29.751

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$26.776

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MKK Technologies

India . 1,053 parts In-Stock

1+ parts

$55.945

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1,053

$55.945

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DigiPath Technology Company

USA . 1,053 parts In-Stock

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$55.945

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1,053

$55.945

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Corohmni

South Africa . 245 parts In-Stock

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$61.619

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245

$61.619

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Kepictronics

USA . 10,000 parts In-Stock

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10,000

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Authorized Procurement Solutions

USA . 7,000 parts In-Stock

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7,000

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Corphita

USA . 2,754 parts In-Stock

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2,754

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Parana Technologies

USA . 1,704 parts In-Stock

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$35.572

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1,704

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$35.572

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Overview

Unlock new possibilities with the STWBC-WATR from STMicroelectronics—your go-to solution for efficient power management and advanced microprocessor applications. Designed to thrive in demanding environments, this compact, high-performance chip boasts exceptional reliability and durability, ensuring optimal functionality across various industrial uses. Experience reduced design complexity and enhanced efficiency, empowering your innovations with quality you can trust. Elevate your projects today!

Feature Benefit Bullets

Surface Mount: YES

The surface mount capability allows for efficient use of PCB space and facilitates automatic assembly, making it ideal for modern electronic applications.

Maximum Supply Voltage: 5.5 V

With a maximum supply voltage of 5.5 V, the product is compatible with a wide range of power supplies and circuitry, providing versatility in design.

Package Shape: SQUARE

The square package shape optimizes layout and routing on PCBs, allowing for better thermal performance and device density.

No. of Terminals: 32

Having 32 terminals enables complex interfacing and functionality, making this microprocessor suitable for demanding applications.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The thin profile is advantageous for space-constrained designs, while the heat sink/slug feature enhances thermal management.

Minimum Supply Voltage: 3 V

A minimum supply voltage of 3 V allows the chip to function efficiently in low-power applications, which is crucial for battery-operated devices.

Maximum Operating Temperature: 105 °C

The ability to operate at temperatures up to 105 °C makes this product suitable for demanding industrial environments.

Minimum Operating Temperature: -40 °C

With a low operating temperature limit of -40 °C, this microprocessor is ideal for harsh conditions and extreme environments.

Terminal Position: QUAD

Quad terminal positioning allows for more efficient signal integrity and improved pin accessibility in the design.

Maximum Seated Height: 1 mm

The low maximum seated height ensures minimal impact on the overall device profile, beneficial in compact designs.

Width: 5 mm

The compact width enhances flexibility in layout, allowing for dense placements on PCBs.

Length: 5 mm

The consistent dimensions provide uniformity in design, making integration into existing systems simpler.

Temperature Grade: INDUSTRIAL

Rated for industrial temperature conditions, this product guarantees reliable performance in challenging applications.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

Being a microprocessor circuit means it can perform complex computations, making it suitable for a wide variety of applications.

Technology: CMOS

CMOS technology ensures low power consumption and high noise immunity, critical for modern electronics.

Terminal Form: NO LEAD

Leadless terminals facilitate better electrical performance and are more environmentally friendly, aligning with current industry standards.

Nominal Supply Voltage: 3.3 V

Operating at a nominal supply voltage of 3.3 V is key for compatibility with many digital logic devices, enhancing interface potential.

Terminal Pitch: 0.5 mm

A 0.5 mm terminal pitch allows for tighter pin arrangements, making it suitable for high-density applications.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs STWBC-WATR attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from STMicroelectronics

Specs

JESD-30 Code:

S-XQCC-N32

Length:

5 mm

No. of Terminals:

32

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

NOT SPECIFIED

Maximum Seated Height:

1 mm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

5 mm

Peripheral IC Type:

Trade Compliance

STWBC-WATR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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